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5962-01-294-0107
20 Products
10115211-101
MICROCIRCUIT,DIGITAL
NSN, MFG P/N
5962012940107
NSN
5962-01-294-0107
MFG
HONEYWELL INTERNATIONAL INC DBA HONEYWELL DIV AEROSPACE-MINNEAPOLIS
Description
BODY HEIGHT: 0.060 INCHES MINIMUM AND 0.130 INCHES MAXIMUM
BODY LENGTH: 3.170 INCHES MINIMUM AND 3.230 INCHES MAXIMUM
BODY WIDTH: 0.876 INCHES MINIMUM AND 0.904 INCHES MAXIMUM
DESIGN FUNCTION AND QUANTITY: 1 CONTROL, MEMORY ACCESS
FEATURES PROVIDED: HERMETICALLY SEALED AND BURN IN AND W/CLOCK AND POSITIVE OUTPUTS
INCLOSURE CONFIGURATION: DUAL-IN-LINE
INCLOSURE MATERIAL: CERAMIC
INPUT CIRCUIT PATTERN: 35 INPUT
OPERATING TEMP RANGE: 0.0 TO 70.0 DEG CELSIUS
OUTPUT LOGIC FORM: TRANSISTOR-TRANSISTOR LOGIC
STORAGE TEMP RANGE: -55.0 TO 150.0 DEG CELSIUS
TERMINAL SURFACE TREATMENT: SOLDER
TERMINAL TYPE AND QUANTITY: 64 PRINTED CIRCUIT
TEST DATA DOCUMENT: 96906-MIL-STD-883 STANDARD
VOLTAGE RATING AND TYPE PER CHARACTERISTIC: 7.0 VOLTS MAXIMUM POWER SOURCE
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26984484
MICROCIRCUIT,DIGITAL
NSN, MFG P/N
5962012940107
NSN
5962-01-294-0107
MFG
LOCKHEED MARTIN CORP LOCKHEED MARTIN MISSION SYSTEMS
Description
BODY HEIGHT: 0.060 INCHES MINIMUM AND 0.130 INCHES MAXIMUM
BODY LENGTH: 3.170 INCHES MINIMUM AND 3.230 INCHES MAXIMUM
BODY WIDTH: 0.876 INCHES MINIMUM AND 0.904 INCHES MAXIMUM
DESIGN FUNCTION AND QUANTITY: 1 CONTROL, MEMORY ACCESS
FEATURES PROVIDED: HERMETICALLY SEALED AND BURN IN AND W/CLOCK AND POSITIVE OUTPUTS
INCLOSURE CONFIGURATION: DUAL-IN-LINE
INCLOSURE MATERIAL: CERAMIC
INPUT CIRCUIT PATTERN: 35 INPUT
OPERATING TEMP RANGE: 0.0 TO 70.0 DEG CELSIUS
OUTPUT LOGIC FORM: TRANSISTOR-TRANSISTOR LOGIC
STORAGE TEMP RANGE: -55.0 TO 150.0 DEG CELSIUS
TERMINAL SURFACE TREATMENT: SOLDER
TERMINAL TYPE AND QUANTITY: 64 PRINTED CIRCUIT
TEST DATA DOCUMENT: 96906-MIL-STD-883 STANDARD
VOLTAGE RATING AND TYPE PER CHARACTERISTIC: 7.0 VOLTS MAXIMUM POWER SOURCE
Related Searches:
MC68450L10
MICROCIRCUIT,DIGITAL
NSN, MFG P/N
5962012940107
NSN
5962-01-294-0107
MFG
FREESCALE SEMICONDUCTOR INC.
