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5962-01-299-6398
20 Products
058-004692-002
MICROCIRCUIT,MEMORY
NSN, MFG P/N
5962012996398
NSN
5962-01-299-6398
MFG
NORTHROP GRUMMAN SYSTEMS CORPORATION DIV MULTIPLE
Description
(NON-CORE DATA) BIT QUANTITY: 16384
(NON-CORE DATA) WORD QUANTITY: 2048
BODY HEIGHT: 0.054 INCHES MINIMUM AND 0.088 INCHES MAXIMUM
BODY LENGTH: 0.540 INCHES MINIMUM AND 0.560 INCHES MAXIMUM
BODY WIDTH: 0.442 INCHES MINIMUM AND 0.458 INCHES MAXIMUM
FEATURES PROVIDED: ELECTROSTATIC SENSITIVE AND HERMETICALLY SEALED AND W/ENABLE AND BURN IN AND PROGRAMMABLE AND ERASABLE
INCLOSURE CONFIGURATION: LEADLESS FLAT PACK
INCLOSURE MATERIAL: CERAMIC
INPUT CIRCUIT PATTERN: 22 INPUT
MAXIMUM POWER DISSIPATION RATING: 788.0 MILLIWATTS
MEMORY DEVICE TYPE: ROM
OPERATING TEMP RANGE: -55.0 TO 125.0 DEG CELSIUS
OUTPUT LOGIC FORM: METAL OXIDE-SEMICONDUCTOR LOGIC
STORAGE TEMP RANGE: -65.0 TO 150.0 DEG CELSIUS
TERMINAL SURFACE TREATMENT: SOLDER
TERMINAL TYPE AND QUANTITY: 32 LEADLESS
TEST DATA DOCUMENT: 96906-MIL-STD-883 STANDARD
TIME RATING PER CHACTERISTIC: 250.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 250.00 NANOSECONDS MAXIMUM PROPAGATION DELAY
Related Searches:
AM2817A-25/BUC
MICROCIRCUIT,MEMORY
NSN, MFG P/N
5962012996398
NSN
5962-01-299-6398
MFG
ADVANCED MICRO DEVICES INC DBA A M D
Description
(NON-CORE DATA) BIT QUANTITY: 16384
(NON-CORE DATA) WORD QUANTITY: 2048
BODY HEIGHT: 0.054 INCHES MINIMUM AND 0.088 INCHES MAXIMUM
BODY LENGTH: 0.540 INCHES MINIMUM AND 0.560 INCHES MAXIMUM
BODY WIDTH: 0.442 INCHES MINIMUM AND 0.458 INCHES MAXIMUM
FEATURES PROVIDED: ELECTROSTATIC SENSITIVE AND HERMETICALLY SEALED AND W/ENABLE AND BURN IN AND PROGRAMMABLE AND ERASABLE
INCLOSURE CONFIGURATION: LEADLESS FLAT PACK
INCLOSURE MATERIAL: CERAMIC
INPUT CIRCUIT PATTERN: 22 INPUT
MAXIMUM POWER DISSIPATION RATING: 788.0 MILLIWATTS
MEMORY DEVICE TYPE: ROM
OPERATING TEMP RANGE: -55.0 TO 125.0 DEG CELSIUS
OUTPUT LOGIC FORM: METAL OXIDE-SEMICONDUCTOR LOGIC
STORAGE TEMP RANGE: -65.0 TO 150.0 DEG CELSIUS
TERMINAL SURFACE TREATMENT: SOLDER
TERMINAL TYPE AND QUANTITY: 32 LEADLESS
TEST DATA DOCUMENT: 96906-MIL-STD-883 STANDARD
TIME RATING PER CHACTERISTIC: 250.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 250.00 NANOSECONDS MAXIMUM PROPAGATION DELAY
Related Searches:
AT28C17-25LM/883
MICROCIRCUIT,MEMORY
NSN, MFG P/N
5962012996398
NSN
5962-01-299-6398
MFG
ATMEL CORPORATION
Description
(NON-CORE DATA) BIT QUANTITY: 16384
(NON-CORE DATA) WORD QUANTITY: 2048
BODY HEIGHT: 0.054 INCHES MINIMUM AND 0.088 INCHES MAXIMUM
BODY LENGTH: 0.540 INCHES MINIMUM AND 0.560 INCHES MAXIMUM
BODY WIDTH: 0.442 INCHES MINIMUM AND 0.458 INCHES MAXIMUM
FEATURES PROVIDED: ELECTROSTATIC SENSITIVE AND HERMETICALLY SEALED AND W/ENABLE AND BURN IN AND PROGRAMMABLE AND ERASABLE
INCLOSURE CONFIGURATION: LEADLESS FLAT PACK
INCLOSURE MATERIAL: CERAMIC
INPUT CIRCUIT PATTERN: 22 INPUT
