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5961-01-349-9021

20 Products

61205-90064

SEMICONDUCTOR DEVICES,UNITIZED

NSN, MFG P/N

5961013499021

NSN

5961-01-349-9021

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61205-90064

SEMICONDUCTOR DEVICES,UNITIZED

NSN, MFG P/N

5961013499021

NSN

5961-01-349-9021

MFG

AAI CORPORATION

Description

CAPACITANCE RATING IN PICOFARADS: 0.1 MINIMUM AND 0.3 MAXIMUM ALL SEMICONDUCTOR DEVICE DIODE
COMPONENT NAME AND QUANTITY: 2 SEMICONDUCTOR DEVICE DIODE
FUNCTION FOR WHICH DESIGNED: MICROWAVE
INCLOSURE MATERIAL: METAL
MAXIMUM OPERATING TEMP PER MEASUREMENT POINT: 150.0 DEG CELSIUS JUNCTION
MOUNTING METHOD: TERMINAL
OVERALL LENGTH: 0.026 INCHES MINIMUM AND 0.028 INCHES MAXIMUM
POWER RATING PER CHARACTERISTIC: 75.0 MILLIWATTS MAXIMUM TOTAL POWER DISSIPATION ALL SEMICONDUCTOR DEVICE DIODE
SEMICONDUCTOR MATERIAL: SILICON ALL SEMICONDUCTOR DEVICE DIODE
SPECIAL FEATURES: ALL SEMICONDUCTOR DEVICE DIODE JUNCTION PATTERN ARRANGEMENT: PN
TERMINAL TYPE AND QUANTITY: 2 BEAM LEAD
VOLTAGE RATING IN VOLTS PER CHARACTERISTIC: 0.4 NOMINAL FORWARD VOLTAGE, DC ALL SEMICONDUCTOR DEVICE DIODE

MA40278M

SEMICONDUCTOR DEVICES,UNITIZED

NSN, MFG P/N

5961013499021

NSN

5961-01-349-9021

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MA40278M

SEMICONDUCTOR DEVICES,UNITIZED

NSN, MFG P/N

5961013499021

NSN

5961-01-349-9021

MFG

M/A-COM INC. DBA TYCO ELECTRONIC WIRELESS SYSTEM

Description

CAPACITANCE RATING IN PICOFARADS: 0.1 MINIMUM AND 0.3 MAXIMUM ALL SEMICONDUCTOR DEVICE DIODE
COMPONENT NAME AND QUANTITY: 2 SEMICONDUCTOR DEVICE DIODE
FUNCTION FOR WHICH DESIGNED: MICROWAVE
INCLOSURE MATERIAL: METAL
MAXIMUM OPERATING TEMP PER MEASUREMENT POINT: 150.0 DEG CELSIUS JUNCTION
MOUNTING METHOD: TERMINAL
OVERALL LENGTH: 0.026 INCHES MINIMUM AND 0.028 INCHES MAXIMUM
POWER RATING PER CHARACTERISTIC: 75.0 MILLIWATTS MAXIMUM TOTAL POWER DISSIPATION ALL SEMICONDUCTOR DEVICE DIODE
SEMICONDUCTOR MATERIAL: SILICON ALL SEMICONDUCTOR DEVICE DIODE
SPECIAL FEATURES: ALL SEMICONDUCTOR DEVICE DIODE JUNCTION PATTERN ARRANGEMENT: PN
TERMINAL TYPE AND QUANTITY: 2 BEAM LEAD
VOLTAGE RATING IN VOLTS PER CHARACTERISTIC: 0.4 NOMINAL FORWARD VOLTAGE, DC ALL SEMICONDUCTOR DEVICE DIODE

312A1717P1

TRANSISTOR

NSN, MFG P/N

5961013499473

NSN

5961-01-349-9473

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312A1717P1

TRANSISTOR

NSN, MFG P/N

5961013499473

NSN

5961-01-349-9473

MFG

GENERAL ELECTRIC CO GE DRIVE SYSTEMS GOVERNMENT BUSINESS OPN

312A1718

TRANSISTOR

NSN, MFG P/N

5961013499921

NSN

5961-01-349-9921

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312A1718

TRANSISTOR

NSN, MFG P/N

5961013499921

NSN

5961-01-349-9921

MFG

BAE SYSTEMS CONTROLS INC.

Description

CURRENT RATING PER CHARACTERISTIC: 20.00 AMPERES MAXIMUM COLLECTOR CURRENT, DC AND 10.00 AMPERES MAXIMUM BASE CURRENT, DC
INCLOSURE MATERIAL: METAL
INTERNAL CONFIGURATION: JUNCTION CONTACT-DARLINGTON CONNECTED
MAXIMUM OPERATING TEMP PER MEASUREMENT POINT: 200.0 DEG CELSIUS JUNCTION
MOUNTING FACILITY QUANTITY: 2
MOUNTING METHOD: UNTHREADED HOLE
OVERALL HEIGHT: 0.450 INCHES MAXIMUM
OVERALL LENGTH: 1.573 INCHES MAXIMUM
OVERALL WIDTH: 1.050 INCHES MAXIMUM
POWER RATING PER CHARACTERISTIC: 250.0 WATTS MAXIMUM TOTAL DEVICE DISSIPATION
SEMICONDUCTOR MATERIAL: SILICON
SPECIAL FEATURES: JUNCTION PATTERN ARRANGEMENT: NPN
TERMINAL TYPE AND QUANTITY: 2 PIN AND 1 CASE
TEST DATA DOCUMENT: 89954-312A1718 DRAWING
VOLTAGE RATING IN VOLTS PER CHARACTERISTIC: 850.0 MAXIMUM COLLECTOR-TO-EMITTER, SUBSTAINING VOLTAGE, BASE OPEN-CIRCUITED AND 8.0 MAXIMUM EMITTER TO BASE VOLTAGE, DC

312A1718P1

TRANSISTOR

NSN, MFG P/N

5961013499921

NSN

5961-01-349-9921

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312A1718P1

TRANSISTOR

NSN, MFG P/N

5961013499921

NSN

5961-01-349-9921

MFG

WARD LEONARD ELECTRIC COMPANY INC.

Description

CURRENT RATING PER CHARACTERISTIC: 20.00 AMPERES MAXIMUM COLLECTOR CURRENT, DC AND 10.00 AMPERES MAXIMUM BASE CURRENT, DC
INCLOSURE MATERIAL: METAL
INTERNAL CONFIGURATION: JUNCTION CONTACT-DARLINGTON CONNECTED
MAXIMUM OPERATING TEMP PER MEASUREMENT POINT: 200.0 DEG CELSIUS JUNCTION
MOUNTING FACILITY QUANTITY: 2
MOUNTING METHOD: UNTHREADED HOLE
OVERALL HEIGHT: 0.450 INCHES MAXIMUM
OVERALL LENGTH: 1.573 INCHES MAXIMUM
OVERALL WIDTH: 1.050 INCHES MAXIMUM
POWER RATING PER CHARACTERISTIC: 250.0 WATTS MAXIMUM TOTAL DEVICE DISSIPATION
SEMICONDUCTOR MATERIAL: SILICON
SPECIAL FEATURES: JUNCTION PATTERN ARRANGEMENT: NPN
TERMINAL TYPE AND QUANTITY: 2 PIN AND 1 CASE
TEST DATA DOCUMENT: 89954-312A1718 DRAWING
VOLTAGE RATING IN VOLTS PER CHARACTERISTIC: 850.0 MAXIMUM COLLECTOR-TO-EMITTER, SUBSTAINING VOLTAGE, BASE OPEN-CIRCUITED AND 8.0 MAXIMUM EMITTER TO BASE VOLTAGE, DC

948E500 PIECE 252

TRANSISTOR

NSN, MFG P/N

5961013499921

NSN

5961-01-349-9921

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948E500 PIECE 252

TRANSISTOR

NSN, MFG P/N

5961013499921

NSN

5961-01-349-9921

MFG

GENERAL ELECTRIC CO GE DRIVE SYSTEMS GOVERNMENT BUSINESS OPN

Description

CURRENT RATING PER CHARACTERISTIC: 20.00 AMPERES MAXIMUM COLLECTOR CURRENT, DC AND 10.00 AMPERES MAXIMUM BASE CURRENT, DC
INCLOSURE MATERIAL: METAL
INTERNAL CONFIGURATION: JUNCTION CONTACT-DARLINGTON CONNECTED
MAXIMUM OPERATING TEMP PER MEASUREMENT POINT: 200.0 DEG CELSIUS JUNCTION
MOUNTING FACILITY QUANTITY: 2
MOUNTING METHOD: UNTHREADED HOLE
OVERALL HEIGHT: 0.450 INCHES MAXIMUM
OVERALL LENGTH: 1.573 INCHES MAXIMUM
OVERALL WIDTH: 1.050 INCHES MAXIMUM
POWER RATING PER CHARACTERISTIC: 250.0 WATTS MAXIMUM TOTAL DEVICE DISSIPATION
SEMICONDUCTOR MATERIAL: SILICON
SPECIAL FEATURES: JUNCTION PATTERN ARRANGEMENT: NPN
TERMINAL TYPE AND QUANTITY: 2 PIN AND 1 CASE
TEST DATA DOCUMENT: 89954-312A1718 DRAWING
VOLTAGE RATING IN VOLTS PER CHARACTERISTIC: 850.0 MAXIMUM COLLECTOR-TO-EMITTER, SUBSTAINING VOLTAGE, BASE OPEN-CIRCUITED AND 8.0 MAXIMUM EMITTER TO BASE VOLTAGE, DC

MJ10025BI

TRANSISTOR

NSN, MFG P/N

5961013499921

NSN

5961-01-349-9921

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MJ10025BI

TRANSISTOR

NSN, MFG P/N

5961013499921

NSN

5961-01-349-9921

MFG

FREESCALE SEMICONDUCTOR INC.

Description

CURRENT RATING PER CHARACTERISTIC: 20.00 AMPERES MAXIMUM COLLECTOR CURRENT, DC AND 10.00 AMPERES MAXIMUM BASE CURRENT, DC
INCLOSURE MATERIAL: METAL
INTERNAL CONFIGURATION: JUNCTION CONTACT-DARLINGTON CONNECTED
MAXIMUM OPERATING TEMP PER MEASUREMENT POINT: 200.0 DEG CELSIUS JUNCTION
MOUNTING FACILITY QUANTITY: 2
MOUNTING METHOD: UNTHREADED HOLE
OVERALL HEIGHT: 0.450 INCHES MAXIMUM
OVERALL LENGTH: 1.573 INCHES MAXIMUM
OVERALL WIDTH: 1.050 INCHES MAXIMUM
POWER RATING PER CHARACTERISTIC: 250.0 WATTS MAXIMUM TOTAL DEVICE DISSIPATION
SEMICONDUCTOR MATERIAL: SILICON
SPECIAL FEATURES: JUNCTION PATTERN ARRANGEMENT: NPN
TERMINAL TYPE AND QUANTITY: 2 PIN AND 1 CASE
TEST DATA DOCUMENT: 89954-312A1718 DRAWING
VOLTAGE RATING IN VOLTS PER CHARACTERISTIC: 850.0 MAXIMUM COLLECTOR-TO-EMITTER, SUBSTAINING VOLTAGE, BASE OPEN-CIRCUITED AND 8.0 MAXIMUM EMITTER TO BASE VOLTAGE, DC

61205-90065

SEMICONDUCTOR DEVICE,DIODE

NSN, MFG P/N

5961013499922

NSN

5961-01-349-9922

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61205-90065

SEMICONDUCTOR DEVICE,DIODE

NSN, MFG P/N

5961013499922

NSN

5961-01-349-9922

MFG

AAI CORPORATION

Description

CAPACITANCE RATING IN PICOFARADS: 0.15 MAXIMUM
CURRENT RATING PER CHARACTERISTIC: 10.00 MICROAMPERES MAXIMUM REVERSE CURRENT, DC
FUNCTION FOR WHICH DESIGNED: MICROWAVE
III PRECIOUS MATERIAL: GOLD
III PRECIOUS MATERIAL AND LOCATION: TERMINALS GOLD
INCLOSURE MATERIAL: METAL
MAXIMUM OPERATING TEMP PER MEASUREMENT POINT: 175.0 DEG CELSIUS AMBIENT AIR
MOUNTING METHOD: TERMINAL
OVERALL HEIGHT: 0.400 INCHES MINIMUM AND 0.600 INCHES MAXIMUM
OVERALL LENGTH: 0.250 INCHES MINIMUM AND 0.310 INCHES MAXIMUM
OVERALL WIDTH: 1.800 INCHES MINIMUM AND 2.700 INCHES MAXIMUM
POWER RATING PER CHARACTERISTIC: 1.0 WATTS MAXIMUM REVERSE POWER DISSIPATION, DC
SEMICONDUCTOR MATERIAL: SILICON
SPECIAL FEATURES: BEAM LEAD SCHOTTKY DIODE FOR DETECTORS; JUNCTION PATTERN ARRANGEMENT: PN
TERMINAL LENGTH: 0.200 INCHES MINIMUM AND 0.225 INCHES MAXIMUM
TERMINAL TYPE AND QUANTITY: 2 BEAM LEAD
VOLTAGE RATING IN VOLTS PER CHARACTERISTIC: 4.0 MAXIMUM BREAKDOWN VOLTAGE, DC

HSCH-5312

SEMICONDUCTOR DEVICE,DIODE

NSN, MFG P/N

5961013499922

NSN

5961-01-349-9922

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HSCH-5312

SEMICONDUCTOR DEVICE,DIODE

NSN, MFG P/N

5961013499922

NSN

5961-01-349-9922

MFG

AVAGO TECHNOLOGIES U.S. INC. DIV AVAGO TECHNOLOGIES

Description

CAPACITANCE RATING IN PICOFARADS: 0.15 MAXIMUM
CURRENT RATING PER CHARACTERISTIC: 10.00 MICROAMPERES MAXIMUM REVERSE CURRENT, DC
FUNCTION FOR WHICH DESIGNED: MICROWAVE
III PRECIOUS MATERIAL: GOLD
III PRECIOUS MATERIAL AND LOCATION: TERMINALS GOLD
INCLOSURE MATERIAL: METAL
MAXIMUM OPERATING TEMP PER MEASUREMENT POINT: 175.0 DEG CELSIUS AMBIENT AIR
MOUNTING METHOD: TERMINAL
OVERALL HEIGHT: 0.400 INCHES MINIMUM AND 0.600 INCHES MAXIMUM
OVERALL LENGTH: 0.250 INCHES MINIMUM AND 0.310 INCHES MAXIMUM
OVERALL WIDTH: 1.800 INCHES MINIMUM AND 2.700 INCHES MAXIMUM
POWER RATING PER CHARACTERISTIC: 1.0 WATTS MAXIMUM REVERSE POWER DISSIPATION, DC
SEMICONDUCTOR MATERIAL: SILICON
SPECIAL FEATURES: BEAM LEAD SCHOTTKY DIODE FOR DETECTORS; JUNCTION PATTERN ARRANGEMENT: PN
TERMINAL LENGTH: 0.200 INCHES MINIMUM AND 0.225 INCHES MAXIMUM
TERMINAL TYPE AND QUANTITY: 2 BEAM LEAD
VOLTAGE RATING IN VOLTS PER CHARACTERISTIC: 4.0 MAXIMUM BREAKDOWN VOLTAGE, DC

307A8978

SEMICONDUCTOR DEVICE ASSEMBLY

NSN, MFG P/N

5961013500041

NSN

5961-01-350-0041

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307A8978

SEMICONDUCTOR DEVICE ASSEMBLY

NSN, MFG P/N

5961013500041

NSN

5961-01-350-0041

MFG

GENERAL ELECTRIC CO GE DRIVE SYSTEMS GOVERNMENT BUSINESS OPN

Description

JOINT ELECTRONICS TYPE DESIGNATION SYSTEM ITEM NAME: FLD RECTIFIER
JOINT ELECTRONICS TYPE DESIGNATION SYSTEM ITEM TYPE NUMBER: 948E500 PIECE 19
MAJOR COMPONENTS: DIODE 6,TERMINAL BOARD 1

307A8982P1

SEMICONDUCTOR DEVICE ASSEMBLY

NSN, MFG P/N

5961013500042

NSN

5961-01-350-0042

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307A8982P1

SEMICONDUCTOR DEVICE ASSEMBLY

NSN, MFG P/N

5961013500042

NSN

5961-01-350-0042

MFG

GENERAL ELECTRIC CO GE DRIVE SYSTEMS GOVERNMENT BUSINESS OPN

Description

JOINT ELECTRONICS TYPE DESIGNATION SYSTEM ITEM TYPE NUMBER: 948E500 PIECE 285
MAJOR COMPONENTS: THYRISTOR 3,PRINTED WIRING BOARD 1

G339805-2

TRANSISTOR

NSN, MFG P/N

5961013501017

NSN

5961-01-350-1017

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G339805-2

TRANSISTOR

NSN, MFG P/N

5961013501017

NSN

5961-01-350-1017

MFG

AUSTIN SEMICONDUCTOR INC DBA MICROSS COMPONENTS

Description

(NON-CORE DATA) SUPPLEMENTARY FEATURES: MILSTAR
CRITICALITY CODE JUSTIFICATION: FEAT
NUCLEAR HARDNESS CRITICAL FEATURE: HARDENED
SPECIAL FEATURES: HARDNESS CRITICAL ITEM

H46506

TRANSISTOR

NSN, MFG P/N

5961013501017

NSN

5961-01-350-1017

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H46506

TRANSISTOR

NSN, MFG P/N

5961013501017

NSN

5961-01-350-1017

MFG

NATIONAL SEMICONDUCTOR CORPORATION

Description

(NON-CORE DATA) SUPPLEMENTARY FEATURES: MILSTAR
CRITICALITY CODE JUSTIFICATION: FEAT
NUCLEAR HARDNESS CRITICAL FEATURE: HARDENED
SPECIAL FEATURES: HARDNESS CRITICAL ITEM

NFP2056

TRANSISTOR

NSN, MFG P/N

5961013501017

NSN

5961-01-350-1017

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NFP2056

TRANSISTOR

NSN, MFG P/N

5961013501017

NSN

5961-01-350-1017

MFG

MICROSEMI CORP. - MASSACHUSETTS DBA MICROSEMI-LAWRENCE DIV MICROSEMI CORPORATION

Description

(NON-CORE DATA) SUPPLEMENTARY FEATURES: MILSTAR
CRITICALITY CODE JUSTIFICATION: FEAT
NUCLEAR HARDNESS CRITICAL FEATURE: HARDENED
SPECIAL FEATURES: HARDNESS CRITICAL ITEM

NHG339805-2

TRANSISTOR

NSN, MFG P/N

5961013501017

NSN

5961-01-350-1017

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NHG339805-2

TRANSISTOR

NSN, MFG P/N

5961013501017

NSN

5961-01-350-1017

MFG

DLA LAND AND MARITIME

Description

(NON-CORE DATA) SUPPLEMENTARY FEATURES: MILSTAR
CRITICALITY CODE JUSTIFICATION: FEAT
NUCLEAR HARDNESS CRITICAL FEATURE: HARDENED
SPECIAL FEATURES: HARDNESS CRITICAL ITEM

SA2858

TRANSISTOR

NSN, MFG P/N

5961013501017

NSN

5961-01-350-1017

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SA2858

TRANSISTOR

NSN, MFG P/N

5961013501017

NSN

5961-01-350-1017

MFG

FAIRCHILD SEMICONDUCTOR CORP SEMICONDUCTOR DIV HQ

Description

(NON-CORE DATA) SUPPLEMENTARY FEATURES: MILSTAR
CRITICALITY CODE JUSTIFICATION: FEAT
NUCLEAR HARDNESS CRITICAL FEATURE: HARDENED
SPECIAL FEATURES: HARDNESS CRITICAL ITEM

5840

SEMICONDUCTOR DEVICE,DIODE

NSN, MFG P/N

5961013501018

NSN

5961-01-350-1018

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5840

SEMICONDUCTOR DEVICE,DIODE

NSN, MFG P/N

5961013501018

NSN

5961-01-350-1018

MFG

VAISALA INC.

Description

DESIGN CONTROL REFERENCE: 5840
III END ITEM IDENTIFICATION: METEROLOGICAL
MANUFACTURERS CODE: 63653
THE MANUFACTURERS DATA:

201909-27

SEMICONDUCTOR DEVICE,DIODE

NSN, MFG P/N

5961013501019

NSN

5961-01-350-1019

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201909-27

SEMICONDUCTOR DEVICE,DIODE

NSN, MFG P/N

5961013501019

NSN

5961-01-350-1019

MFG

LOCKHEED MARTIN CORPORATION DBA LOCKHEED MARTIN DIV MS2

61205-90070

SEMICONDUCTOR DEVICE,DIODE

NSN, MFG P/N

5961013501244

NSN

5961-01-350-1244

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61205-90070

SEMICONDUCTOR DEVICE,DIODE

NSN, MFG P/N

5961013501244

NSN

5961-01-350-1244

MFG

AAI CORPORATION

Description

CAPACITANCE RATING IN PICOFARADS: 0.1 MAXIMUM
CURRENT RATING PER CHARACTERISTIC: 10.00 MICROAMPERES MAXIMUM REVERSE CURRENT, DC
FEATURES PROVIDED: MOUNTING PAD
FUNCTION FOR WHICH DESIGNED: SWITCHING
III PRECIOUS MATERIAL: GOLD
III PRECIOUS MATERIAL AND LOCATION: TERMINAL SURFACES GOLD
INCLOSURE MATERIAL: METAL
MAXIMUM OPERATING TEMP PER MEASUREMENT POINT: 85.0 DEG CELSIUS AMBIENT AIR
MOUNTING METHOD: PRESS FIT
OVERALL HEIGHT: 0.005 INCHES MINIMUM AND 0.008 INCHES MAXIMUM
OVERALL LENGTH: 0.013 INCHES NOMINAL
OVERALL WIDTH: 0.013 INCHES NOMINAL
POWER RATING PER CHARACTERISTIC: 200.0 MILLIWATTS MAXIMUM COLLECTOR POWER DISSIPATION
SEMICONDUCTOR MATERIAL: SILICON
SPECIAL FEATURES: THE DIODE SHALL BE CAPABLE OF FULFILLING ALL REQUIREMENTS WHEN ATTACHED TO GOLD PLATED ALUMINUM USING A SILVER FILLED CONDUCTIVE EPOXY; JUNCTION PATTERN ARRANGEMENT: PN
TERMINAL TYPE AND QUANTITY: 1 BONDING PAD
VOLTAGE RATING IN VOLTS PER CHARACTERISTIC: 100.0 MINIMUM BREAKDOWN VOLTAGE, DC_

DP102147-000

SEMICONDUCTOR DEVICE,DIODE

NSN, MFG P/N

5961013501244

NSN

5961-01-350-1244

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DP102147-000

SEMICONDUCTOR DEVICE,DIODE

NSN, MFG P/N

5961013501244

NSN

5961-01-350-1244

MFG

M/A-COM INC. DBA TYCO ELECTRONIC WIRELESS SYSTEM

Description

CAPACITANCE RATING IN PICOFARADS: 0.1 MAXIMUM
CURRENT RATING PER CHARACTERISTIC: 10.00 MICROAMPERES MAXIMUM REVERSE CURRENT, DC
FEATURES PROVIDED: MOUNTING PAD
FUNCTION FOR WHICH DESIGNED: SWITCHING
III PRECIOUS MATERIAL: GOLD
III PRECIOUS MATERIAL AND LOCATION: TERMINAL SURFACES GOLD
INCLOSURE MATERIAL: METAL
MAXIMUM OPERATING TEMP PER MEASUREMENT POINT: 85.0 DEG CELSIUS AMBIENT AIR
MOUNTING METHOD: PRESS FIT
OVERALL HEIGHT: 0.005 INCHES MINIMUM AND 0.008 INCHES MAXIMUM
OVERALL LENGTH: 0.013 INCHES NOMINAL
OVERALL WIDTH: 0.013 INCHES NOMINAL
POWER RATING PER CHARACTERISTIC: 200.0 MILLIWATTS MAXIMUM COLLECTOR POWER DISSIPATION
SEMICONDUCTOR MATERIAL: SILICON
SPECIAL FEATURES: THE DIODE SHALL BE CAPABLE OF FULFILLING ALL REQUIREMENTS WHEN ATTACHED TO GOLD PLATED ALUMINUM USING A SILVER FILLED CONDUCTIVE EPOXY; JUNCTION PATTERN ARRANGEMENT: PN
TERMINAL TYPE AND QUANTITY: 1 BONDING PAD
VOLTAGE RATING IN VOLTS PER CHARACTERISTIC: 100.0 MINIMUM BREAKDOWN VOLTAGE, DC_