Description
BODY HEIGHT: 0.060 INCHES MINIMUM AND 0.130 INCHES MAXIMUM
BODY LENGTH: 3.170 INCHES MINIMUM AND 3.230 INCHES MAXIMUM
BODY WIDTH: 0.876 INCHES MINIMUM AND 0.904 INCHES MAXIMUM
DESIGN FUNCTION AND QUANTITY: 1 CONTROL, MEMORY ACCESS
FEATURES PROVIDED: HERMETICALLY SEALED AND BURN IN AND W/CLOCK AND POSITIVE OUTPUTS
INCLOSURE CONFIGURATION: DUAL-IN-LINE
INCLOSURE MATERIAL: CERAMIC
INPUT CIRCUIT PATTERN: 35 INPUT
OPERATING TEMP RANGE: 0.0 TO 70.0 DEG CELSIUS
OUTPUT LOGIC FORM: TRANSISTOR-TRANSISTOR LOGIC
STORAGE TEMP RANGE: -55.0 TO 150.0 DEG CELSIUS
TERMINAL SURFACE TREATMENT: SOLDER
TERMINAL TYPE AND QUANTITY: 64 PRINTED CIRCUIT
TEST DATA DOCUMENT: 96906-MIL-STD-883 STANDARD
VOLTAGE RATING AND TYPE PER CHARACTERISTIC: 7.0 VOLTS MAXIMUM POWER SOURCE
Related Searches:
6411952-1
MICROCIRCUIT,MEMORY
NSN, MFG P/N
5962012940108
NSN
5962-01-294-0108
MFG
HONEYWELL INTL INC DEFENSE AVIONICS SYSTEMS FORMER TEST SYSTEMS DIV
Description
(NON-CORE DATA) BIT QUANTITY: 131072
(NON-CORE DATA) WORD QUANTITY: 16384
BODY HEIGHT: 0.290 INCHES MINIMUM AND 0.310 INCHES MAXIMUM
BODY LENGTH: 1.436 INCHES MINIMUM AND 1.464 INCHES MAXIMUM
BODY WIDTH: 0.590 INCHES MINIMUM AND 0.610 INCHES MAXIMUM
FEATURES PROVIDED: HERMETICALLY SEALED AND BURN IN AND HYBRID AND W/ENABLE AND BIDIRECTIONAL
INCLOSURE CONFIGURATION: DUAL-IN-LINE
INCLOSURE MATERIAL: CERAMIC
INPUT CIRCUIT PATTERN: 25 INPUT
MAXIMUM POWER DISSIPATION RATING: 2.0 WATTS
MEMORY DEVICE TYPE: RAM
OPERATING TEMP RANGE: -55.0 TO 125.0 DEG CELSIUS
OUTPUT LOGIC FORM: TRANSISTOR-TRANSISTOR LOGIC
STORAGE TEMP RANGE: -65.0 TO 150.0 DEG CELSIUS
TERMINAL SURFACE TREATMENT: SOLDER
TERMINAL TYPE AND QUANTITY: 28 PRINTED CIRCUIT
TEST DATA DOCUMENT: 96906-MIL-STD-883 STANDARD
TIME RATING PER CHACTERISTIC: 45.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 45.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT
VOLTA
Related Searches:
DPS88H16-45M
MICROCIRCUIT,MEMORY
NSN, MFG P/N
5962012940108
NSN
5962-01-294-0108
MFG
DPAC TECHNOLOGIES CORP.
Description
(NON-CORE DATA) BIT QUANTITY: 131072
(NON-CORE DATA) WORD QUANTITY: 16384
BODY HEIGHT: 0.290 INCHES MINIMUM AND 0.310 INCHES MAXIMUM
BODY LENGTH: 1.436 INCHES MINIMUM AND 1.464 INCHES MAXIMUM
BODY WIDTH: 0.590 INCHES MINIMUM AND 0.610 INCHES MAXIMUM
FEATURES PROVIDED: HERMETICALLY SEALED AND BURN IN AND HYBRID AND W/ENABLE AND BIDIRECTIONAL
INCLOSURE CONFIGURATION: DUAL-IN-LINE
INCLOSURE MATERIAL: CERAMIC
INPUT CIRCUIT PATTERN: 25 INPUT
MAXIMUM POWER DISSIPATION RATING: 2.0 WATTS
MEMORY DEVICE TYPE: RAM
OPERATING TEMP RANGE: -55.0 TO 125.0 DEG CELSIUS
OUTPUT LOGIC FORM: TRANSISTOR-TRANSISTOR LOGIC
STORAGE TEMP RANGE: -65.0 TO 150.0 DEG CELSIUS
