My Quote Request
5962-01-099-4143
20 Products
19-128F00M00R00
MICROCIRCUIT
NSN, MFG P/N
5962010994143
NSN
5962-01-099-4143
MFG
CONCURRENT COMPUTER CORPORATION
Description
MICROCIRCUIT
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MICROCIRCUIT,MEMORY
NSN, MFG P/N
5962010993809
NSN
5962-01-099-3809
MFG
ADVANCED MICRO DEVICES INC DBA A M D
Description
(NON-CORE DATA) BIT QUANTITY: 1024
(NON-CORE DATA) WORD QUANTITY: 256
BODY HEIGHT: 0.185 INCHES MAXIMUM
BODY LENGTH: 0.765 INCHES NOMINAL
BODY WIDTH: 0.295 INCHES NOMINAL
FEATURES PROVIDED: PROGRAMMABLE AND PROGRAMMED AND W/DISABLE AND BIPOLAR AND W/OPEN COLLECTOR AND HIGH SPEED AND SCHOTTKY AND W/ENABLE
INCLOSURE CONFIGURATION: DUAL-IN-LINE
INCLOSURE MATERIAL: PLASTIC
INPUT CIRCUIT PATTERN: 10 INPUT
MEMORY DEVICE TYPE: ROM
OPERATING TEMP RANGE: -0.0 TO 75.0 DEG CELSIUS
OUTPUT LOGIC FORM: TRANSISTOR-TRANSISTOR LOGIC
STORAGE TEMP RANGE: -65.0 TO 150.0 DEG CELSIUS
TERMINAL SURFACE TREATMENT: SOLDER
TERMINAL TYPE AND QUANTITY: 16 PRINTED CIRCUIT
TIME RATING PER CHACTERISTIC: 45.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 45.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT
VOLTAGE RATING AND TYPE PER CHARACTERISTIC: 5.5 VOLTS MAXIMUM POWER SOURCE
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MICROCIRCUIT,MEMORY
NSN, MFG P/N
5962010993809
NSN
5962-01-099-3809
MFG
NATIONAL SEMICONDUCTOR CORPORATION
Description
(NON-CORE DATA) BIT QUANTITY: 1024
(NON-CORE DATA) WORD QUANTITY: 256
BODY HEIGHT: 0.185 INCHES MAXIMUM
BODY LENGTH: 0.765 INCHES NOMINAL
BODY WIDTH: 0.295 INCHES NOMINAL
FEATURES PROVIDED: PROGRAMMABLE AND PROGRAMMED AND W/DISABLE AND BIPOLAR AND W/OPEN COLLECTOR AND HIGH SPEED AND SCHOTTKY AND W/ENABLE
INCLOSURE CONFIGURATION: DUAL-IN-LINE
INCLOSURE MATERIAL: PLASTIC
INPUT CIRCUIT PATTERN: 10 INPUT
MEMORY DEVICE TYPE: ROM
OPERATING TEMP RANGE: -0.0 TO 75.0 DEG CELSIUS
OUTPUT LOGIC FORM: TRANSISTOR-TRANSISTOR LOGIC
STORAGE TEMP RANGE: -65.0 TO 150.0 DEG CELSIUS
TERMINAL SURFACE TREATMENT: SOLDER
TERMINAL TYPE AND QUANTITY: 16 PRINTED CIRCUIT
TIME RATING PER CHACTERISTIC: 45.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 45.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT
VOLTAGE RATING AND TYPE PER CHARACTERISTIC: 5.5 VOLTS MAXIMUM POWER SOURCE
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MICROCIRCUIT,MEMORY
NSN, MFG P/N
5962010993809
NSN
5962-01-099-3809
MFG
PHILIPS SEMICONDUCTORS INC
Description
(NON-CORE DATA) BIT QUANTITY: 1024
(NON-CORE DATA) WORD QUANTITY: 256
BODY HEIGHT: 0.185 INCHES MAXIMUM
BODY LENGTH: 0.765 INCHES NOMINAL
BODY WIDTH: 0.295 INCHES NOMINAL
FEATURES PROVIDED: PROGRAMMABLE AND PROGRAMMED AND W/DISABLE AND BIPOLAR AND W/OPEN COLLECTOR AND HIGH SPEED AND SCHOTTKY AND W/ENABLE
INCLOSURE CONFIGURATION: DUAL-IN-LINE
INCLOSURE MATERIAL: PLASTIC
INPUT CIRCUIT PATTERN: 10 INPUT
MEMORY DEVICE TYPE: ROM
OPERATING TEMP RANGE: -0.0 TO 75.0 DEG CELSIUS
OUTPUT LOGIC FORM: TRANSISTOR-TRANSISTOR LOGIC
STORAGE TEMP RANGE: -65.0 TO 150.0 DEG CELSIUS
TERMINAL SURFACE TREATMENT: SOLDER
TERMINAL TYPE AND QUANTITY: 16 PRINTED CIRCUIT
TIME RATING PER CHACTERISTIC: 45.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 45.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT
VOLTAGE RATING AND TYPE PER CHARACTERISTIC: 5.5 VOLTS MAXIMUM POWER SOURCE
