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5962-01-291-5565

20 Products

717801445-001

MICROCIRCUIT,DIGITAL

NSN, MFG P/N

5962012915565

NSN

5962-01-291-5565

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717801445-001

MICROCIRCUIT,DIGITAL

NSN, MFG P/N

5962012915565

NSN

5962-01-291-5565

MFG

LOCKHEED MARTIN CORPORATION DBA LOCKHEED MARTIN

Description

BODY HEIGHT: 0.125 INCHES MAXIMUM
BODY LENGTH: 0.730 INCHES MAXIMUM
BODY WIDTH: 0.730 INCHES MAXIMUM
DESIGN FUNCTION AND QUANTITY: 1 AMPLIFIER, PREAMPLIFIER
FEATURES PROVIDED: ELECTROSTATIC SENSITIVE AND HYBRID
INCLOSURE CONFIGURATION: LEADLESS FLAT PACK
INCLOSURE MATERIAL: CERAMIC
OPERATING TEMP RANGE: -50.0 TO 125.0 DEG CELSIUS
STORAGE TEMP RANGE: -65.0 TO 150.0 DEG CELSIUS
TERMINAL SURFACE TREATMENT: SOLDER
TERMINAL TYPE AND QUANTITY: 64 LEADLESS
VOLTAGE RATING AND TYPE PER CHARACTERISTIC: 5.0 VOLTS MAXIMUM POWER SOURCE

Z8581

MICROCIRCUIT,DIGITAL

NSN, MFG P/N

5962012915018

NSN

5962-01-291-5018

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Z8581

MICROCIRCUIT,DIGITAL

NSN, MFG P/N

5962012915018

NSN

5962-01-291-5018

MFG

ZILOG INC

Description

BODY HEIGHT: 0.064 INCHES MINIMUM AND 0.100 INCHES MAXIMUM
BODY LENGTH: 0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM
BODY WIDTH: 0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM
CASE OUTLINE SOURCE AND DESIGNATOR: C-2 MIL-M-38510
DEFINITIVE GOVERNMENT SPEC/STD REFERENCE: 5962-87526012A
DESIGN FUNCTION AND QUANTITY: 1 CONTROL AND 1 GENERATOR, CLOCK
FEATURES PROVIDED: MONOLITHIC AND HERMETICALLY SEALED AND W/CLOCK
INCLOSURE CONFIGURATION: LEADLESS FLAT PACK
INCLOSURE MATERIAL: CERAMIC
INPUT CIRCUIT PATTERN: 8 INPUT
MANUFACTURERS CODE: 67268
MAXIMUM POWER DISSIPATION RATING: 1.5 WATTS
NON-DEFINITIVE GOVERNMENT SPEC/STD REFERENCE: 5962-87526
OPERATING TEMP RANGE: -55.0 TO 125.0 DEG CELSIUS
OUTPUT LOGIC FORM: N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC
SPEC/STD CONTROLLING DATA:
STORAGE TEMP RANGE: -65.0 TO 150.0 DEG CELSIUS
TERMINAL SURFACE TREATMENT: SOLDER
TERMINAL TYPE AND QUANTITY: 20 LEADLESS
TEST DATA DOCUMENT: 96906-MIL-STD-883 STANDARD
VOLTAGE RATING A