TERMINAL SURFACE TREATMENT: SOLDER
TERMINAL TYPE AND QUANTITY: 28 PRINTED CIRCUIT
TEST DATA DOCUMENT: 96906-MIL-STD-883 STANDARD
TIME RATING PER CHACTERISTIC: 45.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 45.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT
VOLTA
Related Searches:
EDH88H16C-45CMHR
MICROCIRCUIT,MEMORY
NSN, MFG P/N
5962012940108
NSN
5962-01-294-0108
MFG
WHITE ELECTRONIC DESIGNS CORP DIV COMMERCIAL DIVISION
Description
(NON-CORE DATA) BIT QUANTITY: 131072
(NON-CORE DATA) WORD QUANTITY: 16384
BODY HEIGHT: 0.290 INCHES MINIMUM AND 0.310 INCHES MAXIMUM
BODY LENGTH: 1.436 INCHES MINIMUM AND 1.464 INCHES MAXIMUM
BODY WIDTH: 0.590 INCHES MINIMUM AND 0.610 INCHES MAXIMUM
FEATURES PROVIDED: HERMETICALLY SEALED AND BURN IN AND HYBRID AND W/ENABLE AND BIDIRECTIONAL
INCLOSURE CONFIGURATION: DUAL-IN-LINE
INCLOSURE MATERIAL: CERAMIC
INPUT CIRCUIT PATTERN: 25 INPUT
MAXIMUM POWER DISSIPATION RATING: 2.0 WATTS
MEMORY DEVICE TYPE: RAM
OPERATING TEMP RANGE: -55.0 TO 125.0 DEG CELSIUS
OUTPUT LOGIC FORM: TRANSISTOR-TRANSISTOR LOGIC
STORAGE TEMP RANGE: -65.0 TO 150.0 DEG CELSIUS
TERMINAL SURFACE TREATMENT: SOLDER
TERMINAL TYPE AND QUANTITY: 28 PRINTED CIRCUIT
TEST DATA DOCUMENT: 96906-MIL-STD-883 STANDARD
TIME RATING PER CHACTERISTIC: 45.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 45.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT
VOLTA
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333281-1
MICROCIRCUIT,MEMORY
NSN, MFG P/N
5962012940109
NSN
5962-01-294-0109
MFG
BAE SYSTEMS INFORMATION AND ELECTRONIC SYSTEMS INTEGRATION INC.
Description
(NON-CORE DATA) BIT QUANTITY: 16384
(NON-CORE DATA) WORD QUANTITY: 2048
BODY HEIGHT: 0.070 INCHES MINIMUM AND 0.350 INCHES MAXIMUM
BODY LENGTH: 1.040 INCHES MINIMUM AND 1.500 INCHES MAXIMUM
BODY WIDTH: 0.480 INCHES MINIMUM AND 0.630 INCHES MAXIMUM
FEATURES PROVIDED: HERMETICALLY SEALED AND POSITIVE OUTPUTS AND W/ENABLE AND ELECTROSTATIC SENSITIVE AND PROGRAMMABLE AND ULTRAVIOLET ERASABLE
INCLOSURE CONFIGURATION: DUAL-IN-LINE
INCLOSURE MATERIAL: CERAMIC
INPUT CIRCUIT PATTERN: 13 INPUT
MAXIMUM POWER DISSIPATION RATING: 525.0 MILLIWATTS
MEMORY DEVICE TYPE: PROM
OPERATING TEMP RANGE: 0.0 TO 70.0 DEG CELSIUS
OUTPUT LOGIC FORM: METAL OXIDE-SEMICONDUCTOR LOGIC
STORAGE TEMP RANGE: -65.0 TO 150.0 DEG CELSIUS
TERMINAL SURFACE TREATMENT: SOLDER
TERMINAL TYPE AND QUANTITY: 24 PRINTED CIRCUIT
TIME RATING PER CHACTERISTIC: 300.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 300.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT
Related Searches:
703665
MICROCIRCUIT,MEMORY
NSN, MFG P/N
5962012940109
NSN
5962-01-294-0109
MFG
BAE SYSTEMS INFORMATION AND ELECTRONIC SYSTEMS INTEGRATION INC.
