My Quote Request
No products added yet
5962-01-033-5516
20 Products
10525/BEBJC
MICROCIRCUIT,DIGITAL
NSN, MFG P/N
5962010335516
NSN
5962-01-033-5516
MFG
FREESCALE SEMICONDUCTOR INC.
Description
BODY HEIGHT: 0.140 INCHES MINIMUM AND 0.185 INCHES MAXIMUM
BODY LENGTH: 0.896 INCHES MAXIMUM
BODY WIDTH: 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM
CASE OUTLINE SOURCE AND DESIGNATOR: D-2 MIL-M-38510
DESIGN FUNCTION AND QUANTITY: 4 TRANSLATOR, LEVEL
FEATURES PROVIDED: HERMETICALLY SEALED AND MONOLITHIC AND NEGATIVE OUTPUTS AND SCHOTTKY AND W/TOTEM POLE OUTPUT AND HIGH SPEED
III END ITEM IDENTIFICATION: COUNTERMEASURES SET TYPE AN/TLQ-17A FSCM 72314
INCLOSURE CONFIGURATION: DUAL-IN-LINE
INCLOSURE MATERIAL: CERAMIC AND GLASS
INPUT CIRCUIT PATTERN: QUAD 2 INPUT
MAXIMUM POWER DISSIPATION RATING: 380.0 MILLIWATTS
OPERATING TEMP RANGE: -55.0 TO 125.0 DEG CELSIUS
OUTPUT LOGIC FORM: EMITTER-COUPLED LOGIC
STORAGE TEMP RANGE: -65.0 TO 150.0 DEG CELSIUS
TEST DATA DOCUMENT: 81349-MIL-STD-883 SPECIFICATION
Related Searches:
ROM/PROM FAMILY 005
MICROCIRCUIT,MEMORY
NSN, MFG P/N
5962010335513
NSN
5962-01-033-5513
ROM/PROM FAMILY 005
MICROCIRCUIT,MEMORY
NSN, MFG P/N
5962010335513
NSN
5962-01-033-5513
MFG
DLA LAND AND MARITIME
Description
(NON-CORE DATA) BIT QUANTITY: 1024
(NON-CORE DATA) WORD QUANTITY: 256
BODY HEIGHT: 0.200 INCHES MAXIMUM
BODY LENGTH: 0.747 INCHES MINIMUM AND 0.815 INCHES MAXIMUM
BODY WIDTH: 0.220 INCHES MINIMUM AND 0.280 INCHES MAXIMUM
DESIGN CONTROL REFERENCE: 10560-35
FEATURES PROVIDED: HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND W/ENABLE AND PROGRAMMABLE AND PROGRAMMED AND HIGH SPEED AND WIRE-OR OUTPUTS
III END ITEM IDENTIFICATION: BUILDING BLOCK 57 FSCM 30003
III PRECIOUS MATERIAL AND LOCATION: TERMINALS GOLD
INCLOSURE CONFIGURATION: DUAL-IN-LINE
INCLOSURE MATERIAL: CERAMIC AND GLASS
INPUT CIRCUIT PATTERN: 10 INPUT
MANUFACTURERS CODE: 06424
MAXIMUM POWER DISSIPATION RATING: 525.0 MILLIWATTS
MEMORY DEVICE TYPE: ROM
OPERATING TEMP RANGE: -55.0 TO 125.0 DEG CELSIUS
OUTPUT LOGIC FORM: TRANSISTOR-TRANSISTOR LOGIC
STORAGE TEMP RANGE: -65.0 TO 200.0 DEG CELSIUS
TERMINAL SURFACE TREATMENT: GOLD
TERMINAL TYPE AND QUANTITY: 16 PRINTED CIRCUIT
TEST DATA DO
Related Searches:
S82S129F
MICROCIRCUIT,MEMORY
NSN, MFG P/N
5962010335513
NSN
5962-01-033-5513
MFG
PHILIPS SEMICONDUCTORS INC
Description
(NON-CORE DATA) BIT QUANTITY: 1024
(NON-CORE DATA) WORD QUANTITY: 256
BODY HEIGHT: 0.200 INCHES MAXIMUM
BODY LENGTH: 0.747 INCHES MINIMUM AND 0.815 INCHES MAXIMUM
BODY WIDTH: 0.220 INCHES MINIMUM AND 0.280 INCHES MAXIMUM
DESIGN CONTROL REFERENCE: 10560-35
FEATURES PROVIDED: HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND W/ENABLE AND PROGRAMMABLE AND PROGRAMMED AND HIGH SPEED AND WIRE-OR OUTPUTS
III END ITEM IDENTIFICATION: BUILDING BLOCK 57 FSCM 30003
III PRECIOUS MATERIAL AND LOCATION: TERMINALS GOLD
INCLOSURE CONFIGURATION: DUAL-IN-LINE
INCLOSURE MATERIAL: CERAMIC AND GLASS
INPUT CIRCUIT PATTERN: 10 INPUT
MANUFACTURERS CODE: 06424
MAXIMUM POWER DISSIPATION RATING: 525.0 MILLIWATTS
MEMORY DEVICE TYPE: ROM
OPERATING TEMP RANGE: -55.0 TO 125.0 DEG CELSIUS
OUTPUT LOGIC FORM: TRANSISTOR-TRANSISTOR LOGIC
STORAGE TEMP RANGE: -65.0 TO 200.0 DEG CELSIUS
TERMINAL SURFACE TREATMENT: GOLD
TERMINAL TYPE AND QUANTITY: 16 PRINTED CIRCUIT
TEST DATA DO
Related Searches:
10560-38
MICROCIRCUIT,MEMORY
NSN, MFG P/N
5962010335514
NSN
5962-01-033-5514
MFG
ALLIANT TECHSYSTEMS INC . DIV DEFENSE ELECTRONICS SYSTEMS
Description
(NON-CORE DATA) BIT QUANTITY: 1024
(NON-CORE DATA) WORD QUANTITY: 256
BODY HEIGHT: 0.200 INCHES MAXIMUM
BODY LENGTH: 0.747 INCHES MINIMUM AND 0.815 INCHES MAXIMUM
BODY WIDTH: 0.220 INCHES MINIMUM AND 0.280 INCHES MAXIMUM
DESIGN CONTROL REFERENCE: 10560-38
FEATURES PROVIDED: HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND W/ENABLE AND PROGRAMMABLE AND PROGRAMMED AND HIGH SPEED AND WIRE-OR OUTPUTS
III END ITEM IDENTIFICATION: BUILDING BLOCK 57 FSCM 30003
III PRECIOUS MATERIAL AND LOCATION: TERMINALS GOLD
INCLOSURE CONFIGURATION: DUAL-IN-LINE
INCLOSURE MATERIAL: CERAMIC AND GLASS
INPUT CIRCUIT PATTERN: 10 INPUT
MANUFACTURERS CODE: 06424
MAXIMUM POWER DISSIPATION RATING: 525.0 MILLIWATTS
MEMORY DEVICE TYPE: ROM
OPERATING TEMP RANGE: -55.0 TO 125.0 DEG CELSIUS
OUTPUT LOGIC FORM: TRANSISTOR-TRANSISTOR LOGIC
STORAGE TEMP RANGE: -65.0 TO 200.0 DEG CELSIUS
TERMINAL SURFACE TREATMENT: GOLD
TERMINAL TYPE AND QUANTITY: 16 PRINTED CIRCUIT
TEST DATA DO
Related Searches:
DM7574J
MICROCIRCUIT,MEMORY
NSN, MFG P/N
5962010335514
NSN
5962-01-033-5514
MFG
NATIONAL SEMICONDUCTOR CORPORATION
Description
(NON-CORE DATA) BIT QUANTITY: 1024
(NON-CORE DATA) WORD QUANTITY: 256
BODY HEIGHT: 0.200 INCHES MAXIMUM
BODY LENGTH: 0.747 INCHES MINIMUM AND 0.815 INCHES MAXIMUM
BODY WIDTH: 0.220 INCHES MINIMUM AND 0.280 INCHES MAXIMUM
DESIGN CONTROL REFERENCE: 10560-38
FEATURES PROVIDED: HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND W/ENABLE AND PROGRAMMABLE AND PROGRAMMED AND HIGH SPEED AND WIRE-OR OUTPUTS
III END ITEM IDENTIFICATION: BUILDING BLOCK 57 FSCM 30003
III PRECIOUS MATERIAL AND LOCATION: TERMINALS GOLD
INCLOSURE CONFIGURATION: DUAL-IN-LINE
INCLOSURE MATERIAL: CERAMIC AND GLASS
INPUT CIRCUIT PATTERN: 10 INPUT
MANUFACTURERS CODE: 06424
MAXIMUM POWER DISSIPATION RATING: 525.0 MILLIWATTS
MEMORY DEVICE TYPE: ROM
OPERATING TEMP RANGE: -55.0 TO 125.0 DEG CELSIUS
OUTPUT LOGIC FORM: TRANSISTOR-TRANSISTOR LOGIC
STORAGE TEMP RANGE: -65.0 TO 200.0 DEG CELSIUS
TERMINAL SURFACE TREATMENT: GOLD
TERMINAL TYPE AND QUANTITY: 16 PRINTED CIRCUIT
TEST DATA DO
Related Searches:
HPROM1-1024-2B
MICROCIRCUIT,MEMORY
NSN, MFG P/N
5962010335514
NSN
5962-01-033-5514
MFG
INTERSIL CORPORATION
Description
(NON-CORE DATA) BIT QUANTITY: 1024
(NON-CORE DATA) WORD QUANTITY: 256
BODY HEIGHT: 0.200 INCHES MAXIMUM
BODY LENGTH: 0.747 INCHES MINIMUM AND 0.815 INCHES MAXIMUM
BODY WIDTH: 0.220 INCHES MINIMUM AND 0.280 INCHES MAXIMUM
DESIGN CONTROL REFERENCE: 10560-38
FEATURES PROVIDED: HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND W/ENABLE AND PROGRAMMABLE AND PROGRAMMED AND HIGH SPEED AND WIRE-OR OUTPUTS
III END ITEM IDENTIFICATION: BUILDING BLOCK 57 FSCM 30003
III PRECIOUS MATERIAL AND LOCATION: TERMINALS GOLD
INCLOSURE CONFIGURATION: DUAL-IN-LINE
INCLOSURE MATERIAL: CERAMIC AND GLASS
INPUT CIRCUIT PATTERN: 10 INPUT
MANUFACTURERS CODE: 06424
MAXIMUM POWER DISSIPATION RATING: 525.0 MILLIWATTS
MEMORY DEVICE TYPE: ROM
OPERATING TEMP RANGE: -55.0 TO 125.0 DEG CELSIUS
OUTPUT LOGIC FORM: TRANSISTOR-TRANSISTOR LOGIC
STORAGE TEMP RANGE: -65.0 TO 200.0 DEG CELSIUS
TERMINAL SURFACE TREATMENT: GOLD
TERMINAL TYPE AND QUANTITY: 16 PRINTED CIRCUIT
TEST DATA DO
Related Searches:
IM5623MDE
MICROCIRCUIT,MEMORY
NSN, MFG P/N
5962010335514
NSN
5962-01-033-5514
MFG
INTERSIL INC SUB OF GENERAL ELECTRIC CO
Description
(NON-CORE DATA) BIT QUANTITY: 1024
(NON-CORE DATA) WORD QUANTITY: 256
BODY HEIGHT: 0.200 INCHES MAXIMUM
BODY LENGTH: 0.747 INCHES MINIMUM AND 0.815 INCHES MAXIMUM
BODY WIDTH: 0.220 INCHES MINIMUM AND 0.280 INCHES MAXIMUM
DESIGN CONTROL REFERENCE: 10560-38
FEATURES PROVIDED: HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND W/ENABLE AND PROGRAMMABLE AND PROGRAMMED AND HIGH SPEED AND WIRE-OR OUTPUTS
III END ITEM IDENTIFICATION: BUILDING BLOCK 57 FSCM 30003
III PRECIOUS MATERIAL AND LOCATION: TERMINALS GOLD
INCLOSURE CONFIGURATION: DUAL-IN-LINE
INCLOSURE MATERIAL: CERAMIC AND GLASS
INPUT CIRCUIT PATTERN: 10 INPUT
MANUFACTURERS CODE: 06424
MAXIMUM POWER DISSIPATION RATING: 525.0 MILLIWATTS
MEMORY DEVICE TYPE: ROM
OPERATING TEMP RANGE: -55.0 TO 125.0 DEG CELSIUS
OUTPUT LOGIC FORM: TRANSISTOR-TRANSISTOR LOGIC
STORAGE TEMP RANGE: -65.0 TO 200.0 DEG CELSIUS
TERMINAL SURFACE TREATMENT: GOLD
TERMINAL TYPE AND QUANTITY: 16 PRINTED CIRCUIT
TEST DATA DO
Related Searches:
ROM/PROM FAMILY 005
MICROCIRCUIT,MEMORY
NSN, MFG P/N
5962010335514
NSN
5962-01-033-5514
ROM/PROM FAMILY 005
MICROCIRCUIT,MEMORY
NSN, MFG P/N
5962010335514
NSN
5962-01-033-5514
MFG
DLA LAND AND MARITIME
Description
(NON-CORE DATA) BIT QUANTITY: 1024
(NON-CORE DATA) WORD QUANTITY: 256
BODY HEIGHT: 0.200 INCHES MAXIMUM
BODY LENGTH: 0.747 INCHES MINIMUM AND 0.815 INCHES MAXIMUM
BODY WIDTH: 0.220 INCHES MINIMUM AND 0.280 INCHES MAXIMUM
DESIGN CONTROL REFERENCE: 10560-38
FEATURES PROVIDED: HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND W/ENABLE AND PROGRAMMABLE AND PROGRAMMED AND HIGH SPEED AND WIRE-OR OUTPUTS
III END ITEM IDENTIFICATION: BUILDING BLOCK 57 FSCM 30003
III PRECIOUS MATERIAL AND LOCATION: TERMINALS GOLD
INCLOSURE CONFIGURATION: DUAL-IN-LINE
INCLOSURE MATERIAL: CERAMIC AND GLASS
INPUT CIRCUIT PATTERN: 10 INPUT
MANUFACTURERS CODE: 06424
MAXIMUM POWER DISSIPATION RATING: 525.0 MILLIWATTS
MEMORY DEVICE TYPE: ROM
OPERATING TEMP RANGE: -55.0 TO 125.0 DEG CELSIUS
OUTPUT LOGIC FORM: TRANSISTOR-TRANSISTOR LOGIC
STORAGE TEMP RANGE: -65.0 TO 200.0 DEG CELSIUS
TERMINAL SURFACE TREATMENT: GOLD
TERMINAL TYPE AND QUANTITY: 16 PRINTED CIRCUIT
TEST DATA DO
Related Searches:
S82S129F
MICROCIRCUIT,MEMORY
NSN, MFG P/N
5962010335514
NSN
5962-01-033-5514
MFG
PHILIPS SEMICONDUCTORS INC
Description
(NON-CORE DATA) BIT QUANTITY: 1024
(NON-CORE DATA) WORD QUANTITY: 256
BODY HEIGHT: 0.200 INCHES MAXIMUM
BODY LENGTH: 0.747 INCHES MINIMUM AND 0.815 INCHES MAXIMUM
BODY WIDTH: 0.220 INCHES MINIMUM AND 0.280 INCHES MAXIMUM
DESIGN CONTROL REFERENCE: 10560-38
FEATURES PROVIDED: HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND W/ENABLE AND PROGRAMMABLE AND PROGRAMMED AND HIGH SPEED AND WIRE-OR OUTPUTS
III END ITEM IDENTIFICATION: BUILDING BLOCK 57 FSCM 30003
III PRECIOUS MATERIAL AND LOCATION: TERMINALS GOLD
INCLOSURE CONFIGURATION: DUAL-IN-LINE
INCLOSURE MATERIAL: CERAMIC AND GLASS
INPUT CIRCUIT PATTERN: 10 INPUT
MANUFACTURERS CODE: 06424
MAXIMUM POWER DISSIPATION RATING: 525.0 MILLIWATTS
MEMORY DEVICE TYPE: ROM
OPERATING TEMP RANGE: -55.0 TO 125.0 DEG CELSIUS
OUTPUT LOGIC FORM: TRANSISTOR-TRANSISTOR LOGIC
STORAGE TEMP RANGE: -65.0 TO 200.0 DEG CELSIUS
TERMINAL SURFACE TREATMENT: GOLD
TERMINAL TYPE AND QUANTITY: 16 PRINTED CIRCUIT
TEST DATA DO
Related Searches:
158809-01
MICROCIRCUIT,DIGITAL
NSN, MFG P/N
5962010335515
NSN
5962-01-033-5515
MFG
GE AVIATION SYSTEMS LLC
Description
(NON-CORE DATA) BIT QUANTITY: 8
BODY HEIGHT: 0.030 INCHES MINIMUM AND 0.070 INCHES MAXIMUM
BODY LENGTH: 0.280 INCHES MAXIMUM
BODY WIDTH: 0.120 INCHES MINIMUM AND 0.200 INCHES MAXIMUM
CASE OUTLINE SOURCE AND DESIGNATOR: F-3 MIL-M-38510
DESIGN FUNCTION AND QUANTITY: 1 SHIFT REGISTER, SERIAL IN, PARALLEL OUT
FEATURES PROVIDED: HERMETICALLY SEALED AND MONOLITHIC AND ASYNCHRONOUS AND W/CLEAR AND W/DISABLE AND POSITIVE OUTPUTS AND LOW POWER AND W/ENABLE
III END ITEM IDENTIFICATION: AN/ASN-124 FSCM 35351
III PRECIOUS MATERIAL AND LOCATION: TERMINALS GOLD AND BODY GOLD
INCLOSURE CONFIGURATION: FLAT PACK
INCLOSURE MATERIAL: GLASS AND METAL
INPUT CIRCUIT PATTERN: 4 INPUT
MAXIMUM POWER DISSIPATION RATING: 88.0 MILLIWATTS
OPERATING TEMP RANGE: -55.0 TO 125.0 DEG CELSIUS
OUTPUT LOGIC FORM: TRANSISTOR-TRANSISTOR LOGIC
STORAGE TEMP RANGE: -65.0 TO 150.0 DEG CELSIUS
TERMINAL SURFACE TREATMENT: SOLDER
TERMINAL TYPE AND QUANTITY: 14 FLAT LEADS
TEST DATA DOCUMENT: 81349-MIL-
Related Searches:
615420-1
MICROCIRCUIT,DIGITAL
NSN, MFG P/N
5962010335515
NSN
5962-01-033-5515
MFG
RAYTHEON COMPANY DBA RAYTHEON
Description
(NON-CORE DATA) BIT QUANTITY: 8
BODY HEIGHT: 0.030 INCHES MINIMUM AND 0.070 INCHES MAXIMUM
BODY LENGTH: 0.280 INCHES MAXIMUM
BODY WIDTH: 0.120 INCHES MINIMUM AND 0.200 INCHES MAXIMUM
CASE OUTLINE SOURCE AND DESIGNATOR: F-3 MIL-M-38510
DESIGN FUNCTION AND QUANTITY: 1 SHIFT REGISTER, SERIAL IN, PARALLEL OUT
FEATURES PROVIDED: HERMETICALLY SEALED AND MONOLITHIC AND ASYNCHRONOUS AND W/CLEAR AND W/DISABLE AND POSITIVE OUTPUTS AND LOW POWER AND W/ENABLE
III END ITEM IDENTIFICATION: AN/ASN-124 FSCM 35351
III PRECIOUS MATERIAL AND LOCATION: TERMINALS GOLD AND BODY GOLD
INCLOSURE CONFIGURATION: FLAT PACK
INCLOSURE MATERIAL: GLASS AND METAL
INPUT CIRCUIT PATTERN: 4 INPUT
MAXIMUM POWER DISSIPATION RATING: 88.0 MILLIWATTS
OPERATING TEMP RANGE: -55.0 TO 125.0 DEG CELSIUS
OUTPUT LOGIC FORM: TRANSISTOR-TRANSISTOR LOGIC
STORAGE TEMP RANGE: -65.0 TO 150.0 DEG CELSIUS
TERMINAL SURFACE TREATMENT: SOLDER
TERMINAL TYPE AND QUANTITY: 14 FLAT LEADS
TEST DATA DOCUMENT: 81349-MIL-
Related Searches:
DM54L164AW/883B-16
MICROCIRCUIT,DIGITAL
NSN, MFG P/N
5962010335515
NSN
5962-01-033-5515
DM54L164AW/883B-16
MICROCIRCUIT,DIGITAL
NSN, MFG P/N
5962010335515
NSN
5962-01-033-5515
MFG
NATIONAL SEMICONDUCTOR CORPORATION
Description
(NON-CORE DATA) BIT QUANTITY: 8
BODY HEIGHT: 0.030 INCHES MINIMUM AND 0.070 INCHES MAXIMUM
BODY LENGTH: 0.280 INCHES MAXIMUM
BODY WIDTH: 0.120 INCHES MINIMUM AND 0.200 INCHES MAXIMUM
CASE OUTLINE SOURCE AND DESIGNATOR: F-3 MIL-M-38510
DESIGN FUNCTION AND QUANTITY: 1 SHIFT REGISTER, SERIAL IN, PARALLEL OUT
FEATURES PROVIDED: HERMETICALLY SEALED AND MONOLITHIC AND ASYNCHRONOUS AND W/CLEAR AND W/DISABLE AND POSITIVE OUTPUTS AND LOW POWER AND W/ENABLE
III END ITEM IDENTIFICATION: AN/ASN-124 FSCM 35351
III PRECIOUS MATERIAL AND LOCATION: TERMINALS GOLD AND BODY GOLD
INCLOSURE CONFIGURATION: FLAT PACK
INCLOSURE MATERIAL: GLASS AND METAL
INPUT CIRCUIT PATTERN: 4 INPUT
MAXIMUM POWER DISSIPATION RATING: 88.0 MILLIWATTS
OPERATING TEMP RANGE: -55.0 TO 125.0 DEG CELSIUS
OUTPUT LOGIC FORM: TRANSISTOR-TRANSISTOR LOGIC
STORAGE TEMP RANGE: -65.0 TO 150.0 DEG CELSIUS
TERMINAL SURFACE TREATMENT: SOLDER
TERMINAL TYPE AND QUANTITY: 14 FLAT LEADS
TEST DATA DOCUMENT: 81349-MIL-
Related Searches:
DM54L164W
MICROCIRCUIT,DIGITAL
NSN, MFG P/N
5962010335515
NSN
5962-01-033-5515
MFG
NATIONAL SEMICONDUCTOR CORP
Description
(NON-CORE DATA) BIT QUANTITY: 8
BODY HEIGHT: 0.030 INCHES MINIMUM AND 0.070 INCHES MAXIMUM
BODY LENGTH: 0.280 INCHES MAXIMUM
BODY WIDTH: 0.120 INCHES MINIMUM AND 0.200 INCHES MAXIMUM
CASE OUTLINE SOURCE AND DESIGNATOR: F-3 MIL-M-38510
DESIGN FUNCTION AND QUANTITY: 1 SHIFT REGISTER, SERIAL IN, PARALLEL OUT
FEATURES PROVIDED: HERMETICALLY SEALED AND MONOLITHIC AND ASYNCHRONOUS AND W/CLEAR AND W/DISABLE AND POSITIVE OUTPUTS AND LOW POWER AND W/ENABLE
III END ITEM IDENTIFICATION: AN/ASN-124 FSCM 35351
III PRECIOUS MATERIAL AND LOCATION: TERMINALS GOLD AND BODY GOLD
INCLOSURE CONFIGURATION: FLAT PACK
INCLOSURE MATERIAL: GLASS AND METAL
INPUT CIRCUIT PATTERN: 4 INPUT
MAXIMUM POWER DISSIPATION RATING: 88.0 MILLIWATTS
OPERATING TEMP RANGE: -55.0 TO 125.0 DEG CELSIUS
OUTPUT LOGIC FORM: TRANSISTOR-TRANSISTOR LOGIC
STORAGE TEMP RANGE: -65.0 TO 150.0 DEG CELSIUS
TERMINAL SURFACE TREATMENT: SOLDER
TERMINAL TYPE AND QUANTITY: 14 FLAT LEADS
TEST DATA DOCUMENT: 81349-MIL-
Related Searches:
DMS 85076B
MICROCIRCUIT,DIGITAL
NSN, MFG P/N
5962010335515
NSN
5962-01-033-5515
MFG
DLA LAND AND MARITIME
Description
(NON-CORE DATA) BIT QUANTITY: 8
BODY HEIGHT: 0.030 INCHES MINIMUM AND 0.070 INCHES MAXIMUM
BODY LENGTH: 0.280 INCHES MAXIMUM
BODY WIDTH: 0.120 INCHES MINIMUM AND 0.200 INCHES MAXIMUM
CASE OUTLINE SOURCE AND DESIGNATOR: F-3 MIL-M-38510
DESIGN FUNCTION AND QUANTITY: 1 SHIFT REGISTER, SERIAL IN, PARALLEL OUT
FEATURES PROVIDED: HERMETICALLY SEALED AND MONOLITHIC AND ASYNCHRONOUS AND W/CLEAR AND W/DISABLE AND POSITIVE OUTPUTS AND LOW POWER AND W/ENABLE
III END ITEM IDENTIFICATION: AN/ASN-124 FSCM 35351
III PRECIOUS MATERIAL AND LOCATION: TERMINALS GOLD AND BODY GOLD
INCLOSURE CONFIGURATION: FLAT PACK
INCLOSURE MATERIAL: GLASS AND METAL
INPUT CIRCUIT PATTERN: 4 INPUT
MAXIMUM POWER DISSIPATION RATING: 88.0 MILLIWATTS
OPERATING TEMP RANGE: -55.0 TO 125.0 DEG CELSIUS
OUTPUT LOGIC FORM: TRANSISTOR-TRANSISTOR LOGIC
STORAGE TEMP RANGE: -65.0 TO 150.0 DEG CELSIUS
TERMINAL SURFACE TREATMENT: SOLDER
TERMINAL TYPE AND QUANTITY: 14 FLAT LEADS
TEST DATA DOCUMENT: 81349-MIL-
Related Searches:
M38510/02802BDA
MICROCIRCUIT,DIGITAL
NSN, MFG P/N
5962010335515
NSN
5962-01-033-5515
MFG
MILITARY SPECIFICATIONS PROMULGATED BY MILITARY DEPARTMENTS/AGENCIES UNDER AUTHORITY OF DEFENSE STANDARDIZATION MANUAL 4120 3-M
Description
(NON-CORE DATA) BIT QUANTITY: 8
BODY HEIGHT: 0.030 INCHES MINIMUM AND 0.070 INCHES MAXIMUM
BODY LENGTH: 0.280 INCHES MAXIMUM
BODY WIDTH: 0.120 INCHES MINIMUM AND 0.200 INCHES MAXIMUM
CASE OUTLINE SOURCE AND DESIGNATOR: F-3 MIL-M-38510
DESIGN FUNCTION AND QUANTITY: 1 SHIFT REGISTER, SERIAL IN, PARALLEL OUT
FEATURES PROVIDED: HERMETICALLY SEALED AND MONOLITHIC AND ASYNCHRONOUS AND W/CLEAR AND W/DISABLE AND POSITIVE OUTPUTS AND LOW POWER AND W/ENABLE
III END ITEM IDENTIFICATION: AN/ASN-124 FSCM 35351
III PRECIOUS MATERIAL AND LOCATION: TERMINALS GOLD AND BODY GOLD
INCLOSURE CONFIGURATION: FLAT PACK
INCLOSURE MATERIAL: GLASS AND METAL
INPUT CIRCUIT PATTERN: 4 INPUT
MAXIMUM POWER DISSIPATION RATING: 88.0 MILLIWATTS
OPERATING TEMP RANGE: -55.0 TO 125.0 DEG CELSIUS
OUTPUT LOGIC FORM: TRANSISTOR-TRANSISTOR LOGIC
STORAGE TEMP RANGE: -65.0 TO 150.0 DEG CELSIUS
TERMINAL SURFACE TREATMENT: SOLDER
TERMINAL TYPE AND QUANTITY: 14 FLAT LEADS
TEST DATA DOCUMENT: 81349-MIL-
Related Searches:
SN54L164T
MICROCIRCUIT,DIGITAL
NSN, MFG P/N
5962010335515
NSN
5962-01-033-5515
MFG
TEXAS INSTRUMENTS INCORPORATED DBA TEXAS INSTRUMENTS DIV SEMICONDUCTOR GROUP
Description
(NON-CORE DATA) BIT QUANTITY: 8
BODY HEIGHT: 0.030 INCHES MINIMUM AND 0.070 INCHES MAXIMUM
BODY LENGTH: 0.280 INCHES MAXIMUM
BODY WIDTH: 0.120 INCHES MINIMUM AND 0.200 INCHES MAXIMUM
CASE OUTLINE SOURCE AND DESIGNATOR: F-3 MIL-M-38510
DESIGN FUNCTION AND QUANTITY: 1 SHIFT REGISTER, SERIAL IN, PARALLEL OUT
FEATURES PROVIDED: HERMETICALLY SEALED AND MONOLITHIC AND ASYNCHRONOUS AND W/CLEAR AND W/DISABLE AND POSITIVE OUTPUTS AND LOW POWER AND W/ENABLE
III END ITEM IDENTIFICATION: AN/ASN-124 FSCM 35351
III PRECIOUS MATERIAL AND LOCATION: TERMINALS GOLD AND BODY GOLD
INCLOSURE CONFIGURATION: FLAT PACK
INCLOSURE MATERIAL: GLASS AND METAL
INPUT CIRCUIT PATTERN: 4 INPUT
MAXIMUM POWER DISSIPATION RATING: 88.0 MILLIWATTS
OPERATING TEMP RANGE: -55.0 TO 125.0 DEG CELSIUS
OUTPUT LOGIC FORM: TRANSISTOR-TRANSISTOR LOGIC
STORAGE TEMP RANGE: -65.0 TO 150.0 DEG CELSIUS
TERMINAL SURFACE TREATMENT: SOLDER
TERMINAL TYPE AND QUANTITY: 14 FLAT LEADS
TEST DATA DOCUMENT: 81349-MIL-
Related Searches:
SNC54L164T-16
MICROCIRCUIT,DIGITAL
NSN, MFG P/N
5962010335515
NSN
5962-01-033-5515
MFG
TEXAS INSTRUMENTS INCORPORATED DBA TEXAS INSTRUMENTS DIV SEMICONDUCTOR GROUP
Description
(NON-CORE DATA) BIT QUANTITY: 8
BODY HEIGHT: 0.030 INCHES MINIMUM AND 0.070 INCHES MAXIMUM
BODY LENGTH: 0.280 INCHES MAXIMUM
BODY WIDTH: 0.120 INCHES MINIMUM AND 0.200 INCHES MAXIMUM
CASE OUTLINE SOURCE AND DESIGNATOR: F-3 MIL-M-38510
DESIGN FUNCTION AND QUANTITY: 1 SHIFT REGISTER, SERIAL IN, PARALLEL OUT
FEATURES PROVIDED: HERMETICALLY SEALED AND MONOLITHIC AND ASYNCHRONOUS AND W/CLEAR AND W/DISABLE AND POSITIVE OUTPUTS AND LOW POWER AND W/ENABLE
III END ITEM IDENTIFICATION: AN/ASN-124 FSCM 35351
III PRECIOUS MATERIAL AND LOCATION: TERMINALS GOLD AND BODY GOLD
INCLOSURE CONFIGURATION: FLAT PACK
INCLOSURE MATERIAL: GLASS AND METAL
INPUT CIRCUIT PATTERN: 4 INPUT
MAXIMUM POWER DISSIPATION RATING: 88.0 MILLIWATTS
OPERATING TEMP RANGE: -55.0 TO 125.0 DEG CELSIUS
OUTPUT LOGIC FORM: TRANSISTOR-TRANSISTOR LOGIC
STORAGE TEMP RANGE: -65.0 TO 150.0 DEG CELSIUS
TERMINAL SURFACE TREATMENT: SOLDER
TERMINAL TYPE AND QUANTITY: 14 FLAT LEADS
TEST DATA DOCUMENT: 81349-MIL-
Related Searches:
SNC54L164T16
MICROCIRCUIT,DIGITAL
NSN, MFG P/N
5962010335515
NSN
5962-01-033-5515
MFG
RENTEX EQUIPMENT CORP
Description
(NON-CORE DATA) BIT QUANTITY: 8
BODY HEIGHT: 0.030 INCHES MINIMUM AND 0.070 INCHES MAXIMUM
BODY LENGTH: 0.280 INCHES MAXIMUM
BODY WIDTH: 0.120 INCHES MINIMUM AND 0.200 INCHES MAXIMUM
CASE OUTLINE SOURCE AND DESIGNATOR: F-3 MIL-M-38510
DESIGN FUNCTION AND QUANTITY: 1 SHIFT REGISTER, SERIAL IN, PARALLEL OUT
FEATURES PROVIDED: HERMETICALLY SEALED AND MONOLITHIC AND ASYNCHRONOUS AND W/CLEAR AND W/DISABLE AND POSITIVE OUTPUTS AND LOW POWER AND W/ENABLE
III END ITEM IDENTIFICATION: AN/ASN-124 FSCM 35351
III PRECIOUS MATERIAL AND LOCATION: TERMINALS GOLD AND BODY GOLD
INCLOSURE CONFIGURATION: FLAT PACK
INCLOSURE MATERIAL: GLASS AND METAL
INPUT CIRCUIT PATTERN: 4 INPUT
MAXIMUM POWER DISSIPATION RATING: 88.0 MILLIWATTS
OPERATING TEMP RANGE: -55.0 TO 125.0 DEG CELSIUS
OUTPUT LOGIC FORM: TRANSISTOR-TRANSISTOR LOGIC
STORAGE TEMP RANGE: -65.0 TO 150.0 DEG CELSIUS
TERMINAL SURFACE TREATMENT: SOLDER
TERMINAL TYPE AND QUANTITY: 14 FLAT LEADS
TEST DATA DOCUMENT: 81349-MIL-
Related Searches:
SNJ54L164W
MICROCIRCUIT,DIGITAL
NSN, MFG P/N
5962010335515
NSN
5962-01-033-5515
MFG
TEXAS INSTRUMENTS INCORPORATED DBA TEXAS INSTRUMENTS DIV SEMICONDUCTOR GROUP
Description
(NON-CORE DATA) BIT QUANTITY: 8
BODY HEIGHT: 0.030 INCHES MINIMUM AND 0.070 INCHES MAXIMUM
BODY LENGTH: 0.280 INCHES MAXIMUM
BODY WIDTH: 0.120 INCHES MINIMUM AND 0.200 INCHES MAXIMUM
CASE OUTLINE SOURCE AND DESIGNATOR: F-3 MIL-M-38510
DESIGN FUNCTION AND QUANTITY: 1 SHIFT REGISTER, SERIAL IN, PARALLEL OUT
FEATURES PROVIDED: HERMETICALLY SEALED AND MONOLITHIC AND ASYNCHRONOUS AND W/CLEAR AND W/DISABLE AND POSITIVE OUTPUTS AND LOW POWER AND W/ENABLE
III END ITEM IDENTIFICATION: AN/ASN-124 FSCM 35351
III PRECIOUS MATERIAL AND LOCATION: TERMINALS GOLD AND BODY GOLD
INCLOSURE CONFIGURATION: FLAT PACK
INCLOSURE MATERIAL: GLASS AND METAL
INPUT CIRCUIT PATTERN: 4 INPUT
MAXIMUM POWER DISSIPATION RATING: 88.0 MILLIWATTS
OPERATING TEMP RANGE: -55.0 TO 125.0 DEG CELSIUS
OUTPUT LOGIC FORM: TRANSISTOR-TRANSISTOR LOGIC
STORAGE TEMP RANGE: -65.0 TO 150.0 DEG CELSIUS
TERMINAL SURFACE TREATMENT: SOLDER
TERMINAL TYPE AND QUANTITY: 14 FLAT LEADS
TEST DATA DOCUMENT: 81349-MIL-
Related Searches:
10525DMQB
MICROCIRCUIT,DIGITAL
NSN, MFG P/N
5962010335516
NSN
5962-01-033-5516
MFG
FAIRCHILD SEMICONDUCTOR CORP
Description
BODY HEIGHT: 0.140 INCHES MINIMUM AND 0.185 INCHES MAXIMUM
BODY LENGTH: 0.896 INCHES MAXIMUM
BODY WIDTH: 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM
CASE OUTLINE SOURCE AND DESIGNATOR: D-2 MIL-M-38510
DESIGN FUNCTION AND QUANTITY: 4 TRANSLATOR, LEVEL
FEATURES PROVIDED: HERMETICALLY SEALED AND MONOLITHIC AND NEGATIVE OUTPUTS AND SCHOTTKY AND W/TOTEM POLE OUTPUT AND HIGH SPEED
III END ITEM IDENTIFICATION: COUNTERMEASURES SET TYPE AN/TLQ-17A FSCM 72314
INCLOSURE CONFIGURATION: DUAL-IN-LINE
INCLOSURE MATERIAL: CERAMIC AND GLASS
INPUT CIRCUIT PATTERN: QUAD 2 INPUT
MAXIMUM POWER DISSIPATION RATING: 380.0 MILLIWATTS
OPERATING TEMP RANGE: -55.0 TO 125.0 DEG CELSIUS
OUTPUT LOGIC FORM: EMITTER-COUPLED LOGIC
STORAGE TEMP RANGE: -65.0 TO 150.0 DEG CELSIUS
TEST DATA DOCUMENT: 81349-MIL-STD-883 SPECIFICATION
