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5961-00-180-1330
20 Products
3042556-020-19
SEMICONDUCTOR DEVICE ASSEMBLY
NSN, MFG P/N
5961001801330
NSN
5961-00-180-1330
3042556-020-19
SEMICONDUCTOR DEVICE ASSEMBLY
NSN, MFG P/N
5961001801330
NSN
5961-00-180-1330
MFG
LOCKHEED MARTIN CORPORATION DIV LOCKHEED MARTIN INFORMATION SYSTEMS & GLOBAL SOLUTIONS
Description
DESIGN CONTROL REFERENCE: 3042556-020-19
MAJOR COMPONENTS: DIODE 36; PRINTED WIRING BD 1
MANUFACTURERS CODE: 99696
THE MANUFACTURERS DATA:
Related Searches:
3042556-020-21
SEMICONDUCTOR DEVICE ASSEMBLY
NSN, MFG P/N
5961001801332
NSN
5961-00-180-1332
3042556-020-21
SEMICONDUCTOR DEVICE ASSEMBLY
NSN, MFG P/N
5961001801332
NSN
5961-00-180-1332
MFG
LOCKHEED MARTIN CORPORATION DIV LOCKHEED MARTIN INFORMATION SYSTEMS & GLOBAL SOLUTIONS
Description
DESIGN CONTROL REFERENCE: 3042556-020-21
MAJOR COMPONENTS: DIODE 25; PRINTED WIRING BD 1
MANUFACTURERS CODE: 99696
THE MANUFACTURERS DATA:
Related Searches:
3042556-020-33
SEMICONDUCTOR DEVICE ASSEMBLY
NSN, MFG P/N
5961001801333
NSN
5961-00-180-1333
3042556-020-33
SEMICONDUCTOR DEVICE ASSEMBLY
NSN, MFG P/N
5961001801333
NSN
5961-00-180-1333
MFG
LOCKHEED MARTIN CORPORATION DIV LOCKHEED MARTIN INFORMATION SYSTEMS & GLOBAL SOLUTIONS
Description
DESIGN CONTROL REFERENCE: 3042556-020-33
MAJOR COMPONENTS: DIODE 21; PRINTED WIRING BD 1
MANUFACTURERS CODE: 99696
THE MANUFACTURERS DATA:
Related Searches:
3042556-020-31
SEMICONDUCTOR DEVICE ASSEMBLY
NSN, MFG P/N
5961001801335
NSN
5961-00-180-1335
3042556-020-31
SEMICONDUCTOR DEVICE ASSEMBLY
NSN, MFG P/N
5961001801335
NSN
5961-00-180-1335
MFG
LOCKHEED MARTIN CORPORATION DIV LOCKHEED MARTIN INFORMATION SYSTEMS & GLOBAL SOLUTIONS
Description
DESIGN CONTROL REFERENCE: 3042556-020-31
MAJOR COMPONENTS: DIODE 19; PRINTED WIRING BD 1
MANUFACTURERS CODE: 99696
THE MANUFACTURERS DATA:
Related Searches:
3042556-020-35
SEMICONDUCTOR DEVICE ASSEMBLY
NSN, MFG P/N
5961001801341
NSN
5961-00-180-1341
3042556-020-35
SEMICONDUCTOR DEVICE ASSEMBLY
NSN, MFG P/N
5961001801341
NSN
5961-00-180-1341
MFG
LOCKHEED MARTIN CORPORATION DIV LOCKHEED MARTIN INFORMATION SYSTEMS & GLOBAL SOLUTIONS
Description
DESIGN CONTROL REFERENCE: 3042556-020-35
MAJOR COMPONENTS: DIODE 22; PRINTED WIRING BD 1
MANUFACTURERS CODE: 99696
THE MANUFACTURERS DATA:
Related Searches:
3042556-020-37
SEMICONDUCTOR DEVICE ASSEMBLY
NSN, MFG P/N
5961001801346
NSN
5961-00-180-1346
3042556-020-37
SEMICONDUCTOR DEVICE ASSEMBLY
NSN, MFG P/N
5961001801346
NSN
5961-00-180-1346
MFG
LOCKHEED MARTIN CORPORATION DIV LOCKHEED MARTIN INFORMATION SYSTEMS & GLOBAL SOLUTIONS
Description
DESIGN CONTROL REFERENCE: 3042556-020-37
MAJOR COMPONENTS: DIODE 21; PRINTED WIRING BD 1
MANUFACTURERS CODE: 99696
THE MANUFACTURERS DATA:
Related Searches:
3042556-020-39
SEMICONDUCTOR DEVICE ASSEMBLY