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MICROCIRCUIT,LINEAR
NSN, MFG P/N
5962010994043
NSN
5962-01-099-4043
MFG
TRW ELECTRONICS AND DEFENSE SECTOR RF DEVICES
Description
BODY HEIGHT: 0.352 INCHES NOMINAL
BODY LENGTH: 1.060 INCHES NOMINAL
DESIGN FUNCTION AND QUANTITY: 1 AMPLIFIER, HYBRID
FEATURES PROVIDED: HIGH POWER AND HYBRID
INCLOSURE CONFIGURATION: FLAT PACK
INPUT CIRCUIT PATTERN: 3 INPUT
MAXIMUM POWER DISSIPATION RATING: 800.0 MILLIWATTS
OPERATING TEMP RANGE: -40.0 TO 100.0 DEG CELSIUS
STORAGE TEMP RANGE: -55.0 TO 125.0 DEG CELSIUS
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19-05375-00
MICROCIRCUIT
NSN, MFG P/N
5962010994106
NSN
5962-01-099-4106
MFG
COMPAQ FEDERAL LLC
Description
MICROCIRCUIT
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19-09675-00
MICROCIRCUIT
NSN, MFG P/N
5962010994107
NSN
5962-01-099-4107
MFG
COMPAQ FEDERAL LLC
Description
MICROCIRCUIT
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19-10236-00
MICROCIRCUIT
NSN, MFG P/N
5962010994108
NSN
5962-01-099-4108
MFG
COMPAQ FEDERAL LLC
Description
MICROCIRCUIT
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5017380-014
MICROCIRCUIT
NSN, MFG P/N
5962010994108
NSN
5962-01-099-4108
MFG
THALES TRAINING & SIMULATION LTD
Description
MICROCIRCUIT
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19-10282-00
MICROCIRCUIT
NSN, MFG P/N
5962010994109
NSN
5962-01-099-4109
MFG
COMPAQ FEDERAL LLC
Description
MICROCIRCUIT
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MICROCIRCUIT
NSN, MFG P/N
5962010994109
NSN
5962-01-099-4109
MFG
COMPAQ FEDERAL LLC
Description
MICROCIRCUIT
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19-10378-00
MICROCIRCUIT
NSN, MFG P/N
5962010994110
NSN
5962-01-099-4110
MFG
COMPAQ FEDERAL LLC
Description
MICROCIRCUIT
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19-11038-00
MICROCIRCUIT
NSN, MFG P/N
5962010994111
NSN
5962-01-099-4111
MFG
COMPAQ FEDERAL LLC
Description
MICROCIRCUIT
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19-11039-00
MICROCIRCUIT
NSN, MFG P/N
5962010994112
NSN
5962-01-099-4112
MFG
COMPAQ FEDERAL LLC
Description
MICROCIRCUIT
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19-083F00M00R00
MICROCIRCUIT
NSN, MFG P/N
5962010994141
NSN
5962-01-099-4141
MFG
CONCURRENT COMPUTER CORPORATION
Description
MICROCIRCUIT
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82S62N
MICROCIRCUIT
NSN, MFG P/N
5962010994141
NSN
5962-01-099-4141
MFG
PHILIPS SEMICONDUCTORS INC
Description
MICROCIRCUIT
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19-124F00M00R00
MICROCIRCUIT
NSN, MFG P/N
5962010994142
NSN
5962-01-099-4142
MFG
CONCURRENT COMPUTER CORPORATION
Description
MICROCIRCUIT
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MICROCIRCUIT
NSN, MFG P/N
5962010994142
NSN
5962-01-099-4142
MFG
TEXAS INSTRUMENTS INCORPORATED DBA TEXAS INSTRUMENTS DIV SEMICONDUCTOR GROUP
Description
MICROCIRCUIT
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AP106374-37
MICROCIRCUIT
NSN, MFG P/N
5962010994142
NSN
5962-01-099-4142
MFG
GIORDANO ASSOCIATES INC
Description
MICROCIRCUIT
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MICROCIRCUIT
NSN, MFG P/N
5962010994143
NSN
5962-01-099-4143
MFG
TEXAS INSTRUMENTS INCORPORATED DBA TEXAS INSTRUMENTS DIV SEMICONDUCTOR GROUP
Description
MICROCIRCUIT