5962-85155

MICROCIRCUIT,MEMORY

NSN, MFG P/N

5962012915019

NSN

5962-01-291-5019

View More Info

5962-85155

MICROCIRCUIT,MEMORY

NSN, MFG P/N

5962012915019

NSN

5962-01-291-5019

MFG

DLA LAND AND MARITIME OPNS SUPPORT GROUP DOCUMENT CONTROL UNIT

Description

BODY HEIGHT: 0.060 INCHES MINIMUM AND 0.100 INCHES MAXIMUM
BODY LENGTH: 0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM
BODY WIDTH: 0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM
CASE OUTLINE SOURCE AND DESIGNATOR: C-2 MIL-M-38510
CURRENT RATING PER CHARACTERISTIC: 12.00 MILLIAMPERES MAXIMUM OUTPUT
DEFINITIVE GOVERNMENT SPEC/STD REFERENCE: 5962-85155092A
FEATURES PROVIDED: HERMETICALLY SEALED AND BURN IN AND BIPOLAR AND PROGRAMMABLE
INCLOSURE CONFIGURATION: LEADED CHIP CARRIER
INCLOSURE MATERIAL: CERAMIC
INPUT CIRCUIT PATTERN: 16 INPUT
MANUFACTURERS CODE: 67268
MAXIMUM POWER DISSIPATION RATING: 1.2 WATTS
MEMORY DEVICE TYPE: PAL
NON-DEFINITIVE GOVERNMENT SPEC/STD REFERENCE: 5962-85155
OPERATING TEMP RANGE: -55.0 TO 125.0 DEG CELSIUS
OUTPUT LOGIC FORM: BIPOLAR METAL-OXIDE SEMICONDUCTOR
SPEC/STD CONTROLLING DATA:
STORAGE TEMP RANGE: -65.0 TO 150.0 DEG CELSIUS
TERMINAL SURFACE TREATMENT: SOLDER
TERMINAL TYPE AND QUANTITY: 20 PIN
TEST DATA DOCUMENT: 96906-M

5962-85155092A

MICROCIRCUIT,MEMORY

NSN, MFG P/N

5962012915019

NSN

5962-01-291-5019

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5962-85155092A

MICROCIRCUIT,MEMORY

NSN, MFG P/N

5962012915019

NSN

5962-01-291-5019

MFG

DLA LAND AND MARITIME OPNS SUPPORT GROUP DOCUMENT CONTROL UNIT

Description

BODY HEIGHT: 0.060 INCHES MINIMUM AND 0.100 INCHES MAXIMUM
BODY LENGTH: 0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM
BODY WIDTH: 0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM
CASE OUTLINE SOURCE AND DESIGNATOR: C-2 MIL-M-38510
CURRENT RATING PER CHARACTERISTIC: 12.00 MILLIAMPERES MAXIMUM OUTPUT
DEFINITIVE GOVERNMENT SPEC/STD REFERENCE: 5962-85155092A
FEATURES PROVIDED: HERMETICALLY SEALED AND BURN IN AND BIPOLAR AND PROGRAMMABLE
INCLOSURE CONFIGURATION: LEADED CHIP CARRIER
INCLOSURE MATERIAL: CERAMIC
INPUT CIRCUIT PATTERN: 16 INPUT
MANUFACTURERS CODE: 67268
MAXIMUM POWER DISSIPATION RATING: 1.2 WATTS
MEMORY DEVICE TYPE: PAL
NON-DEFINITIVE GOVERNMENT SPEC/STD REFERENCE: 5962-85155
OPERATING TEMP RANGE: -55.0 TO 125.0 DEG CELSIUS
OUTPUT LOGIC FORM: BIPOLAR METAL-OXIDE SEMICONDUCTOR
SPEC/STD CONTROLLING DATA:
STORAGE TEMP RANGE: -65.0 TO 150.0 DEG CELSIUS
TERMINAL SURFACE TREATMENT: SOLDER
TERMINAL TYPE AND QUANTITY: 20 PIN
TEST DATA DOCUMENT: 96906-M

5962-85155092B

MICROCIRCUIT,MEMORY

NSN, MFG P/N

5962012915019

NSN

5962-01-291-5019

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5962-85155092B

MICROCIRCUIT,MEMORY

NSN, MFG P/N

5962012915019

NSN

5962-01-291-5019

MFG

DLA LAND AND MARITIME OPNS SUPPORT GROUP DOCUMENT CONTROL UNIT

Description

BODY HEIGHT: 0.060 INCHES MINIMUM AND 0.100 INCHES MAXIMUM
BODY LENGTH: 0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM
BODY WIDTH: 0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM
CASE OUTLINE SOURCE AND DESIGNATOR: C-2 MIL-M-38510
CURRENT RATING PER CHARACTERISTIC: 12.00 MILLIAMPERES MAXIMUM OUTPUT
DEFINITIVE GOVERNMENT SPEC/STD REFERENCE: 5962-85155092A
FEATURES PROVIDED: HERMETICALLY SEALED AND BURN IN AND BIPOLAR AND PROGRAMMABLE
INCLOSURE CONFIGURATION: LEADED CHIP CARRIER
INCLOSURE MATERIAL: CERAMIC
INPUT CIRCUIT PATTERN: 16 INPUT
MANUFACTURERS CODE: 67268
MAXIMUM POWER DISSIPATION RATING: 1.2 WATTS
MEMORY DEVICE TYPE: PAL
NON-DEFINITIVE GOVERNMENT SPEC/STD REFERENCE: 5962-85155
OPERATING TEMP RANGE: -55.0 TO 125.0 DEG CELSIUS
OUTPUT LOGIC FORM: BIPOLAR METAL-OXIDE SEMICONDUCTOR
SPEC/STD CONTROLLING DATA:
STORAGE TEMP RANGE: -65.0 TO 150.0 DEG CELSIUS
TERMINAL SURFACE TREATMENT: SOLDER
TERMINAL TYPE AND QUANTITY: 20 PIN
TEST DATA DOCUMENT: 96906-M

5962-85155092X

MICROCIRCUIT,MEMORY

NSN, MFG P/N

5962012915019

NSN

5962-01-291-5019

View More Info

5962-85155092X

MICROCIRCUIT,MEMORY

NSN, MFG P/N

5962012915019

NSN

5962-01-291-5019

MFG

DLA LAND AND MARITIME OPNS SUPPORT GROUP DOCUMENT CONTROL UNIT

Description

BODY HEIGHT: 0.060 INCHES MINIMUM AND 0.100 INCHES MAXIMUM
BODY LENGTH: 0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM
BODY WIDTH: 0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM
CASE OUTLINE SOURCE AND DESIGNATOR: C-2 MIL-M-38510
CURRENT RATING PER CHARACTERISTIC: 12.00 MILLIAMPERES MAXIMUM OUTPUT
DEFINITIVE GOVERNMENT SPEC/STD REFERENCE: 5962-85155092A
FEATURES PROVIDED: HERMETICALLY SEALED AND BURN IN AND BIPOLAR AND PROGRAMMABLE
INCLOSURE CONFIGURATION: LEADED CHIP CARRIER
INCLOSURE MATERIAL: CERAMIC
INPUT CIRCUIT PATTERN: 16 INPUT
MANUFACTURERS CODE: 67268
MAXIMUM POWER DISSIPATION RATING: 1.2 WATTS
MEMORY DEVICE TYPE: PAL
NON-DEFINITIVE GOVERNMENT SPEC/STD REFERENCE: 5962-85155
OPERATING TEMP RANGE: -55.0 TO 125.0 DEG CELSIUS
OUTPUT LOGIC FORM: BIPOLAR METAL-OXIDE SEMICONDUCTOR
SPEC/STD CONTROLLING DATA:
STORAGE TEMP RANGE: -65.0 TO 150.0 DEG CELSIUS
TERMINAL SURFACE TREATMENT: SOLDER
TERMINAL TYPE AND QUANTITY: 20 PIN
TEST DATA DOCUMENT: 96906-M

85155092X

MICROCIRCUIT,MEMORY

NSN, MFG P/N

5962012915019

NSN

5962-01-291-5019

View More Info

85155092X

MICROCIRCUIT,MEMORY

NSN, MFG P/N

5962012915019

NSN

5962-01-291-5019

MFG

DLA LAND AND MARITIME

Description

BODY HEIGHT: 0.060 INCHES MINIMUM AND 0.100 INCHES MAXIMUM
BODY LENGTH: 0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM
BODY WIDTH: 0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM
CASE OUTLINE SOURCE AND DESIGNATOR: C-2 MIL-M-38510
CURRENT RATING PER CHARACTERISTIC: 12.00 MILLIAMPERES MAXIMUM OUTPUT
DEFINITIVE GOVERNMENT SPEC/STD REFERENCE: 5962-85155092A
FEATURES PROVIDED: HERMETICALLY SEALED AND BURN IN AND BIPOLAR AND PROGRAMMABLE
INCLOSURE CONFIGURATION: LEADED CHIP CARRIER
INCLOSURE MATERIAL: CERAMIC
INPUT CIRCUIT PATTERN: 16 INPUT
MANUFACTURERS CODE: 67268
MAXIMUM POWER DISSIPATION RATING: 1.2 WATTS
MEMORY DEVICE TYPE: PAL
NON-DEFINITIVE GOVERNMENT SPEC/STD REFERENCE: 5962-85155
OPERATING TEMP RANGE: -55.0 TO 125.0 DEG CELSIUS
OUTPUT LOGIC FORM: BIPOLAR METAL-OXIDE SEMICONDUCTOR
SPEC/STD CONTROLLING DATA:
STORAGE TEMP RANGE: -65.0 TO 150.0 DEG CELSIUS
TERMINAL SURFACE TREATMENT: SOLDER
TERMINAL TYPE AND QUANTITY: 20 PIN
TEST DATA DOCUMENT: 96906-M

PAL16L8DML/883B

MICROCIRCUIT,MEMORY

NSN, MFG P/N

5962012915019

NSN

5962-01-291-5019

View More Info

PAL16L8DML/883B

MICROCIRCUIT,MEMORY

NSN, MFG P/N

5962012915019

NSN

5962-01-291-5019

MFG

MMI/AMD

Description

BODY HEIGHT: 0.060 INCHES MINIMUM AND 0.100 INCHES MAXIMUM
BODY LENGTH: 0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM
BODY WIDTH: 0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM
CASE OUTLINE SOURCE AND DESIGNATOR: C-2 MIL-M-38510
CURRENT RATING PER CHARACTERISTIC: 12.00 MILLIAMPERES MAXIMUM OUTPUT
DEFINITIVE GOVERNMENT SPEC/STD REFERENCE: 5962-85155092A
FEATURES PROVIDED: HERMETICALLY SEALED AND BURN IN AND BIPOLAR AND PROGRAMMABLE
INCLOSURE CONFIGURATION: LEADED CHIP CARRIER
INCLOSURE MATERIAL: CERAMIC
INPUT CIRCUIT PATTERN: 16 INPUT
MANUFACTURERS CODE: 67268
MAXIMUM POWER DISSIPATION RATING: 1.2 WATTS
MEMORY DEVICE TYPE: PAL
NON-DEFINITIVE GOVERNMENT SPEC/STD REFERENCE: 5962-85155
OPERATING TEMP RANGE: -55.0 TO 125.0 DEG CELSIUS
OUTPUT LOGIC FORM: BIPOLAR METAL-OXIDE SEMICONDUCTOR
SPEC/STD CONTROLLING DATA:
STORAGE TEMP RANGE: -65.0 TO 150.0 DEG CELSIUS
TERMINAL SURFACE TREATMENT: SOLDER
TERMINAL TYPE AND QUANTITY: 20 PIN
TEST DATA DOCUMENT: 96906-M

ROM/PROM

MICROCIRCUIT,MEMORY

NSN, MFG P/N

5962012915019

NSN

5962-01-291-5019

View More Info

ROM/PROM

MICROCIRCUIT,MEMORY

NSN, MFG P/N

5962012915019

NSN

5962-01-291-5019

MFG

DLA LAND AND MARITIME

Description

BODY HEIGHT: 0.060 INCHES MINIMUM AND 0.100 INCHES MAXIMUM
BODY LENGTH: 0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM
BODY WIDTH: 0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM
CASE OUTLINE SOURCE AND DESIGNATOR: C-2 MIL-M-38510
CURRENT RATING PER CHARACTERISTIC: 12.00 MILLIAMPERES MAXIMUM OUTPUT
DEFINITIVE GOVERNMENT SPEC/STD REFERENCE: 5962-85155092A
FEATURES PROVIDED: HERMETICALLY SEALED AND BURN IN AND BIPOLAR AND PROGRAMMABLE
INCLOSURE CONFIGURATION: LEADED CHIP CARRIER
INCLOSURE MATERIAL: CERAMIC
INPUT CIRCUIT PATTERN: 16 INPUT
MANUFACTURERS CODE: 67268
MAXIMUM POWER DISSIPATION RATING: 1.2 WATTS
MEMORY DEVICE TYPE: PAL
NON-DEFINITIVE GOVERNMENT SPEC/STD REFERENCE: 5962-85155
OPERATING TEMP RANGE: -55.0 TO 125.0 DEG CELSIUS
OUTPUT LOGIC FORM: BIPOLAR METAL-OXIDE SEMICONDUCTOR
SPEC/STD CONTROLLING DATA:
STORAGE TEMP RANGE: -65.0 TO 150.0 DEG CELSIUS
TERMINAL SURFACE TREATMENT: SOLDER
TERMINAL TYPE AND QUANTITY: 20 PIN
TEST DATA DOCUMENT: 96906-M

3133315-1

MICROCIRCUIT,DIGITAL-LINEAR

NSN, MFG P/N

5962012915020

NSN

5962-01-291-5020

View More Info

3133315-1

MICROCIRCUIT,DIGITAL-LINEAR

NSN, MFG P/N

5962012915020

NSN

5962-01-291-5020

MFG

RAYTHEON COMPANY

Description

(NON-CORE DATA) BIT QUANTITY: 8
BODY HEIGHT: 0.060 INCHES MINIMUM AND 0.100 INCHES MAXIMUM
BODY LENGTH: 0.395 INCHES MINIMUM AND 0.410 INCHES MAXIMUM
BODY WIDTH: 0.395 INCHES MINIMUM AND 0.410 INCHES MAXIMUM
CASE OUTLINE SOURCE AND DESIGNATOR: C-3 MIL-M-38510
DESIGN FUNCTION AND QUANTITY: 1 CONVERTER, DIGITAL TO ANALOG
FEATURES PROVIDED: ELECTROSTATIC SENSITIVE AND HERMETICALLY SEALED AND BURN IN AND MONOLITHIC
INCLOSURE CONFIGURATION: LEADLESS FLAT PACK
INCLOSURE MATERIAL: CERAMIC
INPUT CIRCUIT PATTERN: 13 INPUT
OPERATING TEMP RANGE: -55.0 TO 125.0 DEG CELSIUS
OUTPUT LOGIC FORM: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
STORAGE TEMP RANGE: -65.0 TO 150.0 DEG CELSIUS
TERMINAL SURFACE TREATMENT: SOLDER
TERMINAL TYPE AND QUANTITY: 24 LEADLESS
TEST DATA DOCUMENT: 96906-MIL-STD-883 STANDARD
TIME RATING PER CHACTERISTIC: 10.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 10.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEV

717801471-001

MICROCIRCUIT,DIGITAL-LINEAR

NSN, MFG P/N

5962012915020

NSN

5962-01-291-5020

View More Info

717801471-001

MICROCIRCUIT,DIGITAL-LINEAR

NSN, MFG P/N

5962012915020

NSN

5962-01-291-5020

MFG

LOCKHEED MARTIN CORPORATION DBA LOCKHEED MARTIN

Description

(NON-CORE DATA) BIT QUANTITY: 8
BODY HEIGHT: 0.060 INCHES MINIMUM AND 0.100 INCHES MAXIMUM
BODY LENGTH: 0.395 INCHES MINIMUM AND 0.410 INCHES MAXIMUM
BODY WIDTH: 0.395 INCHES MINIMUM AND 0.410 INCHES MAXIMUM
CASE OUTLINE SOURCE AND DESIGNATOR: C-3 MIL-M-38510
DESIGN FUNCTION AND QUANTITY: 1 CONVERTER, DIGITAL TO ANALOG
FEATURES PROVIDED: ELECTROSTATIC SENSITIVE AND HERMETICALLY SEALED AND BURN IN AND MONOLITHIC
INCLOSURE CONFIGURATION: LEADLESS FLAT PACK
INCLOSURE MATERIAL: CERAMIC
INPUT CIRCUIT PATTERN: 13 INPUT
OPERATING TEMP RANGE: -55.0 TO 125.0 DEG CELSIUS
OUTPUT LOGIC FORM: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
STORAGE TEMP RANGE: -65.0 TO 150.0 DEG CELSIUS
TERMINAL SURFACE TREATMENT: SOLDER
TERMINAL TYPE AND QUANTITY: 24 LEADLESS
TEST DATA DOCUMENT: 96906-MIL-STD-883 STANDARD
TIME RATING PER CHACTERISTIC: 10.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 10.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEV

VDAC-1850HL/B

MICROCIRCUIT,DIGITAL-LINEAR

NSN, MFG P/N

5962012915020

NSN

5962-01-291-5020

View More Info

VDAC-1850HL/B

MICROCIRCUIT,DIGITAL-LINEAR

NSN, MFG P/N

5962012915020

NSN

5962-01-291-5020

MFG

INTERNATIONAL RECTIFIER CORPORATION DBA CUSTOMER SERVICES DEPARTMENT

Description

(NON-CORE DATA) BIT QUANTITY: 8
BODY HEIGHT: 0.060 INCHES MINIMUM AND 0.100 INCHES MAXIMUM
BODY LENGTH: 0.395 INCHES MINIMUM AND 0.410 INCHES MAXIMUM
BODY WIDTH: 0.395 INCHES MINIMUM AND 0.410 INCHES MAXIMUM
CASE OUTLINE SOURCE AND DESIGNATOR: C-3 MIL-M-38510
DESIGN FUNCTION AND QUANTITY: 1 CONVERTER, DIGITAL TO ANALOG
FEATURES PROVIDED: ELECTROSTATIC SENSITIVE AND HERMETICALLY SEALED AND BURN IN AND MONOLITHIC
INCLOSURE CONFIGURATION: LEADLESS FLAT PACK
INCLOSURE MATERIAL: CERAMIC
INPUT CIRCUIT PATTERN: 13 INPUT
OPERATING TEMP RANGE: -55.0 TO 125.0 DEG CELSIUS
OUTPUT LOGIC FORM: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
STORAGE TEMP RANGE: -65.0 TO 150.0 DEG CELSIUS
TERMINAL SURFACE TREATMENT: SOLDER
TERMINAL TYPE AND QUANTITY: 24 LEADLESS
TEST DATA DOCUMENT: 96906-MIL-STD-883 STANDARD
TIME RATING PER CHACTERISTIC: 10.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 10.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEV

VDAC1850L/B

MICROCIRCUIT,DIGITAL-LINEAR

NSN, MFG P/N

5962012915020

NSN

5962-01-291-5020

View More Info

VDAC1850L/B

MICROCIRCUIT,DIGITAL-LINEAR

NSN, MFG P/N

5962012915020

NSN

5962-01-291-5020

MFG

INTERNATIONAL RECTIFIER CORPORATION DBA CUSTOMER SERVICES DEPARTMENT

Description

(NON-CORE DATA) BIT QUANTITY: 8
BODY HEIGHT: 0.060 INCHES MINIMUM AND 0.100 INCHES MAXIMUM
BODY LENGTH: 0.395 INCHES MINIMUM AND 0.410 INCHES MAXIMUM
BODY WIDTH: 0.395 INCHES MINIMUM AND 0.410 INCHES MAXIMUM
CASE OUTLINE SOURCE AND DESIGNATOR: C-3 MIL-M-38510
DESIGN FUNCTION AND QUANTITY: 1 CONVERTER, DIGITAL TO ANALOG
FEATURES PROVIDED: ELECTROSTATIC SENSITIVE AND HERMETICALLY SEALED AND BURN IN AND MONOLITHIC
INCLOSURE CONFIGURATION: LEADLESS FLAT PACK
INCLOSURE MATERIAL: CERAMIC
INPUT CIRCUIT PATTERN: 13 INPUT
OPERATING TEMP RANGE: -55.0 TO 125.0 DEG CELSIUS
OUTPUT LOGIC FORM: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
STORAGE TEMP RANGE: -65.0 TO 150.0 DEG CELSIUS
TERMINAL SURFACE TREATMENT: SOLDER
TERMINAL TYPE AND QUANTITY: 24 LEADLESS
TEST DATA DOCUMENT: 96906-MIL-STD-883 STANDARD
TIME RATING PER CHACTERISTIC: 10.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 10.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEV

168A367-4

MICROCIRCUIT,MEMORY

NSN, MFG P/N

5962012915393

NSN

5962-01-291-5393

View More Info

168A367-4

MICROCIRCUIT,MEMORY

NSN, MFG P/N

5962012915393

NSN

5962-01-291-5393

MFG

LOCKHEED MARTIN CORPORATION DBA MISSION SYSTEMS & SENSORS

Description

(NON-CORE DATA) BIT QUANTITY: 32768
(NON-CORE DATA) WORD QUANTITY: 4096
BODY HEIGHT: 0.225 INCHES NOMINAL
BODY LENGTH: 1.290 INCHES NOMINAL
BODY WIDTH: 0.500 INCHES MINIMUM AND 0.610 INCHES MAXIMUM
FEATURES PROVIDED: ELECTROSTATIC SENSITIVE AND PROGRAMMED AND BIPOLAR AND SCHOTTKY
INCLOSURE CONFIGURATION: DUAL-IN-LINE
MEMORY DEVICE TYPE: PROM
OPERATING TEMP RANGE: -55.0 TO 125.0 DEG CELSIUS
TERMINAL TYPE AND QUANTITY: 24 PRINTED CIRCUIT

613550-5

MICROCIRCUIT,MEMORY

NSN, MFG P/N

5962012915393

NSN

5962-01-291-5393

View More Info

613550-5

MICROCIRCUIT,MEMORY

NSN, MFG P/N

5962012915393

NSN

5962-01-291-5393

MFG

RAYTHEON CO SEMICONDUCTOR DIV

Description

(NON-CORE DATA) BIT QUANTITY: 32768
(NON-CORE DATA) WORD QUANTITY: 4096
BODY HEIGHT: 0.225 INCHES NOMINAL
BODY LENGTH: 1.290 INCHES NOMINAL
BODY WIDTH: 0.500 INCHES MINIMUM AND 0.610 INCHES MAXIMUM
FEATURES PROVIDED: ELECTROSTATIC SENSITIVE AND PROGRAMMED AND BIPOLAR AND SCHOTTKY
INCLOSURE CONFIGURATION: DUAL-IN-LINE
MEMORY DEVICE TYPE: PROM
OPERATING TEMP RANGE: -55.0 TO 125.0 DEG CELSIUS
TERMINAL TYPE AND QUANTITY: 24 PRINTED CIRCUIT

6135550-5

MICROCIRCUIT,MEMORY

NSN, MFG P/N

5962012915393

NSN

5962-01-291-5393

View More Info

6135550-5

MICROCIRCUIT,MEMORY

NSN, MFG P/N

5962012915393

NSN

5962-01-291-5393

MFG

LOCKHEED MARTIN CORPORATION DBA MISSION SYSTEMS & SENSORS

Description

(NON-CORE DATA) BIT QUANTITY: 32768
(NON-CORE DATA) WORD QUANTITY: 4096
BODY HEIGHT: 0.225 INCHES NOMINAL
BODY LENGTH: 1.290 INCHES NOMINAL
BODY WIDTH: 0.500 INCHES MINIMUM AND 0.610 INCHES MAXIMUM
FEATURES PROVIDED: ELECTROSTATIC SENSITIVE AND PROGRAMMED AND BIPOLAR AND SCHOTTKY
INCLOSURE CONFIGURATION: DUAL-IN-LINE
MEMORY DEVICE TYPE: PROM
OPERATING TEMP RANGE: -55.0 TO 125.0 DEG CELSIUS
TERMINAL TYPE AND QUANTITY: 24 PRINTED CIRCUIT

ROM/PROM

MICROCIRCUIT,MEMORY

NSN, MFG P/N

5962012915393

NSN

5962-01-291-5393

View More Info

ROM/PROM

MICROCIRCUIT,MEMORY

NSN, MFG P/N

5962012915393

NSN

5962-01-291-5393

MFG

DLA LAND AND MARITIME

Description

(NON-CORE DATA) BIT QUANTITY: 32768
(NON-CORE DATA) WORD QUANTITY: 4096
BODY HEIGHT: 0.225 INCHES NOMINAL
BODY LENGTH: 1.290 INCHES NOMINAL
BODY WIDTH: 0.500 INCHES MINIMUM AND 0.610 INCHES MAXIMUM
FEATURES PROVIDED: ELECTROSTATIC SENSITIVE AND PROGRAMMED AND BIPOLAR AND SCHOTTKY
INCLOSURE CONFIGURATION: DUAL-IN-LINE
MEMORY DEVICE TYPE: PROM
OPERATING TEMP RANGE: -55.0 TO 125.0 DEG CELSIUS
TERMINAL TYPE AND QUANTITY: 24 PRINTED CIRCUIT

10215-8205

MICROCIRCUIT,MEMORY

NSN, MFG P/N

5962012915474

NSN

5962-01-291-5474

View More Info

10215-8205

MICROCIRCUIT,MEMORY

NSN, MFG P/N

5962012915474

NSN

5962-01-291-5474

MFG

HARRIS CORPORATION DBA HARRIS RF COMMUNICATION

M27256F1

MICROCIRCUIT,MEMORY

NSN, MFG P/N

5962012915474

NSN

5962-01-291-5474

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M27256F1

MICROCIRCUIT,MEMORY

NSN, MFG P/N

5962012915474

NSN

5962-01-291-5474

MFG

STMICROELECTRONICS INC

ROM/PROM FAMILY 070

MICROCIRCUIT,MEMORY

NSN, MFG P/N

5962012915474

NSN

5962-01-291-5474

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ROM/PROM FAMILY 070

MICROCIRCUIT,MEMORY

NSN, MFG P/N

5962012915474

NSN

5962-01-291-5474

MFG

DLA LAND AND MARITIME