NSN, MFG P/N
5961001801347
NSN
5961-00-180-1347
3042556-020-39
SEMICONDUCTOR DEVICE ASSEMBLY
NSN, MFG P/N
5961001801347
NSN
5961-00-180-1347
MFG
LOCKHEED MARTIN CORPORATION DIV LOCKHEED MARTIN INFORMATION SYSTEMS & GLOBAL SOLUTIONS
Description
DESIGN CONTROL REFERENCE: 3042556-020-39
MAJOR COMPONENTS: DIODE 30; PRINTED WIRING BD 1
MANUFACTURERS CODE: 99696
THE MANUFACTURERS DATA:
Related Searches:
3042556-020-41
SEMICONDUCTOR DEVICE ASSEMBLY
NSN, MFG P/N
5961001801353
NSN
5961-00-180-1353
3042556-020-41
SEMICONDUCTOR DEVICE ASSEMBLY
NSN, MFG P/N
5961001801353
NSN
5961-00-180-1353
MFG
LOCKHEED MARTIN CORPORATION DIV LOCKHEED MARTIN INFORMATION SYSTEMS & GLOBAL SOLUTIONS
Description
DESIGN CONTROL REFERENCE: 3042556-020-41
MAJOR COMPONENTS: DIODE 15; PRINTED WIRING BD 1
MANUFACTURERS CODE: 99696
THE MANUFACTURERS DATA:
Related Searches:
3042556-020-49
SEMICONDUCTOR DEVICE ASSEMBLY
NSN, MFG P/N
5961001801395
NSN
5961-00-180-1395
3042556-020-49
SEMICONDUCTOR DEVICE ASSEMBLY
NSN, MFG P/N
5961001801395
NSN
5961-00-180-1395
MFG
LOCKHEED MARTIN CORPORATION DIV LOCKHEED MARTIN INFORMATION SYSTEMS & GLOBAL SOLUTIONS
Description
DESIGN CONTROL REFERENCE: 3042556-020-49
MAJOR COMPONENTS: DIODE 36; PRINTED WIRING BD 1
MANUFACTURERS CODE: 99696
THE MANUFACTURERS DATA:
Related Searches:
3042556-020-51
SEMICONDUCTOR DEVICE ASSEMBLY
NSN, MFG P/N
5961001801707
NSN
5961-00-180-1707
3042556-020-51
SEMICONDUCTOR DEVICE ASSEMBLY
NSN, MFG P/N
5961001801707
NSN
5961-00-180-1707
MFG
LOCKHEED MARTIN CORPORATION DIV LOCKHEED MARTIN INFORMATION SYSTEMS & GLOBAL SOLUTIONS
Description
DESIGN CONTROL REFERENCE: 3042556-020-51
MAJOR COMPONENTS: DIODE 25; PRINTED WIRING BD 1
MANUFACTURERS CODE: 99696
THE MANUFACTURERS DATA:
Related Searches:
3042556-020-53
SEMICONDUCTOR DEVICE ASSEMBLY
NSN, MFG P/N
5961001801851
NSN
5961-00-180-1851
3042556-020-53
SEMICONDUCTOR DEVICE ASSEMBLY
NSN, MFG P/N
5961001801851
NSN
5961-00-180-1851
MFG
LOCKHEED MARTIN CORPORATION DIV LOCKHEED MARTIN INFORMATION SYSTEMS & GLOBAL SOLUTIONS
Description
DESIGN CONTROL REFERENCE: 3042556-020-53
MAJOR COMPONENTS: DIODE 21; PRINTED WIRING BD 1
MANUFACTURERS CODE: 99696
THE MANUFACTURERS DATA:
Related Searches:
3042556-020-55
SEMICONDUCTOR DEVICE ASSEMBLY
NSN, MFG P/N
5961001801950
NSN
5961-00-180-1950
3042556-020-55
SEMICONDUCTOR DEVICE ASSEMBLY
NSN, MFG P/N
5961001801950
NSN
5961-00-180-1950
MFG
LOCKHEED MARTIN CORPORATION DIV LOCKHEED MARTIN INFORMATION SYSTEMS & GLOBAL SOLUTIONS
Description
DESIGN CONTROL REFERENCE: 3042556-020-55
MAJOR COMPONENTS: DIODE 21; PRINTED WIRING BD 1
MANUFACTURERS CODE: 99696
THE MANUFACTURERS DATA:
Related Searches:
3042556-020-61
SEMICONDUCTOR DEVICE ASSEMBLY
NSN, MFG P/N
5961001802018
NSN
5961-00-180-2018
3042556-020-61
SEMICONDUCTOR DEVICE ASSEMBLY
NSN, MFG P/N
