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5962-01-225-1839

20 Products

332948-1

MICROCIRCUIT,MEMORY

NSN, MFG P/N

5962012251839

NSN

5962-01-225-1839

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332948-1

MICROCIRCUIT,MEMORY

NSN, MFG P/N

5962012251839

NSN

5962-01-225-1839

MFG

BAE SYSTEMS INFORMATION AND ELECTRONIC SYSTEMS INTEGRATION INC.

Description

DESIGN CONTROL REFERENCE: 332948-1
FEATURES PROVIDED: HERMETICALLY SEALED AND MONOLITHIC AND PROGRAMMABLE
INCLOSURE CONFIGURATION: DUAL-IN-LINE
INCLOSURE MATERIAL: CERAMIC
INPUT CIRCUIT PATTERN: 10 INPUT
MANUFACTURERS CODE: 80249
MEMORY DEVICE TYPE: ROM
OPERATING TEMP RANGE: -55.0 TO 125.0 DEG CELSIUS
OUTPUT LOGIC FORM: TRANSISTOR-TRANSISTOR LOGIC
TERMINAL SURFACE TREATMENT: SOLDER
TERMINAL TYPE AND QUANTITY: 16 PRINTED CIRCUIT
THE MANUFACTURERS DATA:

CD54HC08F3A

MICROCIRCUIT,DIGITAL

NSN, MFG P/N

5962012251558

NSN

5962-01-225-1558

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CD54HC08F3A

MICROCIRCUIT,DIGITAL

NSN, MFG P/N

5962012251558

NSN

5962-01-225-1558

MFG

INTERSIL CORPORATION

Description

BODY HEIGHT: 0.185 INCHES NOMINAL
BODY LENGTH: 0.785 INCHES MAXIMUM
BODY WIDTH: 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM
CASE OUTLINE SOURCE AND DESIGNATOR: D-1 MIL-M-38510
CURRENT RATING PER CHARACTERISTIC: 50.00 MILLIAMPERES NOMINAL OUTPUT
DEFINITIVE GOVERNMENT SPEC/STD REFERENCE: 8404701CA
DESIGN FUNCTION AND QUANTITY: 4 GATE, AND
FEATURES PROVIDED: MONOLITHIC AND ELECTROSTATIC SENSITIVE AND HIGH SPEED
INCLOSURE CONFIGURATION: DUAL-IN-LINE
INCLOSURE MATERIAL: CERAMIC
INPUT CIRCUIT PATTERN: QUAD 2 INPUT
MANUFACTURERS CODE: 67268
MAXIMUM POWER DISSIPATION RATING: 500.0 MILLIWATTS
NON-DEFINITIVE GOVERNMENT SPEC/STD REFERENCE: 84047
OPERATING TEMP RANGE: -55.0 TO 125.0 DEG CELSIUS
OUTPUT LOGIC FORM: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
SPEC/STD CONTROLLING DATA:
STORAGE TEMP RANGE: -65.0 TO 150.0 DEG CELSIUS
TERMINAL SURFACE TREATMENT: SOLDER
TERMINAL TYPE AND QUANTITY: 14 PRINTED CIRCUIT
TEST DATA DOCUMENT: 96906-MIL-STD-883 STANDARD_!

ES5754-01

MICROCIRCUIT,DIGITAL

NSN, MFG P/N

5962012251558

NSN

5962-01-225-1558

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ES5754-01

MICROCIRCUIT,DIGITAL

NSN, MFG P/N

5962012251558

NSN

5962-01-225-1558

MFG

DRS SUSTAINMENT SYSTEMS INC. DIV DRS SUSTAINMENT SYSTEMS INC. USE CAGE CODE 98255 FOR CATALOGING.