MAXIMUM POWER DISSIPATION RATING: 788.0 MILLIWATTS
MEMORY DEVICE TYPE: ROM
OPERATING TEMP RANGE: -55.0 TO 125.0 DEG CELSIUS
OUTPUT LOGIC FORM: METAL OXIDE-SEMICONDUCTOR LOGIC
STORAGE TEMP RANGE: -65.0 TO 150.0 DEG CELSIUS
TERMINAL SURFACE TREATMENT: SOLDER
TERMINAL TYPE AND QUANTITY: 32 LEADLESS
TEST DATA DOCUMENT: 96906-MIL-STD-883 STANDARD
TIME RATING PER CHACTERISTIC: 250.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 250.00 NANOSECONDS MAXIMUM PROPAGATION DELAY
Related Searches:
G278424-852
MICROCIRCUIT,MEMORY
NSN, MFG P/N
5962012996398
NSN
5962-01-299-6398
MFG
RAYTHEON COMPANY DBA RAYTHEON
Description
(NON-CORE DATA) BIT QUANTITY: 16384
(NON-CORE DATA) WORD QUANTITY: 2048
BODY HEIGHT: 0.054 INCHES MINIMUM AND 0.088 INCHES MAXIMUM
BODY LENGTH: 0.540 INCHES MINIMUM AND 0.560 INCHES MAXIMUM
BODY WIDTH: 0.442 INCHES MINIMUM AND 0.458 INCHES MAXIMUM
FEATURES PROVIDED: ELECTROSTATIC SENSITIVE AND HERMETICALLY SEALED AND W/ENABLE AND BURN IN AND PROGRAMMABLE AND ERASABLE
INCLOSURE CONFIGURATION: LEADLESS FLAT PACK
INCLOSURE MATERIAL: CERAMIC
INPUT CIRCUIT PATTERN: 22 INPUT
MAXIMUM POWER DISSIPATION RATING: 788.0 MILLIWATTS
MEMORY DEVICE TYPE: ROM
OPERATING TEMP RANGE: -55.0 TO 125.0 DEG CELSIUS
OUTPUT LOGIC FORM: METAL OXIDE-SEMICONDUCTOR LOGIC
STORAGE TEMP RANGE: -65.0 TO 150.0 DEG CELSIUS
TERMINAL SURFACE TREATMENT: SOLDER
TERMINAL TYPE AND QUANTITY: 32 LEADLESS
TEST DATA DOCUMENT: 96906-MIL-STD-883 STANDARD
TIME RATING PER CHACTERISTIC: 250.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 250.00 NANOSECONDS MAXIMUM PROPAGATION DELAY
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MICROCIRCUIT,MEMORY
NSN, MFG P/N
5962012996398
NSN
5962-01-299-6398
MFG
SEEQ TECHNOLOGY INC
Description
(NON-CORE DATA) BIT QUANTITY: 16384
(NON-CORE DATA) WORD QUANTITY: 2048
BODY HEIGHT: 0.054 INCHES MINIMUM AND 0.088 INCHES MAXIMUM
BODY LENGTH: 0.540 INCHES MINIMUM AND 0.560 INCHES MAXIMUM
BODY WIDTH: 0.442 INCHES MINIMUM AND 0.458 INCHES MAXIMUM
FEATURES PROVIDED: ELECTROSTATIC SENSITIVE AND HERMETICALLY SEALED AND W/ENABLE AND BURN IN AND PROGRAMMABLE AND ERASABLE
INCLOSURE CONFIGURATION: LEADLESS FLAT PACK
INCLOSURE MATERIAL: CERAMIC
INPUT CIRCUIT PATTERN: 22 INPUT
MAXIMUM POWER DISSIPATION RATING: 788.0 MILLIWATTS
MEMORY DEVICE TYPE: ROM
OPERATING TEMP RANGE: -55.0 TO 125.0 DEG CELSIUS
OUTPUT LOGIC FORM: METAL OXIDE-SEMICONDUCTOR LOGIC
STORAGE TEMP RANGE: -65.0 TO 150.0 DEG CELSIUS
TERMINAL SURFACE TREATMENT: SOLDER
TERMINAL TYPE AND QUANTITY: 32 LEADLESS
TEST DATA DOCUMENT: 96906-MIL-STD-883 STANDARD
TIME RATING PER CHACTERISTIC: 250.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 250.00 NANOSECONDS MAXIMUM PROPAGATION DELAY
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ROM/PROM
MICROCIRCUIT,MEMORY
NSN, MFG P/N
5962012996398
NSN
5962-01-299-6398
MFG
DLA LAND AND MARITIME
Description
(NON-CORE DATA) BIT QUANTITY: 16384
(NON-CORE DATA) WORD QUANTITY: 2048
BODY HEIGHT: 0.054 INCHES MINIMUM AND 0.088 INCHES MAXIMUM
BODY LENGTH: 0.540 INCHES MINIMUM AND 0.560 INCHES MAXIMUM
BODY WIDTH: 0.442 INCHES MINIMUM AND 0.458 INCHES MAXIMUM
FEATURES PROVIDED: ELECTROSTATIC SENSITIVE AND HERMETICALLY SEALED AND W/ENABLE AND BURN IN AND PROGRAMMABLE AND ERASABLE
INCLOSURE CONFIGURATION: LEADLESS FLAT PACK
INCLOSURE MATERIAL: CERAMIC
INPUT CIRCUIT PATTERN: 22 INPUT
MAXIMUM POWER DISSIPATION RATING: 788.0 MILLIWATTS
MEMORY DEVICE TYPE: ROM
OPERATING TEMP RANGE: -55.0 TO 125.0 DEG CELSIUS
OUTPUT LOGIC FORM: METAL OXIDE-SEMICONDUCTOR LOGIC
STORAGE TEMP RANGE: -65.0 TO 150.0 DEG CELSIUS
TERMINAL SURFACE TREATMENT: SOLDER
TERMINAL TYPE AND QUANTITY: 32 LEADLESS
TEST DATA DOCUMENT: 96906-MIL-STD-883 STANDARD
TIME RATING PER CHACTERISTIC: 250.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 250.00 NANOSECONDS MAXIMUM PROPAGATION DELAY
Related Searches:
M38510/37002B2A
MICROCIRCUIT,DIGITAL
NSN, MFG P/N
5962012996399
NSN
5962-01-299-6399
MFG
MILITARY SPECIFICATIONS PROMULGATED BY MILITARY DEPARTMENTS/AGENCIES UNDER AUTHORITY OF DEFENSE STANDARDIZATION MANUAL 4120 3-M
Description
BODY HEIGHT: 0.060 INCHES MINIMUM AND 0.100 INCHES MAXIMUM
BODY LENGTH: 0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM
BODY WIDTH: 0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM
CASE OUTLINE SOURCE AND DESIGNATOR: C-2 MIL-M-38510
DEFINITIVE GOVERNMENT SPEC/STD REFERENCE: M38510/37002B2A
DESIGN FUNCTION AND QUANTITY: 3 GATE, NAND
FEATURES PROVIDED: HERMETICALLY SEALED AND BURN IN AND LOW POWER AND SCHOTTKY
INCLOSURE CONFIGURATION: LEADLESS FLAT PACK
INCLOSURE MATERIAL: CERAMIC
INPUT CIRCUIT PATTERN: TRIPLE 3 INPUT
MANUFACTURERS CODE: 81349
MAXIMUM POWER DISSIPATION RATING: 36.9 MILLIWATTS
NON-DEFINITIVE GOVERNMENT SPEC/STD REFERENCE: MIL-M-38510/370
NUCLEAR HARDNESS CRITICAL FEATURE: HARDENED
OPERATING TEMP RANGE: -55.0 TO 125.0 DEG CELSIUS
OUTPUT LOGIC FORM: TRANSISTOR-TRANSISTOR LOGIC
SPEC/STD CONTROLLING DATA:
SPECIAL FEATURES: NUCLEAR HARDNESS CRITICAL ITEMS
SPECIFICATION/STANDARD DATA: 81349-MIL-M-38510/370 GOVERNMENT SPECIFICATION
STORAGE TEMP RANGE
Related Searches:
M38510/37002B2B
MICROCIRCUIT,DIGITAL
NSN, MFG P/N
5962012996399
NSN
5962-01-299-6399
MFG
MILITARY SPECIFICATIONS PROMULGATED BY MILITARY DEPARTMENTS/AGENCIES UNDER AUTHORITY OF DEFENSE STANDARDIZATION MANUAL 4120 3-M
Description
BODY HEIGHT: 0.060 INCHES MINIMUM AND 0.100 INCHES MAXIMUM
BODY LENGTH: 0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM
BODY WIDTH: 0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM
CASE OUTLINE SOURCE AND DESIGNATOR: C-2 MIL-M-38510
DEFINITIVE GOVERNMENT SPEC/STD REFERENCE: M38510/37002B2A
DESIGN FUNCTION AND QUANTITY: 3 GATE, NAND
FEATURES PROVIDED: HERMETICALLY SEALED AND BURN IN AND LOW POWER AND SCHOTTKY
INCLOSURE CONFIGURATION: LEADLESS FLAT PACK
INCLOSURE MATERIAL: CERAMIC
INPUT CIRCUIT PATTERN: TRIPLE 3 INPUT
MANUFACTURERS CODE: 81349
MAXIMUM POWER DISSIPATION RATING: 36.9 MILLIWATTS
NON-DEFINITIVE GOVERNMENT SPEC/STD REFERENCE: MIL-M-38510/370
NUCLEAR HARDNESS CRITICAL FEATURE: HARDENED
OPERATING TEMP RANGE: -55.0 TO 125.0 DEG CELSIUS
OUTPUT LOGIC FORM: TRANSISTOR-TRANSISTOR LOGIC
SPEC/STD CONTROLLING DATA:
SPECIAL FEATURES: NUCLEAR HARDNESS CRITICAL ITEMS
SPECIFICATION/STANDARD DATA: 81349-MIL-M-38510/370 GOVERNMENT SPECIFICATION
STORAGE TEMP RANGE
Related Searches:
M38510/37002B2X
MICROCIRCUIT,DIGITAL
NSN, MFG P/N
5962012996399
NSN
5962-01-299-6399
MFG
MILITARY SPECIFICATIONS PROMULGATED BY MILITARY DEPARTMENTS/AGENCIES UNDER AUTHORITY OF DEFENSE STANDARDIZATION MANUAL 4120 3-M
Description
BODY HEIGHT: 0.060 INCHES MINIMUM AND 0.100 INCHES MAXIMUM
BODY LENGTH: 0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM
BODY WIDTH: 0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM
CASE OUTLINE SOURCE AND DESIGNATOR: C-2 MIL-M-38510
DEFINITIVE GOVERNMENT SPEC/STD REFERENCE: M38510/37002B2A
DESIGN FUNCTION AND QUANTITY: 3 GATE, NAND
FEATURES PROVIDED: HERMETICALLY SEALED AND BURN IN AND LOW POWER AND SCHOTTKY
INCLOSURE CONFIGURATION: LEADLESS FLAT PACK
INCLOSURE MATERIAL: CERAMIC
INPUT CIRCUIT PATTERN: TRIPLE 3 INPUT
MANUFACTURERS CODE: 81349
MAXIMUM POWER DISSIPATION RATING: 36.9 MILLIWATTS
NON-DEFINITIVE GOVERNMENT SPEC/STD REFERENCE: MIL-M-38510/370
NUCLEAR HARDNESS CRITICAL FEATURE: HARDENED
OPERATING TEMP RANGE: -55.0 TO 125.0 DEG CELSIUS
OUTPUT LOGIC FORM: TRANSISTOR-TRANSISTOR LOGIC
SPEC/STD CONTROLLING DATA:
SPECIAL FEATURES: NUCLEAR HARDNESS CRITICAL ITEMS
SPECIFICATION/STANDARD DATA: 81349-MIL-M-38510/370 GOVERNMENT SPECIFICATION
STORAGE TEMP RANGE
Related Searches:
168990-21
MICROCIRCUIT,DIGITAL
NSN, MFG P/N
5962012996400
NSN
5962-01-299-6400
MFG
GE AVIATION SYSTEMS LLC
Description
(NON-CORE DATA) BIT QUANTITY: 65536
(NON-CORE DATA) WORD QUANTITY: 8192
BODY HEIGHT: 0.060 INCHES MINIMUM AND 0.120 INCHES MAXIMUM
BODY LENGTH: 0.540 INCHES MINIMUM AND 0.560 INCHES MAXIMUM
BODY WIDTH: 0.442 INCHES MINIMUM AND 0.458 INCHES MAXIMUM
CASE OUTLINE SOURCE AND DESIGNATOR: C-12 MIL-M-38510
FEATURES PROVIDED: HERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND PROGRAMMABLE AND ULTRAVIOLET ERASABLE AND W/ENABLE AND ELECTROSTATIC SENSITIVE
INCLOSURE CONFIGURATION: LEADLESS FLAT PACK
INCLOSURE MATERIAL: CERAMIC
INPUT CIRCUIT PATTERN: 16 INPUT
MAXIMUM POWER DISSIPATION RATING: 1.0 WATTS
OPERATING TEMP RANGE: -55.0 TO 125.0 DEG CELSIUS
OUTPUT LOGIC FORM: N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC
STORAGE TEMP RANGE: -65.0 TO 150.0 DEG CELSIUS
TEST DATA DOCUMENT: 96906-MIL-STD-883 STANDARD
TIME RATING PER CHACTERISTIC: 250.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 250.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL O
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MICROCIRCUIT,DIGITAL
NSN, MFG P/N
5962012996400
NSN
5962-01-299-6400
MFG
GE AVIATION SYSTEMS LLC
Description
(NON-CORE DATA) BIT QUANTITY: 65536
(NON-CORE DATA) WORD QUANTITY: 8192
BODY HEIGHT: 0.060 INCHES MINIMUM AND 0.120 INCHES MAXIMUM
BODY LENGTH: 0.540 INCHES MINIMUM AND 0.560 INCHES MAXIMUM
BODY WIDTH: 0.442 INCHES MINIMUM AND 0.458 INCHES MAXIMUM
CASE OUTLINE SOURCE AND DESIGNATOR: C-12 MIL-M-38510
FEATURES PROVIDED: HERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND PROGRAMMABLE AND ULTRAVIOLET ERASABLE AND W/ENABLE AND ELECTROSTATIC SENSITIVE
INCLOSURE CONFIGURATION: LEADLESS FLAT PACK
INCLOSURE MATERIAL: CERAMIC
INPUT CIRCUIT PATTERN: 16 INPUT
MAXIMUM POWER DISSIPATION RATING: 1.0 WATTS
OPERATING TEMP RANGE: -55.0 TO 125.0 DEG CELSIUS
OUTPUT LOGIC FORM: N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC
STORAGE TEMP RANGE: -65.0 TO 150.0 DEG CELSIUS
TEST DATA DOCUMENT: 96906-MIL-STD-883 STANDARD
TIME RATING PER CHACTERISTIC: 250.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 250.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL O
Related Searches:
8200504ZA
MICROCIRCUIT,DIGITAL
NSN, MFG P/N
5962012996400
NSN
5962-01-299-6400
MFG
DLA LAND AND MARITIME OPNS SUPPORT GROUP DOCUMENT CONTROL UNIT
Description
(NON-CORE DATA) BIT QUANTITY: 65536
(NON-CORE DATA) WORD QUANTITY: 8192
BODY HEIGHT: 0.060 INCHES MINIMUM AND 0.120 INCHES MAXIMUM
BODY LENGTH: 0.540 INCHES MINIMUM AND 0.560 INCHES MAXIMUM
BODY WIDTH: 0.442 INCHES MINIMUM AND 0.458 INCHES MAXIMUM
CASE OUTLINE SOURCE AND DESIGNATOR: C-12 MIL-M-38510
FEATURES PROVIDED: HERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND PROGRAMMABLE AND ULTRAVIOLET ERASABLE AND W/ENABLE AND ELECTROSTATIC SENSITIVE
INCLOSURE CONFIGURATION: LEADLESS FLAT PACK
INCLOSURE MATERIAL: CERAMIC
INPUT CIRCUIT PATTERN: 16 INPUT
MAXIMUM POWER DISSIPATION RATING: 1.0 WATTS
OPERATING TEMP RANGE: -55.0 TO 125.0 DEG CELSIUS
OUTPUT LOGIC FORM: N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC
STORAGE TEMP RANGE: -65.0 TO 150.0 DEG CELSIUS
TEST DATA DOCUMENT: 96906-MIL-STD-883 STANDARD
TIME RATING PER CHACTERISTIC: 250.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 250.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL O
Related Searches:
AM2764A-25/BUA
MICROCIRCUIT,DIGITAL
NSN, MFG P/N
5962012996400
NSN
5962-01-299-6400
MFG
ADVANCED MICRO DEVICES INC DBA A M D
Description
(NON-CORE DATA) BIT QUANTITY: 65536
(NON-CORE DATA) WORD QUANTITY: 8192
BODY HEIGHT: 0.060 INCHES MINIMUM AND 0.120 INCHES MAXIMUM
BODY LENGTH: 0.540 INCHES MINIMUM AND 0.560 INCHES MAXIMUM
BODY WIDTH: 0.442 INCHES MINIMUM AND 0.458 INCHES MAXIMUM
CASE OUTLINE SOURCE AND DESIGNATOR: C-12 MIL-M-38510
FEATURES PROVIDED: HERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND PROGRAMMABLE AND ULTRAVIOLET ERASABLE AND W/ENABLE AND ELECTROSTATIC SENSITIVE
INCLOSURE CONFIGURATION: LEADLESS FLAT PACK
INCLOSURE MATERIAL: CERAMIC
INPUT CIRCUIT PATTERN: 16 INPUT
MAXIMUM POWER DISSIPATION RATING: 1.0 WATTS
OPERATING TEMP RANGE: -55.0 TO 125.0 DEG CELSIUS
OUTPUT LOGIC FORM: N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC
STORAGE TEMP RANGE: -65.0 TO 150.0 DEG CELSIUS
TEST DATA DOCUMENT: 96906-MIL-STD-883 STANDARD
TIME RATING PER CHACTERISTIC: 250.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 250.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL O
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MICROCIRCUIT,DIGITAL
NSN, MFG P/N
5962012996400
NSN
5962-01-299-6400
ROM/PROM FAMILY 155
MICROCIRCUIT,DIGITAL
NSN, MFG P/N
5962012996400
NSN
5962-01-299-6400
MFG
DLA LAND AND MARITIME
Description
(NON-CORE DATA) BIT QUANTITY: 65536
(NON-CORE DATA) WORD QUANTITY: 8192
BODY HEIGHT: 0.060 INCHES MINIMUM AND 0.120 INCHES MAXIMUM
BODY LENGTH: 0.540 INCHES MINIMUM AND 0.560 INCHES MAXIMUM
BODY WIDTH: 0.442 INCHES MINIMUM AND 0.458 INCHES MAXIMUM
CASE OUTLINE SOURCE AND DESIGNATOR: C-12 MIL-M-38510
FEATURES PROVIDED: HERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND PROGRAMMABLE AND ULTRAVIOLET ERASABLE AND W/ENABLE AND ELECTROSTATIC SENSITIVE
INCLOSURE CONFIGURATION: LEADLESS FLAT PACK
INCLOSURE MATERIAL: CERAMIC
INPUT CIRCUIT PATTERN: 16 INPUT
MAXIMUM POWER DISSIPATION RATING: 1.0 WATTS
OPERATING TEMP RANGE: -55.0 TO 125.0 DEG CELSIUS
OUTPUT LOGIC FORM: N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC
STORAGE TEMP RANGE: -65.0 TO 150.0 DEG CELSIUS
TEST DATA DOCUMENT: 96906-MIL-STD-883 STANDARD
TIME RATING PER CHACTERISTIC: 250.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 250.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL O
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168990-20
MICROCIRCUIT,MEMORY
NSN, MFG P/N
5962012996401
NSN
5962-01-299-6401
MFG
GE AVIATION SYSTEMS LLC
Description
(NON-CORE DATA) BIT QUANTITY: 65536
(NON-CORE DATA) WORD QUANTITY: 8192
BODY HEIGHT: 0.060 INCHES MINIMUM AND 0.120 INCHES MAXIMUM
BODY LENGTH: 0.540 INCHES MINIMUM AND 0.560 INCHES MAXIMUM
BODY WIDTH: 0.442 INCHES MINIMUM AND 0.458 INCHES MAXIMUM
CASE OUTLINE SOURCE AND DESIGNATOR: C-12 MIL-M-38510
FEATURES PROVIDED: HERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND PROGRAMMABLE AND ULTRAVIOLET ERASABLE AND W/ENABLE AND ELECTROSTATIC SENSITIVE
INCLOSURE CONFIGURATION: LEADLESS FLAT PACK
INCLOSURE MATERIAL: CERAMIC
INPUT CIRCUIT PATTERN: 16 INPUT
MAXIMUM POWER DISSIPATION RATING: 1.0 WATTS
MEMORY DEVICE TYPE: ROM
OPERATING TEMP RANGE: -55.0 TO 125.0 DEG CELSIUS
OUTPUT LOGIC FORM: N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC
STORAGE TEMP RANGE: -65.0 TO 150.0 DEG CELSIUS
TERMINAL SURFACE TREATMENT: SOLDER
TERMINAL TYPE AND QUANTITY: 32 LEADLESS
TEST DATA DOCUMENT: 96906-MIL-STD-883 STANDARD
TIME RATING PER CHACTERISTIC: 250.00 NANOSECONDS MAXIMUM PROPAGATION DEL
Related Searches:
547975-05-01
MICROCIRCUIT,MEMORY
NSN, MFG P/N
5962012996401
NSN
5962-01-299-6401
MFG
GE AVIATION SYSTEMS LLC
Description
(NON-CORE DATA) BIT QUANTITY: 65536
(NON-CORE DATA) WORD QUANTITY: 8192
BODY HEIGHT: 0.060 INCHES MINIMUM AND 0.120 INCHES MAXIMUM
BODY LENGTH: 0.540 INCHES MINIMUM AND 0.560 INCHES MAXIMUM
BODY WIDTH: 0.442 INCHES MINIMUM AND 0.458 INCHES MAXIMUM
CASE OUTLINE SOURCE AND DESIGNATOR: C-12 MIL-M-38510
FEATURES PROVIDED: HERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND PROGRAMMABLE AND ULTRAVIOLET ERASABLE AND W/ENABLE AND ELECTROSTATIC SENSITIVE
INCLOSURE CONFIGURATION: LEADLESS FLAT PACK
INCLOSURE MATERIAL: CERAMIC
INPUT CIRCUIT PATTERN: 16 INPUT
MAXIMUM POWER DISSIPATION RATING: 1.0 WATTS
MEMORY DEVICE TYPE: ROM
OPERATING TEMP RANGE: -55.0 TO 125.0 DEG CELSIUS
OUTPUT LOGIC FORM: N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC
STORAGE TEMP RANGE: -65.0 TO 150.0 DEG CELSIUS
TERMINAL SURFACE TREATMENT: SOLDER
TERMINAL TYPE AND QUANTITY: 32 LEADLESS
TEST DATA DOCUMENT: 96906-MIL-STD-883 STANDARD
TIME RATING PER CHACTERISTIC: 250.00 NANOSECONDS MAXIMUM PROPAGATION DEL
Related Searches:
8200504ZA
MICROCIRCUIT,MEMORY
NSN, MFG P/N
5962012996401
NSN
5962-01-299-6401
MFG
DLA LAND AND MARITIME OPNS SUPPORT GROUP DOCUMENT CONTROL UNIT
Description
(NON-CORE DATA) BIT QUANTITY: 65536
(NON-CORE DATA) WORD QUANTITY: 8192
BODY HEIGHT: 0.060 INCHES MINIMUM AND 0.120 INCHES MAXIMUM
BODY LENGTH: 0.540 INCHES MINIMUM AND 0.560 INCHES MAXIMUM
BODY WIDTH: 0.442 INCHES MINIMUM AND 0.458 INCHES MAXIMUM
CASE OUTLINE SOURCE AND DESIGNATOR: C-12 MIL-M-38510
FEATURES PROVIDED: HERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND PROGRAMMABLE AND ULTRAVIOLET ERASABLE AND W/ENABLE AND ELECTROSTATIC SENSITIVE
INCLOSURE CONFIGURATION: LEADLESS FLAT PACK
INCLOSURE MATERIAL: CERAMIC
INPUT CIRCUIT PATTERN: 16 INPUT
MAXIMUM POWER DISSIPATION RATING: 1.0 WATTS
MEMORY DEVICE TYPE: ROM
OPERATING TEMP RANGE: -55.0 TO 125.0 DEG CELSIUS
OUTPUT LOGIC FORM: N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC
STORAGE TEMP RANGE: -65.0 TO 150.0 DEG CELSIUS
TERMINAL SURFACE TREATMENT: SOLDER
TERMINAL TYPE AND QUANTITY: 32 LEADLESS
TEST DATA DOCUMENT: 96906-MIL-STD-883 STANDARD
TIME RATING PER CHACTERISTIC: 250.00 NANOSECONDS MAXIMUM PROPAGATION DEL
Related Searches:
AM2764A-25/BUA
MICROCIRCUIT,MEMORY
NSN, MFG P/N
5962012996401
NSN
5962-01-299-6401
MFG
ADVANCED MICRO DEVICES INC DBA A M D
Description
(NON-CORE DATA) BIT QUANTITY: 65536
(NON-CORE DATA) WORD QUANTITY: 8192
BODY HEIGHT: 0.060 INCHES MINIMUM AND 0.120 INCHES MAXIMUM
BODY LENGTH: 0.540 INCHES MINIMUM AND 0.560 INCHES MAXIMUM
BODY WIDTH: 0.442 INCHES MINIMUM AND 0.458 INCHES MAXIMUM
CASE OUTLINE SOURCE AND DESIGNATOR: C-12 MIL-M-38510
FEATURES PROVIDED: HERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND PROGRAMMABLE AND ULTRAVIOLET ERASABLE AND W/ENABLE AND ELECTROSTATIC SENSITIVE
INCLOSURE CONFIGURATION: LEADLESS FLAT PACK
INCLOSURE MATERIAL: CERAMIC
INPUT CIRCUIT PATTERN: 16 INPUT
MAXIMUM POWER DISSIPATION RATING: 1.0 WATTS
MEMORY DEVICE TYPE: ROM
OPERATING TEMP RANGE: -55.0 TO 125.0 DEG CELSIUS
OUTPUT LOGIC FORM: N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC
STORAGE TEMP RANGE: -65.0 TO 150.0 DEG CELSIUS
TERMINAL SURFACE TREATMENT: SOLDER
TERMINAL TYPE AND QUANTITY: 32 LEADLESS
TEST DATA DOCUMENT: 96906-MIL-STD-883 STANDARD
TIME RATING PER CHACTERISTIC: 250.00 NANOSECONDS MAXIMUM PROPAGATION DEL
Related Searches:
ROM/PROM FAMILY 155
MICROCIRCUIT,MEMORY
NSN, MFG P/N
5962012996401
NSN
5962-01-299-6401
ROM/PROM FAMILY 155
MICROCIRCUIT,MEMORY
NSN, MFG P/N
5962012996401
NSN
5962-01-299-6401
MFG
DLA LAND AND MARITIME
Description
(NON-CORE DATA) BIT QUANTITY: 65536
(NON-CORE DATA) WORD QUANTITY: 8192
BODY HEIGHT: 0.060 INCHES MINIMUM AND 0.120 INCHES MAXIMUM
BODY LENGTH: 0.540 INCHES MINIMUM AND 0.560 INCHES MAXIMUM
BODY WIDTH: 0.442 INCHES MINIMUM AND 0.458 INCHES MAXIMUM
CASE OUTLINE SOURCE AND DESIGNATOR: C-12 MIL-M-38510
FEATURES PROVIDED: HERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND PROGRAMMABLE AND ULTRAVIOLET ERASABLE AND W/ENABLE AND ELECTROSTATIC SENSITIVE
INCLOSURE CONFIGURATION: LEADLESS FLAT PACK
INCLOSURE MATERIAL: CERAMIC
INPUT CIRCUIT PATTERN: 16 INPUT
MAXIMUM POWER DISSIPATION RATING: 1.0 WATTS
MEMORY DEVICE TYPE: ROM
OPERATING TEMP RANGE: -55.0 TO 125.0 DEG CELSIUS
OUTPUT LOGIC FORM: N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC
STORAGE TEMP RANGE: -65.0 TO 150.0 DEG CELSIUS
TERMINAL SURFACE TREATMENT: SOLDER
TERMINAL TYPE AND QUANTITY: 32 LEADLESS
TEST DATA DOCUMENT: 96906-MIL-STD-883 STANDARD
TIME RATING PER CHACTERISTIC: 250.00 NANOSECONDS MAXIMUM PROPAGATION DEL
Related Searches:
104312-001
MICROCIRCUIT,DIGITAL
NSN, MFG P/N
5962012996402
NSN
5962-01-299-6402
MFG
AERO SYSTEMS ENGINEERING INC.
Description
BODY HEIGHT: 0.180 INCHES MAXIMUM
BODY LENGTH: 0.930 INCHES MINIMUM AND 0.975 INCHES MAXIMUM
BODY WIDTH: 0.245 INCHES MINIMUM AND 0.300 INCHES MAXIMUM
DESIGN FUNCTION AND QUANTITY: 8 FLIP-FLOP, EDGE TRIGGERED, D-TYPE
FEATURES PROVIDED: HERMETICALLY SEALED AND BURN IN AND HIGH SPEED AND 3-STATE OUTPUT AND W/CLOCK
III END ITEM IDENTIFICATION: 4920-01-187-4068 TEST SYSTEM,AUT
INCLOSURE CONFIGURATION: DUAL-IN-LINE
INCLOSURE MATERIAL: CERAMIC
INPUT CIRCUIT PATTERN: 10 INPUT
OPERATING TEMP RANGE: -55.0 TO 125.0 DEG CELSIUS
OUTPUT LOGIC FORM: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
STORAGE TEMP RANGE: -65.0 TO 150.0 DEG CELSIUS
TERMINAL SURFACE TREATMENT: SOLDER
TERMINAL TYPE AND QUANTITY: 20 PRINTED CIRCUIT
TEST DATA DOCUMENT: 96906-MIL-STD-883 STANDARD
TIME RATING PER CHACTERISTIC: 400.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 400.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT
VOLTAGE RATING AND TYPE PE