5961001802018
NSN
5961-00-180-2018
MFG
LOCKHEED MARTIN CORPORATION DIV LOCKHEED MARTIN INFORMATION SYSTEMS & GLOBAL SOLUTIONS
Description
DESIGN CONTROL REFERENCE: 3042556-020-61
MAJOR COMPONENTS: DIODE 19; PRINTED WIRING BD 1
MANUFACTURERS CODE: 99696
THE MANUFACTURERS DATA:
Related Searches:
353-6456-011
SEMICONDUCTOR DEVICE,DIODE
NSN, MFG P/N
5961001802642
NSN
5961-00-180-2642
353-6456-011
SEMICONDUCTOR DEVICE,DIODE
NSN, MFG P/N
5961001802642
NSN
5961-00-180-2642
MFG
ROCKWELL COLLINS INC. DBA GOVERNMENT SYSTEMS DIV GOVERNMENT SYSTEMS
Description
CURRENT RATING PER CHARACTERISTIC: 50.00 MILLIAMPERES MAXIMUM MAXIMUM REVERSE SURGE CURRENT
FEATURES PROVIDED: HERMETICALLY SEALED CASE
INCLOSURE MATERIAL: GLASS AND METAL
MAXIMUM OPERATING TEMP PER MEASUREMENT POINT: 175.0 DEG CELSIUS JUNCTION
MOUNTING METHOD: TERMINAL
OVERALL DIAMETER: 0.085 INCHES MAXIMUM
OVERALL LENGTH: 0.085 INCHES MAXIMUM
POWER RATING PER CHARACTERISTIC: 3.0 WATTS MAXIMUM TOTAL DEVICE DISSIPATION
SEMICONDUCTOR MATERIAL: SILICON
TERMINAL LENGTH: 0.700 INCHES MINIMUM
TERMINAL TYPE AND QUANTITY: 2 UNINSULATED WIRE LEAD
VOLTAGE RATING IN VOLTS PER CHARACTERISTIC: 15.0 MAXIMUM NOMINAL REGULATOR VOLTAGE
Related Searches:
RA-304
SEMICONDUCTOR DEVICE,DIODE
NSN, MFG P/N
5961001802841
NSN
5961-00-180-2841
MFG
VOLTAGE MULTIPLIERS INC. DBA V M I
Description
MOUNTING METHOD: TERMINAL
OVERALL HEIGHT: 1.500 INCHES MAXIMUM
OVERALL LENGTH: 1.500 INCHES MAXIMUM
OVERALL WIDTH: 1.500 INCHES MAXIMUM
SEMICONDUCTOR MATERIAL: SILICON
TERMINAL TYPE AND QUANTITY: 2 UNINSULATED WIRE LEAD
Related Searches:
SA3418
SEMICONDUCTOR DEVICE,DIODE
NSN, MFG P/N
5961001802841
NSN
5961-00-180-2841
MFG
SEMTECH CORPORATION
Description
MOUNTING METHOD: TERMINAL
OVERALL HEIGHT: 1.500 INCHES MAXIMUM
OVERALL LENGTH: 1.500 INCHES MAXIMUM
OVERALL WIDTH: 1.500 INCHES MAXIMUM
SEMICONDUCTOR MATERIAL: SILICON
TERMINAL TYPE AND QUANTITY: 2 UNINSULATED WIRE LEAD
Related Searches:
27A10495-101-11
SEMICONDUCTOR DEVICE,DIODE
NSN, MFG P/N
5961001802857
NSN
5961-00-180-2857
27A10495-101-11
SEMICONDUCTOR DEVICE,DIODE
NSN, MFG P/N
5961001802857
NSN
5961-00-180-2857
MFG
THE BOEING COMPANY DBA BOEING
Description
CURRENT RATING PER CHARACTERISTIC: 35.00 MILLIAMPERES MAXIMUM VOLTAGE REGULATOR DIODE CURRENT
FEATURES PROVIDED: HERMETICALLY SEALED CASE
INCLOSURE MATERIAL: GLASS
JOINT ELECTRONIC DEVICE ENGINEERING COUNCIL/JEDEC/CASE OUTLINE DESIGNATION: DO-7
MAXIMUM OPERATING TEMP PER MEASUREMENT POINT: 175.0 DEG CELSIUS JUNCTION
MOUNTING METHOD: TERMINAL
OVERALL DIAMETER: 0.107 INCHES MAXIMUM
OVERALL LENGTH: 0.300 INCHES MAXIMUM
POWER RATING PER CHARACTERISTIC: 250.0 MILLIWATTS MAXIMUM TOTAL POWER DISSIPATION
SEMICONDUCTOR MATERIAL: SILICON
TERMINAL LENGTH: 1.000 INCHES MINIMUM
TERMINAL TYPE AND QUANTITY: 2 UNINSULATED WIRE LEAD