Description

BODY HEIGHT: 0.185 INCHES NOMINAL
BODY LENGTH: 0.785 INCHES MAXIMUM
BODY WIDTH: 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM
CASE OUTLINE SOURCE AND DESIGNATOR: D-1 MIL-M-38510
CURRENT RATING PER CHARACTERISTIC: 50.00 MILLIAMPERES NOMINAL OUTPUT
DEFINITIVE GOVERNMENT SPEC/STD REFERENCE: 8404701CA
DESIGN FUNCTION AND QUANTITY: 4 GATE, AND
FEATURES PROVIDED: MONOLITHIC AND ELECTROSTATIC SENSITIVE AND HIGH SPEED
INCLOSURE CONFIGURATION: DUAL-IN-LINE
INCLOSURE MATERIAL: CERAMIC
INPUT CIRCUIT PATTERN: QUAD 2 INPUT
MANUFACTURERS CODE: 67268
MAXIMUM POWER DISSIPATION RATING: 500.0 MILLIWATTS
NON-DEFINITIVE GOVERNMENT SPEC/STD REFERENCE: 84047
OPERATING TEMP RANGE: -55.0 TO 125.0 DEG CELSIUS
OUTPUT LOGIC FORM: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
SPEC/STD CONTROLLING DATA:
STORAGE TEMP RANGE: -65.0 TO 150.0 DEG CELSIUS
TERMINAL SURFACE TREATMENT: SOLDER
TERMINAL TYPE AND QUANTITY: 14 PRINTED CIRCUIT
TEST DATA DOCUMENT: 96906-MIL-STD-883 STANDARD_!

MM54HC08J-MIL

MICROCIRCUIT,DIGITAL

NSN, MFG P/N

5962012251558

NSN

5962-01-225-1558

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MM54HC08J-MIL

MICROCIRCUIT,DIGITAL

NSN, MFG P/N

5962012251558

NSN

5962-01-225-1558

MFG

NATIONAL SEMICONDUCTOR CORPORATION

Description

BODY HEIGHT: 0.185 INCHES NOMINAL
BODY LENGTH: 0.785 INCHES MAXIMUM
BODY WIDTH: 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM
CASE OUTLINE SOURCE AND DESIGNATOR: D-1 MIL-M-38510
CURRENT RATING PER CHARACTERISTIC: 50.00 MILLIAMPERES NOMINAL OUTPUT
DEFINITIVE GOVERNMENT SPEC/STD REFERENCE: 8404701CA
DESIGN FUNCTION AND QUANTITY: 4 GATE, AND
FEATURES PROVIDED: MONOLITHIC AND ELECTROSTATIC SENSITIVE AND HIGH SPEED
INCLOSURE CONFIGURATION: DUAL-IN-LINE
INCLOSURE MATERIAL: CERAMIC
INPUT CIRCUIT PATTERN: QUAD 2 INPUT
MANUFACTURERS CODE: 67268
MAXIMUM POWER DISSIPATION RATING: 500.0 MILLIWATTS
NON-DEFINITIVE GOVERNMENT SPEC/STD REFERENCE: 84047
OPERATING TEMP RANGE: -55.0 TO 125.0 DEG CELSIUS
OUTPUT LOGIC FORM: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
SPEC/STD CONTROLLING DATA:
STORAGE TEMP RANGE: -65.0 TO 150.0 DEG CELSIUS
TERMINAL SURFACE TREATMENT: SOLDER
TERMINAL TYPE AND QUANTITY: 14 PRINTED CIRCUIT
TEST DATA DOCUMENT: 96906-MIL-STD-883 STANDARD_!