Description
(NON-CORE DATA) BIT QUANTITY: 16384
(NON-CORE DATA) WORD QUANTITY: 2048
BODY HEIGHT: 0.070 INCHES MINIMUM AND 0.350 INCHES MAXIMUM
BODY LENGTH: 1.040 INCHES MINIMUM AND 1.500 INCHES MAXIMUM
BODY WIDTH: 0.480 INCHES MINIMUM AND 0.630 INCHES MAXIMUM
FEATURES PROVIDED: HERMETICALLY SEALED AND POSITIVE OUTPUTS AND W/ENABLE AND ELECTROSTATIC SENSITIVE AND PROGRAMMABLE AND ULTRAVIOLET ERASABLE
INCLOSURE CONFIGURATION: DUAL-IN-LINE
INCLOSURE MATERIAL: CERAMIC
INPUT CIRCUIT PATTERN: 13 INPUT
MAXIMUM POWER DISSIPATION RATING: 525.0 MILLIWATTS
MEMORY DEVICE TYPE: PROM
OPERATING TEMP RANGE: 0.0 TO 70.0 DEG CELSIUS
OUTPUT LOGIC FORM: METAL OXIDE-SEMICONDUCTOR LOGIC
STORAGE TEMP RANGE: -65.0 TO 150.0 DEG CELSIUS
TERMINAL SURFACE TREATMENT: SOLDER
TERMINAL TYPE AND QUANTITY: 24 PRINTED CIRCUIT
TIME RATING PER CHACTERISTIC: 300.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 300.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT
Related Searches:
703673-1
MICROCIRCUIT,MEMORY
NSN, MFG P/N
5962012940109
NSN
5962-01-294-0109
MFG
BAE SYSTEMS INFORMATION AND ELECTRONIC SYSTEMS INTEGRATION INC.
Description
(NON-CORE DATA) BIT QUANTITY: 16384
(NON-CORE DATA) WORD QUANTITY: 2048
BODY HEIGHT: 0.070 INCHES MINIMUM AND 0.350 INCHES MAXIMUM
BODY LENGTH: 1.040 INCHES MINIMUM AND 1.500 INCHES MAXIMUM
BODY WIDTH: 0.480 INCHES MINIMUM AND 0.630 INCHES MAXIMUM
FEATURES PROVIDED: HERMETICALLY SEALED AND POSITIVE OUTPUTS AND W/ENABLE AND ELECTROSTATIC SENSITIVE AND PROGRAMMABLE AND ULTRAVIOLET ERASABLE
INCLOSURE CONFIGURATION: DUAL-IN-LINE
INCLOSURE MATERIAL: CERAMIC
INPUT CIRCUIT PATTERN: 13 INPUT
MAXIMUM POWER DISSIPATION RATING: 525.0 MILLIWATTS
MEMORY DEVICE TYPE: PROM
OPERATING TEMP RANGE: 0.0 TO 70.0 DEG CELSIUS
OUTPUT LOGIC FORM: METAL OXIDE-SEMICONDUCTOR LOGIC
STORAGE TEMP RANGE: -65.0 TO 150.0 DEG CELSIUS
TERMINAL SURFACE TREATMENT: SOLDER
TERMINAL TYPE AND QUANTITY: 24 PRINTED CIRCUIT
TIME RATING PER CHACTERISTIC: 300.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 300.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT
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AM2716B-300DC
MICROCIRCUIT,MEMORY
NSN, MFG P/N
5962012940109
NSN
5962-01-294-0109
MFG
ADVANCED MICRO DEVICES INC DBA A M D
Description
(NON-CORE DATA) BIT QUANTITY: 16384
(NON-CORE DATA) WORD QUANTITY: 2048
BODY HEIGHT: 0.070 INCHES MINIMUM AND 0.350 INCHES MAXIMUM
BODY LENGTH: 1.040 INCHES MINIMUM AND 1.500 INCHES MAXIMUM
BODY WIDTH: 0.480 INCHES MINIMUM AND 0.630 INCHES MAXIMUM
FEATURES PROVIDED: HERMETICALLY SEALED AND POSITIVE OUTPUTS AND W/ENABLE AND ELECTROSTATIC SENSITIVE AND PROGRAMMABLE AND ULTRAVIOLET ERASABLE
INCLOSURE CONFIGURATION: DUAL-IN-LINE
INCLOSURE MATERIAL: CERAMIC
INPUT CIRCUIT PATTERN: 13 INPUT
MAXIMUM POWER DISSIPATION RATING: 525.0 MILLIWATTS
MEMORY DEVICE TYPE: PROM
OPERATING TEMP RANGE: 0.0 TO 70.0 DEG CELSIUS
OUTPUT LOGIC FORM: METAL OXIDE-SEMICONDUCTOR LOGIC
STORAGE TEMP RANGE: -65.0 TO 150.0 DEG CELSIUS
TERMINAL SURFACE TREATMENT: SOLDER
TERMINAL TYPE AND QUANTITY: 24 PRINTED CIRCUIT
TIME RATING PER CHACTERISTIC: 300.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 300.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT
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MICROCIRCUIT,MEMORY
NSN, MFG P/N
5962012940109
NSN
5962-01-294-0109
MFG
DLA LAND AND MARITIME
Description
(NON-CORE DATA) BIT QUANTITY: 16384
(NON-CORE DATA) WORD QUANTITY: 2048
BODY HEIGHT: 0.070 INCHES MINIMUM AND 0.350 INCHES MAXIMUM
BODY LENGTH: 1.040 INCHES MINIMUM AND 1.500 INCHES MAXIMUM
BODY WIDTH: 0.480 INCHES MINIMUM AND 0.630 INCHES MAXIMUM
FEATURES PROVIDED: HERMETICALLY SEALED AND POSITIVE OUTPUTS AND W/ENABLE AND ELECTROSTATIC SENSITIVE AND PROGRAMMABLE AND ULTRAVIOLET ERASABLE
INCLOSURE CONFIGURATION: DUAL-IN-LINE
INCLOSURE MATERIAL: CERAMIC
INPUT CIRCUIT PATTERN: 13 INPUT
MAXIMUM POWER DISSIPATION RATING: 525.0 MILLIWATTS
MEMORY DEVICE TYPE: PROM
OPERATING TEMP RANGE: 0.0 TO 70.0 DEG CELSIUS
OUTPUT LOGIC FORM: METAL OXIDE-SEMICONDUCTOR LOGIC
STORAGE TEMP RANGE: -65.0 TO 150.0 DEG CELSIUS
TERMINAL SURFACE TREATMENT: SOLDER
TERMINAL TYPE AND QUANTITY: 24 PRINTED CIRCUIT
TIME RATING PER CHACTERISTIC: 300.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 300.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT
Related Searches:
0N199148
MICROCIRCUIT,DIGITAL
NSN, MFG P/N
5962012940671
NSN
5962-01-294-0671
MFG
NATIONAL SECURITY AGENCY
Description
MICROCIRCUIT,DIGITAL
Related Searches:
0N199154
MICROCIRCUIT,DIGITAL
NSN, MFG P/N
5962012940672
NSN
5962-01-294-0672
MFG
NATIONAL SECURITY AGENCY
Description
MICROCIRCUIT,DIGITAL
Related Searches:
CD4024AD13
MICROCIRCUIT,DIGITAL
NSN, MFG P/N
5962012940672
NSN
5962-01-294-0672
MFG
INTERSIL CORPORATION
Description
MICROCIRCUIT,DIGITAL
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MC14024BBCBS
MICROCIRCUIT,DIGITAL
NSN, MFG P/N
5962012940672
NSN
5962-01-294-0672
MFG
FREESCALE SEMICONDUCTOR INC.
Description
MICROCIRCUIT,DIGITAL
Related Searches:
11426-40035
MICROCIRCUIT,DIGITAL
NSN, MFG P/N
5962012941005
NSN
5962-01-294-1005
MFG
AAI CORPORATION
Description
FEATURES PROVIDED: PROGRAMMABLE
III END ITEM IDENTIFICATION: B52MIDATS
Related Searches:
11426-40085
MICROCIRCUIT,DIGITAL
NSN, MFG P/N
5962012941005
NSN
5962-01-294-1005
MFG
AAI CORPORATION
Description
FEATURES PROVIDED: PROGRAMMABLE
III END ITEM IDENTIFICATION: B52MIDATS
Related Searches:
91667043
MICROCIRCUIT,DIGITAL
NSN, MFG P/N
5962012941303
NSN
5962-01-294-1303
MFG
THALES
Description
(NON-CORE DATA) BIT QUANTITY: 8
BODY HEIGHT: 0.059 INCHES MINIMUM AND 0.071 INCHES MAXIMUM
BODY LENGTH: 0.345 INCHES MINIMUM AND 0.359 INCHES MAXIMUM
BODY WIDTH: 0.345 INCHES MINIMUM AND 0.359 INCHES MAXIMUM
DESIGN FUNCTION AND QUANTITY: 8 REGISTER, D-TYPE
FEATURES PROVIDED: POSITIVE EDGE TRIGGERED AND W/ENABLE AND W/CLOCK AND 3-STATE OUTPUT
INCLOSURE CONFIGURATION: LEADLESS FLAT PACK
INCLOSURE MATERIAL: CERAMIC
INPUT CIRCUIT PATTERN: 10 INPUT
OPERATING TEMP RANGE: -55.0 TO 125.0 DEG CELSIUS
OUTPUT LOGIC FORM: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
STORAGE TEMP RANGE: -65.0 TO 155.0 DEG CELSIUS
TERMINAL SURFACE TREATMENT: SOLDER
TERMINAL TYPE AND QUANTITY: 20 LEADLESS
TEST DATA DOCUMENT: 96906-MIL-STD-883 STANDARD
TIME RATING PER CHACTERISTIC: 11.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 11.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT
VOLTAGE RATING AND TYPE PER CHARACTERISTIC: 7.0 VOLTS MAXIMUM
Related Searches:
99169552
MICROCIRCUIT,DIGITAL
NSN, MFG P/N
5962012941303
NSN
5962-01-294-1303
MFG
THALES
Description
(NON-CORE DATA) BIT QUANTITY: 8
BODY HEIGHT: 0.059 INCHES MINIMUM AND 0.071 INCHES MAXIMUM
BODY LENGTH: 0.345 INCHES MINIMUM AND 0.359 INCHES MAXIMUM
BODY WIDTH: 0.345 INCHES MINIMUM AND 0.359 INCHES MAXIMUM
DESIGN FUNCTION AND QUANTITY: 8 REGISTER, D-TYPE
FEATURES PROVIDED: POSITIVE EDGE TRIGGERED AND W/ENABLE AND W/CLOCK AND 3-STATE OUTPUT
INCLOSURE CONFIGURATION: LEADLESS FLAT PACK
INCLOSURE MATERIAL: CERAMIC
INPUT CIRCUIT PATTERN: 10 INPUT
OPERATING TEMP RANGE: -55.0 TO 125.0 DEG CELSIUS
OUTPUT LOGIC FORM: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
STORAGE TEMP RANGE: -65.0 TO 155.0 DEG CELSIUS
TERMINAL SURFACE TREATMENT: SOLDER
TERMINAL TYPE AND QUANTITY: 20 LEADLESS
TEST DATA DOCUMENT: 96906-MIL-STD-883 STANDARD
TIME RATING PER CHACTERISTIC: 11.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 11.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT
VOLTAGE RATING AND TYPE PER CHARACTERISTIC: 7.0 VOLTS MAXIMUM
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IDT54FCT374ALB
MICROCIRCUIT,DIGITAL
NSN, MFG P/N
5962012941303
NSN
5962-01-294-1303
MFG
INTEGRATED DEVICE TECHNOLOGY INC
Description
(NON-CORE DATA) BIT QUANTITY: 8
BODY HEIGHT: 0.059 INCHES MINIMUM AND 0.071 INCHES MAXIMUM
BODY LENGTH: 0.345 INCHES MINIMUM AND 0.359 INCHES MAXIMUM
BODY WIDTH: 0.345 INCHES MINIMUM AND 0.359 INCHES MAXIMUM
DESIGN FUNCTION AND QUANTITY: 8 REGISTER, D-TYPE
FEATURES PROVIDED: POSITIVE EDGE TRIGGERED AND W/ENABLE AND W/CLOCK AND 3-STATE OUTPUT
INCLOSURE CONFIGURATION: LEADLESS FLAT PACK
INCLOSURE MATERIAL: CERAMIC
INPUT CIRCUIT PATTERN: 10 INPUT
OPERATING TEMP RANGE: -55.0 TO 125.0 DEG CELSIUS
OUTPUT LOGIC FORM: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
STORAGE TEMP RANGE: -65.0 TO 155.0 DEG CELSIUS
TERMINAL SURFACE TREATMENT: SOLDER
TERMINAL TYPE AND QUANTITY: 20 LEADLESS
TEST DATA DOCUMENT: 96906-MIL-STD-883 STANDARD
TIME RATING PER CHACTERISTIC: 11.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 11.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT
VOLTAGE RATING AND TYPE PER CHARACTERISTIC: 7.0 VOLTS MAXIMUM