VOLTAGE RATING IN VOLTS PER CHARACTERISTIC: 6.3 MAXIMUM BREAKDOWN VOLTAGE, DC
VOLTAGE TOLERANCE IN PERCENT: -5.0 TO 5.0
Related Searches:
69-7172
SEMICONDUCTOR DEVICE,DIODE
NSN, MFG P/N
5961001802857
NSN
5961-00-180-2857
MFG
INTERNATIONAL RECTIFIER CORPORATION
Description
CURRENT RATING PER CHARACTERISTIC: 35.00 MILLIAMPERES MAXIMUM VOLTAGE REGULATOR DIODE CURRENT
FEATURES PROVIDED: HERMETICALLY SEALED CASE
INCLOSURE MATERIAL: GLASS
JOINT ELECTRONIC DEVICE ENGINEERING COUNCIL/JEDEC/CASE OUTLINE DESIGNATION: DO-7
MAXIMUM OPERATING TEMP PER MEASUREMENT POINT: 175.0 DEG CELSIUS JUNCTION
MOUNTING METHOD: TERMINAL
OVERALL DIAMETER: 0.107 INCHES MAXIMUM
OVERALL LENGTH: 0.300 INCHES MAXIMUM
POWER RATING PER CHARACTERISTIC: 250.0 MILLIWATTS MAXIMUM TOTAL POWER DISSIPATION
SEMICONDUCTOR MATERIAL: SILICON
TERMINAL LENGTH: 1.000 INCHES MINIMUM
TERMINAL TYPE AND QUANTITY: 2 UNINSULATED WIRE LEAD
VOLTAGE RATING IN VOLTS PER CHARACTERISTIC: 6.3 MAXIMUM BREAKDOWN VOLTAGE, DC
VOLTAGE TOLERANCE IN PERCENT: -5.0 TO 5.0
Related Searches:
SZ51006
SEMICONDUCTOR DEVICE,DIODE
NSN, MFG P/N
5961001802857
NSN
5961-00-180-2857
MFG
FREESCALE SEMICONDUCTOR INC.
Description
CURRENT RATING PER CHARACTERISTIC: 35.00 MILLIAMPERES MAXIMUM VOLTAGE REGULATOR DIODE CURRENT
FEATURES PROVIDED: HERMETICALLY SEALED CASE
INCLOSURE MATERIAL: GLASS
JOINT ELECTRONIC DEVICE ENGINEERING COUNCIL/JEDEC/CASE OUTLINE DESIGNATION: DO-7
MAXIMUM OPERATING TEMP PER MEASUREMENT POINT: 175.0 DEG CELSIUS JUNCTION
MOUNTING METHOD: TERMINAL
OVERALL DIAMETER: 0.107 INCHES MAXIMUM
OVERALL LENGTH: 0.300 INCHES MAXIMUM
POWER RATING PER CHARACTERISTIC: 250.0 MILLIWATTS MAXIMUM TOTAL POWER DISSIPATION
SEMICONDUCTOR MATERIAL: SILICON
TERMINAL LENGTH: 1.000 INCHES MINIMUM
TERMINAL TYPE AND QUANTITY: 2 UNINSULATED WIRE LEAD
VOLTAGE RATING IN VOLTS PER CHARACTERISTIC: 6.3 MAXIMUM BREAKDOWN VOLTAGE, DC
VOLTAGE TOLERANCE IN PERCENT: -5.0 TO 5.0
Related Searches:
TD41033
SEMICONDUCTOR DEVICE,DIODE
NSN, MFG P/N
5961001802857
NSN
5961-00-180-2857
MFG
TELCOM SEMICONDUCTOR INC
Description
CURRENT RATING PER CHARACTERISTIC: 35.00 MILLIAMPERES MAXIMUM VOLTAGE REGULATOR DIODE CURRENT
FEATURES PROVIDED: HERMETICALLY SEALED CASE
INCLOSURE MATERIAL: GLASS
JOINT ELECTRONIC DEVICE ENGINEERING COUNCIL/JEDEC/CASE OUTLINE DESIGNATION: DO-7
MAXIMUM OPERATING TEMP PER MEASUREMENT POINT: 175.0 DEG CELSIUS JUNCTION
MOUNTING METHOD: TERMINAL
OVERALL DIAMETER: 0.107 INCHES MAXIMUM
OVERALL LENGTH: 0.300 INCHES MAXIMUM
POWER RATING PER CHARACTERISTIC: 250.0 MILLIWATTS MAXIMUM TOTAL POWER DISSIPATION
SEMICONDUCTOR MATERIAL: SILICON
TERMINAL LENGTH: 1.000 INCHES MINIMUM
TERMINAL TYPE AND QUANTITY: 2 UNINSULATED WIRE LEAD
VOLTAGE RATING IN VOLTS PER CHARACTERISTIC: 6.3 MAXIMUM BREAKDOWN VOLTAGE, DC
VOLTAGE TOLERANCE IN PERCENT: -5.0 TO 5.0