MM54HC08J/883B

MICROCIRCUIT,DIGITAL

NSN, MFG P/N

5962012251558

NSN

5962-01-225-1558

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MM54HC08J/883B

MICROCIRCUIT,DIGITAL

NSN, MFG P/N

5962012251558

NSN

5962-01-225-1558

MFG

NATIONAL SEMICONDUCTOR CORPORATION

Description

BODY HEIGHT: 0.185 INCHES NOMINAL
BODY LENGTH: 0.785 INCHES MAXIMUM
BODY WIDTH: 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM
CASE OUTLINE SOURCE AND DESIGNATOR: D-1 MIL-M-38510
CURRENT RATING PER CHARACTERISTIC: 50.00 MILLIAMPERES NOMINAL OUTPUT
DEFINITIVE GOVERNMENT SPEC/STD REFERENCE: 8404701CA
DESIGN FUNCTION AND QUANTITY: 4 GATE, AND
FEATURES PROVIDED: MONOLITHIC AND ELECTROSTATIC SENSITIVE AND HIGH SPEED
INCLOSURE CONFIGURATION: DUAL-IN-LINE
INCLOSURE MATERIAL: CERAMIC
INPUT CIRCUIT PATTERN: QUAD 2 INPUT
MANUFACTURERS CODE: 67268
MAXIMUM POWER DISSIPATION RATING: 500.0 MILLIWATTS
NON-DEFINITIVE GOVERNMENT SPEC/STD REFERENCE: 84047
OPERATING TEMP RANGE: -55.0 TO 125.0 DEG CELSIUS
OUTPUT LOGIC FORM: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
SPEC/STD CONTROLLING DATA:
STORAGE TEMP RANGE: -65.0 TO 150.0 DEG CELSIUS
TERMINAL SURFACE TREATMENT: SOLDER
TERMINAL TYPE AND QUANTITY: 14 PRINTED CIRCUIT
TEST DATA DOCUMENT: 96906-MIL-STD-883 STANDARD_!

SNJ54HC08J

MICROCIRCUIT,DIGITAL

NSN, MFG P/N

5962012251558

NSN

5962-01-225-1558

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SNJ54HC08J

MICROCIRCUIT,DIGITAL

NSN, MFG P/N

5962012251558

NSN

5962-01-225-1558

MFG

TEXAS INSTRUMENTS INCORPORATED DBA TEXAS INSTRUMENTS DIV SEMICONDUCTOR GROUP

Description

BODY HEIGHT: 0.185 INCHES NOMINAL
BODY LENGTH: 0.785 INCHES MAXIMUM
BODY WIDTH: 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM
CASE OUTLINE SOURCE AND DESIGNATOR: D-1 MIL-M-38510
CURRENT RATING PER CHARACTERISTIC: 50.00 MILLIAMPERES NOMINAL OUTPUT
DEFINITIVE GOVERNMENT SPEC/STD REFERENCE: 8404701CA
DESIGN FUNCTION AND QUANTITY: 4 GATE, AND
FEATURES PROVIDED: MONOLITHIC AND ELECTROSTATIC SENSITIVE AND HIGH SPEED
INCLOSURE CONFIGURATION: DUAL-IN-LINE
INCLOSURE MATERIAL: CERAMIC
INPUT CIRCUIT PATTERN: QUAD 2 INPUT
MANUFACTURERS CODE: 67268
MAXIMUM POWER DISSIPATION RATING: 500.0 MILLIWATTS
NON-DEFINITIVE GOVERNMENT SPEC/STD REFERENCE: 84047
OPERATING TEMP RANGE: -55.0 TO 125.0 DEG CELSIUS
OUTPUT LOGIC FORM: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
SPEC/STD CONTROLLING DATA:
STORAGE TEMP RANGE: -65.0 TO 150.0 DEG CELSIUS
TERMINAL SURFACE TREATMENT: SOLDER
TERMINAL TYPE AND QUANTITY: 14 PRINTED CIRCUIT
TEST DATA DOCUMENT: 96906-MIL-STD-883 STANDARD_!

520-10893-11

MICROCIRCUIT,DIGITAL

NSN, MFG P/N

5962012251824

NSN

5962-01-225-1824

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520-10893-11

MICROCIRCUIT,DIGITAL

NSN, MFG P/N

5962012251824

NSN

5962-01-225-1824

MFG

THE BOEING COMPANY DBA BOEING

520-10893-15

MICROCIRCUIT,DIGITAL

NSN, MFG P/N

5962012251828

NSN

5962-01-225-1828

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520-10893-15

MICROCIRCUIT,DIGITAL

NSN, MFG P/N

5962012251828

NSN

5962-01-225-1828

MFG

THE BOEING COMPANY DBA BOEING

520-10893-3

MICROCIRCUIT,DIGITAL

NSN, MFG P/N

5962012251832

NSN

5962-01-225-1832

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520-10893-3

MICROCIRCUIT,DIGITAL

NSN, MFG P/N

5962012251832

NSN

5962-01-225-1832

MFG

THE BOEING COMPANY DBA BOEING

332952-1

MICROCIRCUIT,MEMORY

NSN, MFG P/N

5962012251833

NSN

5962-01-225-1833

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332952-1

MICROCIRCUIT,MEMORY

NSN, MFG P/N

5962012251833

NSN

5962-01-225-1833

MFG

BAE SYSTEMS INFORMATION AND ELECTRONIC SYSTEMS INTEGRATION INC.

Description

DESIGN CONTROL REFERENCE: 332952-1
FEATURES PROVIDED: HERMETICALLY SEALED AND MONOLITHIC AND PROGRAMMABLE
INCLOSURE CONFIGURATION: DUAL-IN-LINE
INCLOSURE MATERIAL: CERAMIC
INPUT CIRCUIT PATTERN: 10 INPUT
MANUFACTURERS CODE: 80249
MEMORY DEVICE TYPE: ROM
OPERATING TEMP RANGE: -55.0 TO 125.0 DEG CELSIUS
OUTPUT LOGIC FORM: TRANSISTOR-TRANSISTOR LOGIC
TERMINAL SURFACE TREATMENT: SOLDER
TERMINAL TYPE AND QUANTITY: 16 PRINTED CIRCUIT
THE MANUFACTURERS DATA:

M38510/20302BEX

MICROCIRCUIT,MEMORY

NSN, MFG P/N

5962012251833

NSN

5962-01-225-1833

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M38510/20302BEX

MICROCIRCUIT,MEMORY

NSN, MFG P/N

5962012251833

NSN

5962-01-225-1833

MFG

MILITARY SPECIFICATIONS PROMULGATED BY MILITARY DEPARTMENTS/AGENCIES UNDER AUTHORITY OF DEFENSE STANDARDIZATION MANUAL 4120 3-M

Description

DESIGN CONTROL REFERENCE: 332952-1
FEATURES PROVIDED: HERMETICALLY SEALED AND MONOLITHIC AND PROGRAMMABLE
INCLOSURE CONFIGURATION: DUAL-IN-LINE
INCLOSURE MATERIAL: CERAMIC
INPUT CIRCUIT PATTERN: 10 INPUT
MANUFACTURERS CODE: 80249
MEMORY DEVICE TYPE: ROM
OPERATING TEMP RANGE: -55.0 TO 125.0 DEG CELSIUS
OUTPUT LOGIC FORM: TRANSISTOR-TRANSISTOR LOGIC
TERMINAL SURFACE TREATMENT: SOLDER
TERMINAL TYPE AND QUANTITY: 16 PRINTED CIRCUIT
THE MANUFACTURERS DATA:

ROM/PROM

MICROCIRCUIT,MEMORY

NSN, MFG P/N

5962012251833

NSN

5962-01-225-1833

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ROM/PROM

MICROCIRCUIT,MEMORY

NSN, MFG P/N

5962012251833

NSN

5962-01-225-1833

MFG

DLA LAND AND MARITIME

Description

DESIGN CONTROL REFERENCE: 332952-1
FEATURES PROVIDED: HERMETICALLY SEALED AND MONOLITHIC AND PROGRAMMABLE
INCLOSURE CONFIGURATION: DUAL-IN-LINE
INCLOSURE MATERIAL: CERAMIC
INPUT CIRCUIT PATTERN: 10 INPUT
MANUFACTURERS CODE: 80249
MEMORY DEVICE TYPE: ROM
OPERATING TEMP RANGE: -55.0 TO 125.0 DEG CELSIUS
OUTPUT LOGIC FORM: TRANSISTOR-TRANSISTOR LOGIC
TERMINAL SURFACE TREATMENT: SOLDER
TERMINAL TYPE AND QUANTITY: 16 PRINTED CIRCUIT
THE MANUFACTURERS DATA:

332954-1

MICROCIRCUIT,MEMORY

NSN, MFG P/N

5962012251834

NSN

5962-01-225-1834

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332954-1

MICROCIRCUIT,MEMORY

NSN, MFG P/N

5962012251834

NSN

5962-01-225-1834

MFG

BAE SYSTEMS INFORMATION AND ELECTRONIC SYSTEMS INTEGRATION INC.

Description

DESIGN CONTROL REFERENCE: 332954-1
FEATURES PROVIDED: HERMETICALLY SEALED AND MONOLITHIC AND PROGRAMMABLE
INCLOSURE CONFIGURATION: DUAL-IN-LINE
INCLOSURE MATERIAL: CERAMIC
INPUT CIRCUIT PATTERN: 10 INPUT
MANUFACTURERS CODE: 80249
MEMORY DEVICE TYPE: ROM
OPERATING TEMP RANGE: -55.0 TO 125.0 DEG CELSIUS
OUTPUT LOGIC FORM: TRANSISTOR-TRANSISTOR LOGIC
TERMINAL SURFACE TREATMENT: SOLDER
TERMINAL TYPE AND QUANTITY: 16 PRINTED CIRCUIT
THE MANUFACTURERS DATA:

M38510/20302BEX

MICROCIRCUIT,MEMORY

NSN, MFG P/N

5962012251834

NSN

5962-01-225-1834

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M38510/20302BEX

MICROCIRCUIT,MEMORY

NSN, MFG P/N

5962012251834

NSN

5962-01-225-1834

MFG

MILITARY SPECIFICATIONS PROMULGATED BY MILITARY DEPARTMENTS/AGENCIES UNDER AUTHORITY OF DEFENSE STANDARDIZATION MANUAL 4120 3-M

Description

DESIGN CONTROL REFERENCE: 332954-1
FEATURES PROVIDED: HERMETICALLY SEALED AND MONOLITHIC AND PROGRAMMABLE
INCLOSURE CONFIGURATION: DUAL-IN-LINE
INCLOSURE MATERIAL: CERAMIC
INPUT CIRCUIT PATTERN: 10 INPUT
MANUFACTURERS CODE: 80249
MEMORY DEVICE TYPE: ROM
OPERATING TEMP RANGE: -55.0 TO 125.0 DEG CELSIUS
OUTPUT LOGIC FORM: TRANSISTOR-TRANSISTOR LOGIC
TERMINAL SURFACE TREATMENT: SOLDER
TERMINAL TYPE AND QUANTITY: 16 PRINTED CIRCUIT
THE MANUFACTURERS DATA:

ROM/PROM

MICROCIRCUIT,MEMORY

NSN, MFG P/N

5962012251834

NSN

5962-01-225-1834

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ROM/PROM

MICROCIRCUIT,MEMORY

NSN, MFG P/N

5962012251834

NSN

5962-01-225-1834

MFG

DLA LAND AND MARITIME

Description

DESIGN CONTROL REFERENCE: 332954-1
FEATURES PROVIDED: HERMETICALLY SEALED AND MONOLITHIC AND PROGRAMMABLE
INCLOSURE CONFIGURATION: DUAL-IN-LINE
INCLOSURE MATERIAL: CERAMIC
INPUT CIRCUIT PATTERN: 10 INPUT
MANUFACTURERS CODE: 80249
MEMORY DEVICE TYPE: ROM
OPERATING TEMP RANGE: -55.0 TO 125.0 DEG CELSIUS
OUTPUT LOGIC FORM: TRANSISTOR-TRANSISTOR LOGIC
TERMINAL SURFACE TREATMENT: SOLDER
TERMINAL TYPE AND QUANTITY: 16 PRINTED CIRCUIT
THE MANUFACTURERS DATA:

332951-1

MICROCIRCUIT,DIGITAL

NSN, MFG P/N

5962012251836

NSN

5962-01-225-1836

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332951-1

MICROCIRCUIT,DIGITAL

NSN, MFG P/N

5962012251836

NSN

5962-01-225-1836

MFG

BAE SYSTEMS INFORMATION AND ELECTRONIC SYSTEMS INTEGRATION INC.

Description

DESIGN CONTROL REFERENCE: 332951-1
FEATURES PROVIDED: HERMETICALLY SEALED AND MONOLITHIC AND PROGRAMMABLE
INCLOSURE CONFIGURATION: DUAL-IN-LINE
INCLOSURE MATERIAL: CERAMIC
INPUT CIRCUIT PATTERN: 10 INPUT
MANUFACTURERS CODE: 80249
OPERATING TEMP RANGE: -55.0 TO 125.0 DEG CELSIUS
OUTPUT LOGIC FORM: TRANSISTOR-TRANSISTOR LOGIC
THE MANUFACTURERS DATA:

M38510/20302BEX

MICROCIRCUIT,DIGITAL

NSN, MFG P/N

5962012251836

NSN

5962-01-225-1836

View More Info

M38510/20302BEX

MICROCIRCUIT,DIGITAL

NSN, MFG P/N

5962012251836

NSN

5962-01-225-1836

MFG

MILITARY SPECIFICATIONS PROMULGATED BY MILITARY DEPARTMENTS/AGENCIES UNDER AUTHORITY OF DEFENSE STANDARDIZATION MANUAL 4120 3-M

Description

DESIGN CONTROL REFERENCE: 332951-1
FEATURES PROVIDED: HERMETICALLY SEALED AND MONOLITHIC AND PROGRAMMABLE
INCLOSURE CONFIGURATION: DUAL-IN-LINE
INCLOSURE MATERIAL: CERAMIC
INPUT CIRCUIT PATTERN: 10 INPUT
MANUFACTURERS CODE: 80249
OPERATING TEMP RANGE: -55.0 TO 125.0 DEG CELSIUS
OUTPUT LOGIC FORM: TRANSISTOR-TRANSISTOR LOGIC
THE MANUFACTURERS DATA:

332961-1

MICROCIRCUIT,MEMORY

NSN, MFG P/N

5962012251838

NSN

5962-01-225-1838

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332961-1

MICROCIRCUIT,MEMORY

NSN, MFG P/N

5962012251838

NSN

5962-01-225-1838

MFG

BAE SYSTEMS INFORMATION AND ELECTRONIC SYSTEMS INTEGRATION INC.

Description

(NON-CORE DATA) BIT QUANTITY: 2048
(NON-CORE DATA) WORD QUANTITY: 512
BODY HEIGHT: 0.185 INCHES MAXIMUM
BODY LENGTH: 0.840 INCHES MAXIMUM
BODY WIDTH: 0.310 INCHES MAXIMUM
CASE OUTLINE SOURCE AND DESIGNATOR: D-2 MIL-M-38510
FEATURES PROVIDED: HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND BIPOLAR AND SCHOTTKY AND PROGRAMMABLE
INCLOSURE CONFIGURATION: DUAL-IN-LINE
INCLOSURE MATERIAL: CERAMIC AND GLASS
INPUT CIRCUIT PATTERN: 10 INPUT
MEMORY DEVICE TYPE: PROM
OPERATING TEMP RANGE: -55.0 TO 125.0 DEG CELSIUS
OUTPUT LOGIC FORM: TRANSISTOR-TRANSISTOR LOGIC
SPECIAL FEATURES: SINE/COSINE MSB
TERMINAL SURFACE TREATMENT: SOLDER
TERMINAL TYPE AND QUANTITY: 16 PRINTED CIRCUIT
VOLTAGE RATING AND TYPE PER CHARACTERISTIC: -0.5 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE

M38510/20402BEA

MICROCIRCUIT,MEMORY

NSN, MFG P/N

5962012251838

NSN

5962-01-225-1838

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M38510/20402BEA

MICROCIRCUIT,MEMORY

NSN, MFG P/N

5962012251838

NSN

5962-01-225-1838

MFG

MILITARY SPECIFICATIONS PROMULGATED BY MILITARY DEPARTMENTS/AGENCIES UNDER AUTHORITY OF DEFENSE STANDARDIZATION MANUAL 4120 3-M

Description

(NON-CORE DATA) BIT QUANTITY: 2048
(NON-CORE DATA) WORD QUANTITY: 512
BODY HEIGHT: 0.185 INCHES MAXIMUM
BODY LENGTH: 0.840 INCHES MAXIMUM
BODY WIDTH: 0.310 INCHES MAXIMUM
CASE OUTLINE SOURCE AND DESIGNATOR: D-2 MIL-M-38510
FEATURES PROVIDED: HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND BIPOLAR AND SCHOTTKY AND PROGRAMMABLE
INCLOSURE CONFIGURATION: DUAL-IN-LINE
INCLOSURE MATERIAL: CERAMIC AND GLASS
INPUT CIRCUIT PATTERN: 10 INPUT
MEMORY DEVICE TYPE: PROM
OPERATING TEMP RANGE: -55.0 TO 125.0 DEG CELSIUS
OUTPUT LOGIC FORM: TRANSISTOR-TRANSISTOR LOGIC
SPECIAL FEATURES: SINE/COSINE MSB
TERMINAL SURFACE TREATMENT: SOLDER
TERMINAL TYPE AND QUANTITY: 16 PRINTED CIRCUIT
VOLTAGE RATING AND TYPE PER CHARACTERISTIC: -0.5 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE

ROM/PROM

MICROCIRCUIT,MEMORY

NSN, MFG P/N

5962012251838

NSN

5962-01-225-1838

View More Info

ROM/PROM

MICROCIRCUIT,MEMORY

NSN, MFG P/N

5962012251838

NSN

5962-01-225-1838

MFG

DLA LAND AND MARITIME

Description

(NON-CORE DATA) BIT QUANTITY: 2048
(NON-CORE DATA) WORD QUANTITY: 512
BODY HEIGHT: 0.185 INCHES MAXIMUM
BODY LENGTH: 0.840 INCHES MAXIMUM
BODY WIDTH: 0.310 INCHES MAXIMUM
CASE OUTLINE SOURCE AND DESIGNATOR: D-2 MIL-M-38510
FEATURES PROVIDED: HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND BIPOLAR AND SCHOTTKY AND PROGRAMMABLE
INCLOSURE CONFIGURATION: DUAL-IN-LINE
INCLOSURE MATERIAL: CERAMIC AND GLASS
INPUT CIRCUIT PATTERN: 10 INPUT
MEMORY DEVICE TYPE: PROM
OPERATING TEMP RANGE: -55.0 TO 125.0 DEG CELSIUS
OUTPUT LOGIC FORM: TRANSISTOR-TRANSISTOR LOGIC
SPECIAL FEATURES: SINE/COSINE MSB
TERMINAL SURFACE TREATMENT: SOLDER
TERMINAL TYPE AND QUANTITY: 16 PRINTED CIRCUIT
VOLTAGE RATING AND TYPE PER CHARACTERISTIC: -0.5 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE